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Rajesh Katkar

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  • San Jose, CA, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SCRIBE LANE REINFORCEMENT
    • Publication number 20240170411
    • Publication date May 23, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Xu CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES
    • Publication number 20240162102
    • Publication date May 16, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    SYSTEMS AND METHODS FOR RELEVELED BUMP PLANES FOR CHIPLETS
    • Publication number 20240162190
    • Publication date May 16, 2024
    • Adeia Semiconductor Inc.
    • Javier A. DeLaCruz
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS
    • Publication number 20240145438
    • Publication date May 2, 2024
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Javier A. DeLaCruz
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
    • Publication number 20240136333
    • Publication date Apr 25, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES
    • Publication number 20240120245
    • Publication date Apr 11, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    LOW TEMPERATURE BONDED STRUCTURES
    • Publication number 20240113059
    • Publication date Apr 4, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED OPTICAL DEVICES
    • Publication number 20240103274
    • Publication date Mar 28, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
    • Publication number 20240096823
    • Publication date Mar 21, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Javier A. DeLaCruz
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TSV AS PAD
    • Publication number 20240088101
    • Publication date Mar 14, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER-LEVEL BONDING OF OBSTRUCTIVE ELEMENTS
    • Publication number 20240079351
    • Publication date Mar 7, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Javier A. DeLaCruz
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RAPID THERMAL PROCESSING FOR DIRECT BONDING
    • Publication number 20240079376
    • Publication date Mar 7, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Dominik Suwito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT-BONDED OPTOELECTRONIC DEVICES
    • Publication number 20240063199
    • Publication date Feb 22, 2024
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Min Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
    • Publication number 20240038633
    • Publication date Feb 1, 2024
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
    • Publication number 20240006377
    • Publication date Jan 4, 2024
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Liang Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES WITHOUT INTERVENING ADHESIVE
    • Publication number 20230420399
    • Publication date Dec 28, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEAL FOR MICROELECTRONIC ASSEMBLY
    • Publication number 20230420313
    • Publication date Dec 28, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
    • Publication number 20230420419
    • Publication date Dec 28, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIFFUSION BARRIER COLLAR FOR INTERCONNECTS
    • Publication number 20230360968
    • Publication date Nov 9, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES
    • Publication number 20230361072
    • Publication date Nov 9, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Liang Wang
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    DIRECT-BONDED LED ARRAYS AND DRIVERS
    • Publication number 20230317703
    • Publication date Oct 5, 2023
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Min Tao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
    • Publication number 20230317628
    • Publication date Oct 5, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
    • Publication number 20230317591
    • Publication date Oct 5, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES
    • Publication number 20230268300
    • Publication date Aug 24, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW TEMPERATURE BONDED STRUCTURES
    • Publication number 20230268307
    • Publication date Aug 24, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAVITY PACKAGES
    • Publication number 20230260858
    • Publication date Aug 17, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Shaowu Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOLDED DIRECT BONDED AND INTERCONNECTED STACK
    • Publication number 20230253367
    • Publication date Aug 10, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES
    • Publication number 20230245950
    • Publication date Aug 3, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem HABA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    DIRECT BONDING ON PACKAGE SUBSTRATES
    • Publication number 20230215836
    • Publication date Jul 6, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES WITH INTERCONNECT ASSEMBLIES
    • Publication number 20230207474
    • Publication date Jun 29, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS