Rao TUMMALA

Person

Greensboro, GA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded semiconductor packages and methods thereof
- Patent number 12,027,453
- Issue date Jul 2, 2024
- Georgia Tech Research Corporation
- Nobuo Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-compatible inductors with magnetic layers
- Patent number 11,756,985
- Issue date Sep 12, 2023
- Georgia Tech Research Corporation
- Markondeya Raj Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-package-via (TPV) structures on inorganic interposer and me...
- Patent number 10,672,718
- Issue date Jun 2, 2020
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with polymer-filled or polymer-lined optical through-via...
- Patent number 9,417,415
- Issue date Aug 16, 2016
- Georgia Tech Research Corporation
- Rao R. Tummala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-package-via (TPV) structures on inorganic interposer and me...
- Patent number 9,275,934
- Issue date Mar 1, 2016
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of making the same
- Patent number 9,173,282
- Issue date Oct 27, 2015
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin interposer assemblies with through vias
- Patent number 9,167,694
- Issue date Oct 20, 2015
- Georgia Tech Research Corporation
- Venkatesh V. Sundaram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress relieving second level interconnect structures and methods o...
- Patent number 8,970,036
- Issue date Mar 3, 2015
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect assemblies and methods of making and using same
- Patent number 8,633,601
- Issue date Jan 21, 2014
- Georgia Tech Research Corporation
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-last embedded interconnect structures
- Patent number 8,536,695
- Issue date Sep 17, 2013
- Georgia Tech Research Corporation
- Fuhan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded actives and discrete passives in a cavity within build-up...
- Patent number 8,335,084
- Issue date Dec 18, 2012
- Georgia Tech Research Corporation
- Baik-Woo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating three-dimensional high capacitance density structures
- Patent number 8,174,017
- Issue date May 8, 2012
- Georgia Tech Research Corporation
- Markondeya Raj Pulugurtha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing high-density capacitors
- Patent number 8,084,841
- Issue date Dec 27, 2011
- Georgia Tech Research
- MarkondeyaRaj Pulugurtha
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Ferroelectrics and ferromagnetics for noise isolation in integrated...
- Patent number 7,977,758
- Issue date Jul 12, 2011
- Georgia Tech Research Corporation
- Markondeya Raj Pulugurtha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-aspect-ratio metal-polymer composite structures for nano inter...
- Patent number 7,557,448
- Issue date Jul 7, 2009
- Georgia Tech Research Corporation
- Ankur Aggarwal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lead-free bonding systems
- Patent number 7,556,189
- Issue date Jul 7, 2009
- Georgia Tech Research Corporation
- Ankur Aggarwal
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-aspect-ratio metal-polymer composite structures for nano inter...
- Patent number 7,262,075
- Issue date Aug 28, 2007
- Georgia Tech Research Corp.
- Ankur Aggarwal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a multilayer wiring substrate
- Patent number 6,261,941
- Issue date Jul 17, 2001
- Georgia Tech Research Corp.
- Weipang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED SEMICONDUCTOR PACKAGES AND METHODS THEREOF
- Publication number 20240321703
- Publication date Sep 26, 2024
- Georgia Tech Research Corporation
- Novuo Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCH BARRIER DEPOSITION AND DEVICES MADE ACCORDING TO T...
- Publication number 20230215762
- Publication date Jul 6, 2023
- Georgia Tech Research Corporation
- Pratik Nimbalkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR PACKAGES AND METHODS THEREOF
- Publication number 20220230948
- Publication date Jul 21, 2022
- Georgia Tech Research Corporation
- Nobuo OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-COMPATIBLE INDUCTORS WITH MAGNETIC LAYERS
- Publication number 20210036095
- Publication date Feb 4, 2021
- Georgia Tech Research Corporation
- Markondeya Raj PULUGURTHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND ME...
- Publication number 20160141257
- Publication date May 19, 2016
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-LEVEL ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURES FOR...
- Publication number 20160113108
- Publication date Apr 21, 2016
- Georgia Tech Research Corporation
- Venkatesh SUNDARAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL INTERCONNECTS AND METHODS OF FABRICATING SAME
- Publication number 20160109653
- Publication date Apr 21, 2016
- Georgia Tech Research Corporation
- William A. Vis
- G02 - OPTICS
Information Patent Application
NEW STRUCTURE OF MICROELECTRONIC PACKAGES WITH EDGE PROTECTION BY C...
- Publication number 20160111380
- Publication date Apr 21, 2016
- Georgia Tech Research Corporation
- Venkatesh SUNDARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Glass-Polymer Optical Interposer
- Publication number 20140355931
- Publication date Dec 4, 2014
- Georgia Tech Research Corporation
- Rao R. Tummala
- G02 - OPTICS
Information Patent Application
MAGNETIC DEVICE UTILIZING NANOCOMPOSITE FILMS LAYERED WITH ADHESIVES
- Publication number 20140347157
- Publication date Nov 27, 2014
- Georgia Tech Research Corporation
- Markondeya Raj Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Second Level Interconnect Structures and Methods of Making the Same
- Publication number 20130270695
- Publication date Oct 17, 2013
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Package-Via (TPV) Structures On Inorganic Interposer And Me...
- Publication number 20130119555
- Publication date May 16, 2013
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME
- Publication number 20130107485
- Publication date May 2, 2013
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH PACKAGE VIA STRUCTURES IN PANEL-BASED SILICON SUBSTRATES AN...
- Publication number 20120261805
- Publication date Oct 18, 2012
- Georgia Tech Research Corporation
- VENKATESH V. SUNDARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-LAST EMBEDDED INTERCONNECT STRUCTURES AND METHODS OF MAKING TH...
- Publication number 20120228754
- Publication date Sep 13, 2012
- Georgia Tech Research Corporation
- FUHAN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20120104603
- Publication date May 3, 2012
- Georgia Tech Research Corporation
- Nitesh Kumbhat
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ULTRA-THIN INTERPOSER ASSEMBLIES WITH THROUGH VIAS
- Publication number 20120106117
- Publication date May 3, 2012
- Georgia Tech Research Corporation
- Venkatesh V. Sundaram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATING HIGH-DENSITY CAPACITORS
- Publication number 20100284123
- Publication date Nov 11, 2010
- MarkondeyaRaj Pulugurtha
- B82 - NANO-TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING HIGH-DENSITY CAPACITORS
- Publication number 20100283122
- Publication date Nov 11, 2010
- MarkondeyaRaj PULUGURTHA
- B82 - NANO-TECHNOLOGY
Information Patent Application
Ferroelectrics and ferromagnetics for noise isolation in integrated...
- Publication number 20100103639
- Publication date Apr 29, 2010
- Markondeya Raj Pulugurtha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-ASPECT-RATIO METAL-POLYMER COMPOSITE STRUCTURES FOR NANO INTER...
- Publication number 20080136035
- Publication date Jun 12, 2008
- Georgia Tech Research Corporation
- Ankur Aggarwal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrating three-dimensional high capacitance density structures
- Publication number 20070040204
- Publication date Feb 22, 2007
- Markondeya Raj Pulugurtha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded actives and discrete passives in a cavity within build-up...
- Publication number 20070025092
- Publication date Feb 1, 2007
- Baik-Woo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reactively formed integrated capacitors on organic substrates and f...
- Publication number 20060269762
- Publication date Nov 30, 2006
- Markondeya Raj Pulugurtha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Organic based dielectric materials and methods for minaturized RF c...
- Publication number 20060258327
- Publication date Nov 16, 2006
- Baik-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill on substrate process and ultra-fine pitch, low standoff c...
- Publication number 20060211171
- Publication date Sep 21, 2006
- Rao O. Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-free bonding systems
- Publication number 20050274227
- Publication date Dec 15, 2005
- Georgia Tech Research Corporation
- Ankur Aggarwal
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-aspect-ratio metal-polymer composite structures for nano inter...
- Publication number 20050191842
- Publication date Sep 1, 2005
- Georgia Tech Research Corporation
- Ankur Aggarwal
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Rao TUMMALA

