Paul Fischer

Person

Wilmington, DE, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic chip package
- Patent number 6,544,638
- Issue date Apr 8, 2003
- Gore Enterprise Holdings, Inc.
- Paul J. Fischer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dimensionally stable core for use in high density chip packages and...
- Patent number 6,344,371
- Issue date Feb 5, 2002
- W. L. Gore & Associates, Inc.
- Paul J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constraining ring for use in electronic packaging
- Patent number 6,184,589
- Issue date Feb 6, 2001
- John J. Budnaitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic chip package
- Patent number 6,143,401
- Issue date Nov 7, 2000
- W. L. Gore & Associates, Inc.
- Paul J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing warp and die stress in the production of an e...
- Patent number 6,027,590
- Issue date Feb 22, 2000
- W. L. Gore & Associates, Inc.
- Mark F. Sylvester
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling an integrated circuit chip package having an...
- Patent number 6,015,722
- Issue date Jan 18, 2000
- Gore Enterprise Holdings, Inc.
- Donald R. Banks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constraining ring for use in electronic packaging
- Patent number 6,011,697
- Issue date Jan 4, 2000
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming redundant signal traces and corresponding electro...
- Patent number 5,976,974
- Issue date Nov 2, 1999
- W. L. Gore & Associates, Inc.
- Paul J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling an integrated circuit chip package having at...
- Patent number 5,970,319
- Issue date Oct 19, 1999
- Gore Enterprise Holdings, Inc.
- Donald R. Banks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling an integrated circuit chip package having at...
- Patent number 5,919,329
- Issue date Jul 6, 1999
- Gore Enterprise Holdings, Inc.
- Donald R. Banks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constraining ring for use in electronic packaging
- Patent number 5,879,786
- Issue date Mar 9, 1999
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing warp and die stress in the production of an e...
- Patent number 5,868,887
- Issue date Feb 9, 1999
- W. L. Gore & Associates, Inc.
- Mark F. Sylvester
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dimensionally stable core for use in high density chip packages
- Patent number 5,847,327
- Issue date Dec 8, 1998
- W. L. Gore & Associates, Inc.
- Paul J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming raised metallic contacts on electrical circuits f...
- Patent number 5,786,270
- Issue date Jul 28, 1998
- W. L. Gore & Associates, Inc.
- Robin E. Gorrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming raised metallic contacts on electrical circuits
- Patent number 5,747,358
- Issue date May 5, 1998
- W. L. Gore & Associates, Inc.
- Robin E. Gorrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 5,701,032
- Issue date Dec 23, 1997
- W. L. Gore & Associates, Inc.
- Paul James Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 5,525,834
- Issue date Jun 11, 1996
- W. L. Gore & Associates, Inc.
- Paul J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-resistant circuit board
- Patent number 5,473,119
- Issue date Dec 5, 1995
- W. L. Gore & Associates, Inc.
- C. Thomas Rosenmayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intergrated circuit element having a planar, solvent-free dielectri...
- Patent number 5,034,801
- Issue date Jul 23, 1991
- W. L. Gore & Associates, Inc.
- Paul J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance laminates
- Patent number 4,996,097
- Issue date Feb 26, 1991
- W. L. Gore & Associates, Inc.
- Paul Fischer
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic chip package
- Publication number 20020031650
- Publication date Mar 14, 2002
- Paul J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMENSIONALLY STABLE CORE FOR USE IN HIGH DENSITY CHIP PACKAGES AND...
- Publication number 20010029065
- Publication date Oct 11, 2001
- PAUL J. FISCHER
- H01 - BASIC ELECTRIC ELEMENTS

Paul Fischer

Person

Patents Grantslast 30 patents

Electronic chip package

Dimensionally stable core for use in high density chip packages and...

Constraining ring for use in electronic packaging

Electronic chip package

Method for minimizing warp and die stress in the production of an e...

Method for assembling an integrated circuit chip package having an...

Constraining ring for use in electronic packaging

Method of forming redundant signal traces and corresponding electro...

Method for assembling an integrated circuit chip package having at...

Method for assembling an integrated circuit chip package having at...

Constraining ring for use in electronic packaging

Method for minimizing warp and die stress in the production of an e...

Dimensionally stable core for use in high density chip packages

Method of forming raised metallic contacts on electrical circuits f...

Method of forming raised metallic contacts on electrical circuits

Integrated circuit package

Integrated circuit package

Stress-resistant circuit board

Intergrated circuit element having a planar, solvent-free dielectri...

High capacitance laminates

Patents Applicationslast 30 patents

Electronic chip package

DIMENSIONALLY STABLE CORE FOR USE IN HIGH DENSITY CHIP PACKAGES AND...