Philip R. Osborn

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,833,044
- Issue date Nov 10, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,593,643
- Issue date Mar 17, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,062,661
- Issue date Aug 28, 2018
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,691,731
- Issue date Jun 27, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having cavities for receiving microelectro...
- Patent number 9,633,968
- Issue date Apr 25, 2017
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,224,717
- Issue date Dec 29, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having cavities for receiving microelectro...
- Patent number 9,105,612
- Issue date Aug 11, 2015
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,093,435
- Issue date Jul 28, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 8,969,133
- Issue date Mar 3, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,816,514
- Issue date Aug 26, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 8,618,659
- Issue date Dec 31, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having cavities for receiving microelectro...
- Patent number 8,541,873
- Issue date Sep 24, 2013
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,410,618
- Issue date Apr 2, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,008,785
- Issue date Aug 30, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having cavities for receiving microelectri...
- Patent number 7,994,622
- Issue date Aug 9, 2011
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic connection components having bondable wires
- Patent number 7,268,304
- Issue date Sep 11, 2007
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Components, methods and assemblies for multi-chip packages
- Patent number 7,061,122
- Issue date Jun 13, 2006
- Tessera, Inc.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a plurality of semiconductor packages
- Patent number 6,214,640
- Issue date Apr 10, 2001
- Tessera, Inc.
- Jennifer Fosberry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20220375891
- Publication date Nov 24, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package Assembly With Wire Bonds To Encapsulation Surface
- Publication number 20210050322
- Publication date Feb 18, 2021
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20200168579
- Publication date May 28, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20180350766
- Publication date Dec 6, 2018
- Tessera, Inc.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20170287733
- Publication date Oct 5, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20160211237
- Publication date Jul 21, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING CAVITIES FOR RECEIVING MICROELECTRO...
- Publication number 20150340336
- Publication date Nov 26, 2015
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20150091118
- Publication date Apr 2, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20140124565
- Publication date May 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING CAVITIES FOR RECEIVING MICROELECTRO...
- Publication number 20140021641
- Publication date Jan 23, 2014
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20130292834
- Publication date Nov 7, 2013
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20130203216
- Publication date Aug 8, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20120280386
- Publication date Nov 8, 2012
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING CAVITIES FOR RECEIVING MICROELECTRO...
- Publication number 20110291297
- Publication date Dec 1, 2011
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110285020
- Publication date Nov 24, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...
- Publication number 20110147953
- Publication date Jun 23, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE
- Publication number 20110147928
- Publication date Jun 23, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip packages having cavities
- Publication number 20080303132
- Publication date Dec 11, 2008
- Tessera, Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20080185705
- Publication date Aug 7, 2008
- Tessera, Inc.
- Philip R. Osborn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Components, methods and assemblies for multi-chip packages
- Publication number 20070166876
- Publication date Jul 19, 2007
- Tessera, Inc.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical ground method for ball stack package
- Publication number 20070152310
- Publication date Jul 5, 2007
- Tessera, Inc.
- Philip R. Osborn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic connection components having bondable wires
- Publication number 20050243529
- Publication date Nov 3, 2005
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189622
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189635
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Foldover packages and manufacturing and test methods therefor
- Publication number 20050150813
- Publication date Jul 14, 2005
- Tessera, Inc.
- Jesse Burl Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Components, methods and assemblies for multi-chip packages
- Publication number 20040262777
- Publication date Dec 30, 2004
- Tessera, Inc.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Philip R. Osborn

Person

Patents Grantslast 30 patents

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Microelectronic packages having cavities for receiving microelectro...

Package-on-package assembly with wire bonds to encapsulation surface

Microelectronic packages having cavities for receiving microelectro...

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Microelectronic assembly with joined bond elements having lowered i...

Package-on-package assembly with wire bonds to encapsulation surface

Microelectronic packages having cavities for receiving microelectro...

Microelectronic assembly with joined bond elements having lowered i...

Microelectronic assembly with joined bond elements having lowered i...

Microelectronic packages having cavities for receiving microelectri...

Microelectronic connection components having bondable wires

Components, methods and assemblies for multi-chip packages

Method of manufacturing a plurality of semiconductor packages

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

Package-On-Package Assembly With Wire Bonds To Encapsulation Surface

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

MICROELECTRONIC PACKAGES HAVING CAVITIES FOR RECEIVING MICROELECTRO...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

MICROELECTRONIC PACKAGES HAVING CAVITIES FOR RECEIVING MICROELECTRO...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

MICROELECTRONIC PACKAGES HAVING CAVITIES FOR RECEIVING MICROELECTRO...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED I...

MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE

Semiconductor chip packages having cavities

Microelectronic packages and methods therefor

Components, methods and assemblies for multi-chip packages

Electrical ground method for ball stack package

Microelectronic connection components having bondable wires

Packaged acoustic and electromagnetic transducer chips

Packaged acoustic and electromagnetic transducer chips

Foldover packages and manufacturing and test methods therefor

Components, methods and assemblies for multi-chip packages