Ravi V. Mahajan

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Localized high density substrate routing
- Patent number 12,107,042
- Issue date Oct 1, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 11,984,396
- Issue date May 14, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 11,515,248
- Issue date Nov 29, 2022
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 10,796,988
- Issue date Oct 6, 2020
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes stacked electronic devices
- Patent number 9,941,246
- Issue date Apr 10, 2018
- Intel Corporation
- Nitin Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages including high density bump-less build...
- Patent number 9,941,245
- Issue date Apr 10, 2018
- Intel Corporation
- Oswald Skeete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic assembly method
- Patent number 9,820,384
- Issue date Nov 14, 2017
- Intel Corporation
- Sasha Oster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Localized high density substrate routing
- Patent number 9,269,701
- Issue date Feb 23, 2016
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 9,136,236
- Issue date Sep 15, 2015
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for assembling an integrated circuit package having a subst...
- Patent number RE44629
- Issue date Dec 10, 2013
- Intel Corporation
- Suresh Ramalingam
- 029 - Metal working
Information Patent Grant
Microelectronic package containing silicon connecting region for hi...
- Patent number 8,441,809
- Issue date May 14, 2013
- Intel Corporation
- Ravi Mahajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package containing silicon patches for high density...
- Patent number 8,064,224
- Issue date Nov 22, 2011
- Intel Corporation
- Ravi Mahajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming electronic package having fluid-conducting channel
- Patent number 7,882,624
- Issue date Feb 8, 2011
- Intel Corporation
- Chuan Hu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic package and method of cooling an interconnect featu...
- Patent number 7,851,905
- Issue date Dec 14, 2010
- Intel Corporation
- Gregory M. Chrysler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electromagnetically-actuated micropump for liquid metal alloy
- Patent number 7,764,499
- Issue date Jul 27, 2010
- Intel Corporation
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Using external radiators with electroosmotic pumps for cooling inte...
- Patent number 7,576,432
- Issue date Aug 18, 2009
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetically-actuated micropump for liquid metal alloy enclo...
- Patent number 7,539,016
- Issue date May 26, 2009
- Intel Corporation
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Computer system having controlled cooling
- Patent number 7,508,671
- Issue date Mar 24, 2009
- Intel Corporation
- Ioan Sauciuc
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic die having a thermoelectric module
- Patent number 7,279,796
- Issue date Oct 9, 2007
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages, assemblies, and systems with fluid cooling
- Patent number 7,126,822
- Issue date Oct 24, 2006
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using external radiators with electroosmotic pumps for cooling inte...
- Patent number 6,992,381
- Issue date Jan 31, 2006
- Intel Corporation
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-channel heat exchangers and spreaders
- Patent number 6,934,154
- Issue date Aug 23, 2005
- Intel Corporation
- Ravi Prasher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated circuit die and an electronic assembly having a three-di...
- Patent number 6,908,845
- Issue date Jun 21, 2005
- Intel Corporation
- Johanna M. Swan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-phase cooling utilizing microchannel heat exchangers and channe...
- Patent number 6,903,929
- Issue date Jun 7, 2005
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with high capacity thermal spreader and methods...
- Patent number 6,706,562
- Issue date Mar 16, 2004
- Intel Corporation
- Ravi V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial underfill for flip-chip electronic packages
- Patent number 6,700,209
- Issue date Mar 2, 2004
- Intel Corporation
- George F. Raiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having a substrate vent hole
- Patent number 6,490,166
- Issue date Dec 3, 2002
- Intel Corporation
- Suresh Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial underfill for flip-chip electronic packages
- Patent number 6,365,441
- Issue date Apr 2, 2002
- Intel Corporation
- George F. Raiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI containment for microprocessor core mounted on a card using sur...
- Patent number 6,239,973
- Issue date May 29, 2001
- Intel Corporation
- Scot W. Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for reducing electromagnetic interference and enclosure
- Patent number 6,191,475
- Issue date Feb 20, 2001
- Intel Corporation
- Harry G. Skinner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20240421073
- Publication date Dec 19, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20230130944
- Publication date Apr 27, 2023
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20230040850
- Publication date Feb 9, 2023
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20200395297
- Publication date Dec 17, 2020
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES
- Publication number 20160260688
- Publication date Sep 8, 2016
- Intel Corporation
- Nitin Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20150340353
- Publication date Nov 26, 2015
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE MICROELECTRONIC ASSEMBLY AND METHOD
- Publication number 20150187681
- Publication date Jul 2, 2015
- Ravi V. Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD
- Publication number 20150163921
- Publication date Jun 11, 2015
- Sasha Oster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20140091474
- Publication date Apr 3, 2014
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE CONTAINING SILICON CONNECTING REGION FOR HI...
- Publication number 20110241208
- Publication date Oct 6, 2011
- Ravi Mahajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING HIGH DENSITY BUMP-LESS BUILD...
- Publication number 20110101491
- Publication date May 5, 2011
- OSWALD SKEETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE CONTAINING SILICON PATCHES FOR HIGH DENSITY...
- Publication number 20090244874
- Publication date Oct 1, 2009
- Ravi Mahajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromagnetically-actuated micropump for liquid metal alloy
- Publication number 20090237884
- Publication date Sep 24, 2009
- Intel Corporation
- loan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ENABLING BARE DIE LIQUID COOLING FOR THE BARE DIE AND HOT SPOTS
- Publication number 20090084931
- Publication date Apr 2, 2009
- Intel Corporation
- Ioan Sauciuc
- B22 - CASTING POWDER METALLURGY
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF COOLING AN INTERCONNECT FEATU...
- Publication number 20090079063
- Publication date Mar 26, 2009
- Gregory M. Chrysler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetically-actuated micropump for liquid metal alloy enclo...
- Publication number 20070164427
- Publication date Jul 19, 2007
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Electronic packages, assemblies, and systems with fluid cooling and...
- Publication number 20060139883
- Publication date Jun 29, 2006
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of providing a heat spreader
- Publication number 20060127672
- Publication date Jun 15, 2006
- Gregory M. Chrysler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Using external radiators with electroosmotic pumps for cooling inte...
- Publication number 20060055030
- Publication date Mar 16, 2006
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Channeled heat sink and chassis with integrated heat rejecter for t...
- Publication number 20050117299
- Publication date Jun 2, 2005
- Ravi Prasher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Channeled heat sink and chassis with integrated heat rejecter for t...
- Publication number 20050117300
- Publication date Jun 2, 2005
- Ravi Prasher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Channeled heat sink and chassis with integrated heat rejecter for t...
- Publication number 20050117301
- Publication date Jun 2, 2005
- Ravi Prasher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Using external radiators with electroosmotic pumps for cooling inte...
- Publication number 20050093138
- Publication date May 5, 2005
- Sarah E. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Computer system having controlled cooling
- Publication number 20050078451
- Publication date Apr 14, 2005
- Ioan Sauciuc
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Microelectronic die having a thermoelectric module
- Publication number 20050029637
- Publication date Feb 10, 2005
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with fluid cooling and associated methods
- Publication number 20040190254
- Publication date Sep 30, 2004
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-phase cooling utilizing microchannel heat exchangers and channe...
- Publication number 20040190251
- Publication date Sep 30, 2004
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-channel heat exchangers and spreaders
- Publication number 20040190252
- Publication date Sep 30, 2004
- Ravi Prasher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Channeled heat sink and chassis with integrated heat rejector for t...
- Publication number 20040190253
- Publication date Sep 30, 2004
- Ravi Prasher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Integrated circuit die and an electronic assembly having a three-di...
- Publication number 20030186486
- Publication date Oct 2, 2003
- Johanna M. Swan
- H01 - BASIC ELECTRIC ELEMENTS