Person

Patents Grantslast 30 patents

Embedded semiconductor packages and methods thereof

Substrate-compatible inductors with magnetic layers

Through-package-via (TPV) structures on inorganic interposer and me...

Interposer with polymer-filled or polymer-lined optical through-via...

Through-package-via (TPV) structures on inorganic interposer and me...

Interconnect structures and methods of making the same

Ultra-thin interposer assemblies with through vias

Stress relieving second level interconnect structures and methods o...

Interconnect assemblies and methods of making and using same

Chip-last embedded interconnect structures

Embedded actives and discrete passives in a cavity within build-up...

Integrating three-dimensional high capacitance density structures

Systems and methods for providing high-density capacitors

Ferroelectrics and ferromagnetics for noise isolation in integrated...

High-aspect-ratio metal-polymer composite structures for nano inter...

Lead-free bonding systems

High-aspect-ratio metal-polymer composite structures for nano inter...

Method for manufacturing a multilayer wiring substrate

Patents Applicationslast 30 patents

EMBEDDED SEMICONDUCTOR PACKAGES AND METHODS THEREOF

METHODS FOR ETCH BARRIER DEPOSITION AND DEVICES MADE ACCORDING TO T...

EMBEDDED SEMICONDUCTOR PACKAGES AND METHODS THEREOF

SUBSTRATE-COMPATIBLE INDUCTORS WITH MAGNETIC LAYERS

THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND ME...

PACKAGE-LEVEL ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURES FOR...

OPTICAL INTERCONNECTS AND METHODS OF FABRICATING SAME

NEW STRUCTURE OF MICROELECTRONIC PACKAGES WITH EDGE PROTECTION BY C...

Glass-Polymer Optical Interposer

MAGNETIC DEVICE UTILIZING NANOCOMPOSITE FILMS LAYERED WITH ADHESIVES

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

Second Level Interconnect Structures and Methods of Making the Same

Through-Package-Via (TPV) Structures On Inorganic Interposer And Me...

INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME

THROUGH PACKAGE VIA STRUCTURES IN PANEL-BASED SILICON SUBSTRATES AN...

CHIP-LAST EMBEDDED INTERCONNECT STRUCTURES AND METHODS OF MAKING TH...

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

ULTRA-THIN INTERPOSER ASSEMBLIES WITH THROUGH VIAS

SYSTEMS AND METHODS FOR FABRICATING HIGH-DENSITY CAPACITORS

SYSTEMS AND METHODS FOR PROVIDING HIGH-DENSITY CAPACITORS

Ferroelectrics and ferromagnetics for noise isolation in integrated...

HIGH-ASPECT-RATIO METAL-POLYMER COMPOSITE STRUCTURES FOR NANO INTER...

Integrating three-dimensional high capacitance density structures

Embedded actives and discrete passives in a cavity within build-up...

Reactively formed integrated capacitors on organic substrates and f...

Organic based dielectric materials and methods for minaturized RF c...

Underfill on substrate process and ultra-fine pitch, low standoff c...

Lead-free bonding systems

High-aspect-ratio metal-polymer composite structures for nano inter...