Rajesh Katkar

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Manifold designs for embedded liquid cooling in a package
- Patent number 12,176,264
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assembly including coolant channel on the backsi...
- Patent number 12,176,263
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level bonding of obstructive elements
- Patent number 12,176,303
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED arrays drivers
- Patent number 12,166,024
- Issue date Dec 10, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded optical devices
- Patent number 12,153,222
- Issue date Nov 26, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structures for making direct metal-to-metal bonds at low temp...
- Patent number 12,136,605
- Issue date Nov 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,132,020
- Issue date Oct 29, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,100,676
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Direct gang bonding methods including directly bonding first elemen...
- Patent number 12,080,672
- Issue date Sep 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical redundancy for bonded structures
- Patent number 12,046,583
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,046,571
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND—high aspect ratio strings and channels
- Patent number 12,035,529
- Issue date Jul 9, 2024
- Adeia Semiconductor Inc.
- Rajesh Katkar
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Fine pitch BVA using reconstituted wafer with area array accessible...
- Patent number 11,990,382
- Issue date May 21, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for bonding elements including conductive interface feat...
- Patent number 11,955,393
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pads over TSV
- Patent number 11,955,445
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 11,955,463
- Issue date Apr 9, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,948,847
- Issue date Apr 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Image sensor device
- Patent number 11,935,907
- Issue date Mar 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked optical waveguides
- Patent number 11,914,148
- Issue date Feb 27, 2024
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- G02 - OPTICS
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for non-volatile random access memory stacks
- Patent number 11,876,076
- Issue date Jan 16, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for releveled bump planes for chiplets
- Patent number 11,862,604
- Issue date Jan 2, 2024
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective elements for bonded structures
- Patent number 11,848,284
- Issue date Dec 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical redundancy for bonded structures
- Patent number 11,842,894
- Issue date Dec 12, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 11,837,582
- Issue date Dec 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Over and under interconnects
- Patent number 11,830,804
- Issue date Nov 28, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIPLET-TO-CHIPLET PROTOCOL SWITCH
- Publication number 20250006642
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250006617
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Xu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY BONDED OPTICAL COMPONENTS
- Publication number 20250004197
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- G02 - OPTICS
Information Patent Application
EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250006632
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Xu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER FOR INTERCONNECTS
- Publication number 20240429094
- Publication date Dec 26, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387324
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387323
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT GANG BONDING METHODS AND STRUCTURES
- Publication number 20240387439
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...
- Publication number 20240347404
- Publication date Oct 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVER AND UNDER INTERCONNECTS
- Publication number 20240347443
- Publication date Oct 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED OPTICAL WAVEGUIDES
- Publication number 20240345399
- Publication date Oct 17, 2024
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- G02 - OPTICS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR DEVICE PACKAGES AND METHODS OF COOLING...
- Publication number 20240332128
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING BACKSIDE POWER/GROUND DELIV...
- Publication number 20240332129
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR BACKSIDE POWER DELIVERY NETWORK
- Publication number 20240332267
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES, INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES
- Publication number 20240312951
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240266377
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE BRIDGING APPARATUS
- Publication number 20240258271
- Publication date Aug 1, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Symbiotic Network On Layers
- Publication number 20240250071
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURES FOR BONDING ELEMENTS INCLUDING CONDUCTIVE INTERFACE FEAT...
- Publication number 20240249985
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT BONDED AND INTERCONNECTED STACK
- Publication number 20240243103
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...
- Publication number 20240203948
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SYSTEMS FOR COOLING HIGH POWERED DEVICES AND METHODS OF...
- Publication number 20240203823
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PADS OVER TSV
- Publication number 20240194625
- Publication date Jun 13, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECTLY BONDED STRUCTURE WITH FRAME STRUCTURE
- Publication number 20240186268
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DELIVERY NETWORK
- Publication number 20240186248
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240178256
- Publication date May 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCRIBE LANE REINFORCEMENT
- Publication number 20240170411
- Publication date May 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Xu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20240162102
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Rajesh Katkar

Person

Patents Grantslast 30 patents

Manifold designs for embedded liquid cooling in a package

Integrated cooling assembly including coolant channel on the backsi...

Wafer-level bonding of obstructive elements

Direct-bonded LED arrays drivers

Bonded optical devices

Layer structures for making direct metal-to-metal bonds at low temp...

Low temperature bonded structures

Low temperature bonded structures

Bonded structures

Direct gang bonding methods including directly bonding first elemen...

Bonded structures with integrated passive component

Electrical redundancy for bonded structures

Low temperature bonded structures

3D NAND—high aspect ratio strings and channels

Multiple plated via arrays of different wire heights on a same subs...

Fine pitch BVA using reconstituted wafer with area array accessible...

Bond enhancement structure in microelectronics for trapping contami...

Structures for bonding elements including conductive interface feat...

Metal pads over TSV

Direct bonded stack structures for increased reliability and improv...

Bonded structures

Image sensor device

Stacked optical waveguides

Multi-metal contact structure

Apparatus for non-volatile random access memory stacks

Systems and methods for releveled bump planes for chiplets

Protective elements for bonded structures

Electrical redundancy for bonded structures

Molded direct bonded and interconnected stack

Over and under interconnects

Patents Applicationslast 30 patents

CHIPLET-TO-CHIPLET PROTOCOL SWITCH

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK

DIRECTLY BONDED OPTICAL COMPONENTS

EMBEDDED CHIPLETS WITH BACKSIDE POWER DELIVERY NETWORK

DIFFUSION BARRIER FOR INTERCONNECTS

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

DIRECT GANG BONDING METHODS AND STRUCTURES

FINE PITCH BVA USING RECONSTITUTED WAFER WITH AREA ARRAY ACCESSIBLE...

OVER AND UNDER INTERCONNECTS

STACKED OPTICAL WAVEGUIDES

EMBEDDED COOLING SYSTEMS FOR DEVICE PACKAGES AND METHODS OF COOLING...

INTEGRATED COOLING ASSEMBLIES INCLUDING BACKSIDE POWER/GROUND DELIV...

INTERPOSER FOR BACKSIDE POWER DELIVERY NETWORK

SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES

IMAGE SENSOR DEVICE

ACTIVE BRIDGING APPARATUS

Symbiotic Network On Layers

STRUCTURES FOR BONDING ELEMENTS INCLUDING CONDUCTIVE INTERFACE FEAT...

MOLDED DIRECT BONDED AND INTERCONNECTED STACK

DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROV...

MULTI-METAL CONTACT STRUCTURE

INTEGRATED SYSTEMS FOR COOLING HIGH POWERED DEVICES AND METHODS OF...

METAL PADS OVER TSV

DIRECTLY BONDED STRUCTURE WITH FRAME STRUCTURE

BACKSIDE POWER DELIVERY NETWORK

IMAGE SENSOR DEVICE

SCRIBE LANE REINFORCEMENT

BONDED STRUCTURES