Ravi V. Mahajan

Person

Patents Grantslast 30 patents

Localized high density substrate routing

Localized high density substrate routing

Localized high density substrate routing

Localized high density substrate routing

Electronic assembly that includes stacked electronic devices

Integrated circuit packages including high density bump-less build...

Flexible electronic assembly method

Localized high density substrate routing

Localized high density substrate routing

Process for assembling an integrated circuit package having a subst...

Microelectronic package containing silicon connecting region for hi...

Microelectronic package containing silicon patches for high density...

Method of forming electronic package having fluid-conducting channel

Microelectronic package and method of cooling an interconnect featu...

Electromagnetically-actuated micropump for liquid metal alloy

Using external radiators with electroosmotic pumps for cooling inte...

Electromagnetically-actuated micropump for liquid metal alloy enclo...

Computer system having controlled cooling

Microelectronic die having a thermoelectric module

Electronic packages, assemblies, and systems with fluid cooling

Using external radiators with electroosmotic pumps for cooling inte...

Micro-channel heat exchangers and spreaders

Integrated circuit die and an electronic assembly having a three-di...

Two-phase cooling utilizing microchannel heat exchangers and channe...

Electronic assembly with high capacity thermal spreader and methods...

Partial underfill for flip-chip electronic packages

Integrated circuit package having a substrate vent hole

Partial underfill for flip-chip electronic packages

EMI containment for microprocessor core mounted on a card using sur...

Substrate for reducing electromagnetic interference and enclosure

Patents Applicationslast 30 patents

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

FLEXIBLE MICROELECTRONIC ASSEMBLY AND METHOD

FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

MICROELECTRONIC PACKAGE CONTAINING SILICON CONNECTING REGION FOR HI...

INTEGRATED CIRCUIT PACKAGES INCLUDING HIGH DENSITY BUMP-LESS BUILD...

MICROELECTRONIC PACKAGE CONTAINING SILICON PATCHES FOR HIGH DENSITY...

Electromagnetically-actuated micropump for liquid metal alloy

ENABLING BARE DIE LIQUID COOLING FOR THE BARE DIE AND HOT SPOTS

MICROELECTRONIC PACKAGE AND METHOD OF COOLING AN INTERCONNECT FEATU...

Electromagnetically-actuated micropump for liquid metal alloy enclo...

Electronic packages, assemblies, and systems with fluid cooling and...

Method of providing a heat spreader

Using external radiators with electroosmotic pumps for cooling inte...

Channeled heat sink and chassis with integrated heat rejecter for t...

Channeled heat sink and chassis with integrated heat rejecter for t...

Channeled heat sink and chassis with integrated heat rejecter for t...

Using external radiators with electroosmotic pumps for cooling inte...

Computer system having controlled cooling

Microelectronic die having a thermoelectric module

Electronic assembly with fluid cooling and associated methods

Two-phase cooling utilizing microchannel heat exchangers and channe...

Micro-channel heat exchangers and spreaders

Channeled heat sink and chassis with integrated heat rejector for t...

Integrated circuit die and an electronic assembly having a three-di...