Richard H. Livengood

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for controlling material removal from semicond...
- Patent number 7,232,526
- Issue date Jun 19, 2007
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor-level signal cutting method and structure
- Patent number 7,205,566
- Issue date Apr 17, 2007
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical nano-machining with a scanning probe system for integrated...
- Patent number 7,183,122
- Issue date Feb 27, 2007
- Intel Corporation
- Michael DiBattista
- G01 - MEASURING TESTING
Information Patent Grant
Transistor-level signal cutting method and structure
- Patent number 7,141,439
- Issue date Nov 28, 2006
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiducial transistor in an integrated circuit
- Patent number 6,855,946
- Issue date Feb 15, 2005
- Intel Corporation
- Steve Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized backside chip cooling with integrated smart valves
- Patent number 6,825,557
- Issue date Nov 30, 2004
- Intel Corporation
- Michael DiBattista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling material removal from a semico...
- Patent number 6,780,658
- Issue date Aug 24, 2004
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making and using a beacon fiducial for an...
- Patent number 6,753,541
- Issue date Jun 22, 2004
- Intel Corporation
- Steve Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling material removal from a semico...
- Patent number 6,579,732
- Issue date Jun 17, 2003
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making and using an improved fiducial for...
- Patent number 6,528,895
- Issue date Mar 4, 2003
- Intel Corporation
- Paul Winer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance via capacitor and method for manufacturing same
- Patent number 6,525,922
- Issue date Feb 25, 2003
- Intel Corporation
- Paul Winer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interconnect for power distribution on integrated circuits
- Patent number 6,495,454
- Issue date Dec 17, 2002
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for distributing a clock on the silicon backside of an integ...
- Patent number 6,448,168
- Issue date Sep 10, 2002
- Intel Corporation
- Valluri R. Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making and using an improved fiducial for...
- Patent number 6,373,572
- Issue date Apr 16, 2002
- Intel Corporation
- Paul Winer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling material removal from a semico...
- Patent number 6,355,494
- Issue date Mar 12, 2002
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate interconnect for power distribution on integrated circuits
- Patent number 6,355,950
- Issue date Mar 12, 2002
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal distribution network on backside of substrate
- Patent number 6,316,981
- Issue date Nov 13, 2001
- Intel Corporation
- Valluri R. Rao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus providing a circuit edit structure through the...
- Patent number 6,309,897
- Issue date Oct 30, 2001
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip having an on-chip decoupling capacitor
- Patent number 6,222,246
- Issue date Apr 24, 2001
- Intel Corporation
- Tak M. Mak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for editing an integrated circuit
- Patent number 6,159,753
- Issue date Dec 12, 2000
- Intel Corporation
- Paul Winer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus providing a circuit edit structure through the...
- Patent number 6,153,891
- Issue date Nov 28, 2000
- Intel Corporation
- Richard H. Livengood
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for performing a circuit edit through the back...
- Patent number 6,150,718
- Issue date Nov 21, 2000
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of accessing the circuitry on a semiconductor substrate from...
- Patent number 6,122,174
- Issue date Sep 19, 2000
- Intel Corporation
- Richard H. Livengood
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for distributing a clock on the silicon backsi...
- Patent number 6,037,822
- Issue date Mar 14, 2000
- Intel Corporation
- Valluri R. Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for probing an integrated circuit through the...
- Patent number 6,020,746
- Issue date Feb 1, 2000
- Intel Corporation
- Richard H. Livengood
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming a fiducial for aligning an integrated circuit die
- Patent number 6,001,703
- Issue date Dec 14, 1999
- Intel Corporation
- Paul Winer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus providing a mechanical probe structure in an i...
- Patent number 5,976,980
- Issue date Nov 2, 1999
- Intel Corporation
- Richard H. Livengood
- B24 - GRINDING POLISHING
Information Patent Grant
Method of accessing the circuitry on a semiconductor substrate from...
- Patent number 5,952,247
- Issue date Sep 14, 1999
- Intel Corporation
- Richard H. Livengood
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for endpointing while milling an integrated ci...
- Patent number 5,948,217
- Issue date Sep 7, 1999
- Intel Corporation
- Paul Winer
- B24 - GRINDING POLISHING
Information Patent Grant
Fiducial for aligning an integrated circuit die
- Patent number 5,942,805
- Issue date Aug 24, 1999
- Intel Corporation
- Paul Winer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ALTERING OPERATIONAL CHARACTERISTICS OF A SEMICONDUCTOR DEVICE USIN...
- Publication number 20240105419
- Publication date Mar 28, 2024
- Intel Corporation
- Shida TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND TRANSISTOR CIRCUIT MODIFICATION USING DIRECT CONTAC...
- Publication number 20240006302
- Publication date Jan 4, 2024
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS TO ENABLE INLINE CIRCUIT EDIT
- Publication number 20230369211
- Publication date Nov 16, 2023
- Intel Corporation
- Clifford J. ENGEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE CIRCUIT EDIT FOR BACKSIDE POWER DELIVERY WITH DEEP VIA
- Publication number 20230369221
- Publication date Nov 16, 2023
- Intel Corporation
- Clifford J. ENGEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE CIRCUIT EDIT
- Publication number 20230369207
- Publication date Nov 16, 2023
- Intel Corporation
- Clifford J. ENGEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor-level signal cutting method and structure
- Publication number 20060172440
- Publication date Aug 3, 2006
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor-level signal cutting method and structure
- Publication number 20060170099
- Publication date Aug 3, 2006
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Physical nano-machining with a scanning probe system for integrated...
- Publication number 20050260775
- Publication date Nov 24, 2005
- Michael DiBattista
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for controlling material removal from semicond...
- Publication number 20040241999
- Publication date Dec 2, 2004
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Localized backside chip cooling with integrated smart valves
- Publication number 20040113265
- Publication date Jun 17, 2004
- Intel Corporation
- Michael DiBattista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for controlling material removal from a semico...
- Publication number 20030207578
- Publication date Nov 6, 2003
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for making and using a beacon fiducial for an...
- Publication number 20030183786
- Publication date Oct 2, 2003
- Steve Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance via capacitor and method for manufacturing same
- Publication number 20020085336
- Publication date Jul 4, 2002
- Paul Winer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for controlling material removal from a semico...
- Publication number 20020055272
- Publication date May 9, 2002
- Intel Corporation
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for making and using an improved fiducial for...
- Publication number 20020030805
- Publication date Mar 14, 2002
- Paul Winer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate interconnect for power distribution on integrated circuits
- Publication number 20020020862
- Publication date Feb 21, 2002
- Richard H. Livengood
- H01 - BASIC ELECTRIC ELEMENTS

Richard H. Livengood

Person

Patents Grantslast 30 patents

Method and apparatus for controlling material removal from semicond...

Transistor-level signal cutting method and structure

Physical nano-machining with a scanning probe system for integrated...

Transistor-level signal cutting method and structure

Fiducial transistor in an integrated circuit

Localized backside chip cooling with integrated smart valves

Method and apparatus for controlling material removal from a semico...

Method and apparatus for making and using a beacon fiducial for an...

Method and apparatus for controlling material removal from a semico...

Method and apparatus for making and using an improved fiducial for...

High performance via capacitor and method for manufacturing same

Substrate interconnect for power distribution on integrated circuits

Method for distributing a clock on the silicon backside of an integ...

Method and apparatus for making and using an improved fiducial for...

Method and apparatus for controlling material removal from a semico...

Substrate interconnect for power distribution on integrated circuits

Signal distribution network on backside of substrate

Method and apparatus providing a circuit edit structure through the...

Flip-chip having an on-chip decoupling capacitor

Method and apparatus for editing an integrated circuit

Method and apparatus providing a circuit edit structure through the...

Method and apparatus for performing a circuit edit through the back...

Method of accessing the circuitry on a semiconductor substrate from...

Method and apparatus for distributing a clock on the silicon backsi...

Method and apparatus for probing an integrated circuit through the...

Method of forming a fiducial for aligning an integrated circuit die

Method and apparatus providing a mechanical probe structure in an i...

Method of accessing the circuitry on a semiconductor substrate from...

Method and apparatus for endpointing while milling an integrated ci...

Fiducial for aligning an integrated circuit die

Patents Applicationslast 30 patents

ALTERING OPERATIONAL CHARACTERISTICS OF A SEMICONDUCTOR DEVICE USIN...

GATE-ALL-AROUND TRANSISTOR CIRCUIT MODIFICATION USING DIRECT CONTAC...

DESIGNS TO ENABLE INLINE CIRCUIT EDIT

INLINE CIRCUIT EDIT FOR BACKSIDE POWER DELIVERY WITH DEEP VIA

INLINE CIRCUIT EDIT

Transistor-level signal cutting method and structure

Transistor-level signal cutting method and structure

Physical nano-machining with a scanning probe system for integrated...

Method and apparatus for controlling material removal from semicond...

Localized backside chip cooling with integrated smart valves

Method and apparatus for controlling material removal from a semico...

Method and apparatus for making and using a beacon fiducial for an...

High performance via capacitor and method for manufacturing same

Method and apparatus for controlling material removal from a semico...

Method and apparatus for making and using an improved fiducial for...

Substrate interconnect for power distribution on integrated circuits