Roger St. Amand

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier assisted substrate method of manufacturing an electronic de...
- Patent number 12,051,611
- Issue date Jul 30, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package and method
- Patent number 12,009,343
- Issue date Jun 11, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,876,039
- Issue date Jan 16, 2024
- Amkor Technol Singapore Holding Pte. Ltd.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 11,652,038
- Issue date May 16, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin bonded interposer package
- Patent number 11,621,243
- Issue date Apr 4, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 11,488,892
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,362,027
- Issue date Jun 14, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier assisted substrate method of manufacturing an electronic de...
- Patent number 11,018,040
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,943,858
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin bonded interposer package
- Patent number 10,818,637
- Issue date Oct 27, 2020
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making semiconductor devices
- Patent number 10,714,408
- Issue date Jul 14, 2020
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 10,347,562
- Issue date Jul 9, 2019
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin bonded interposer package
- Patent number 10,242,966
- Issue date Mar 26, 2019
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,192,816
- Issue date Jan 29, 2019
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 9,852,976
- Issue date Dec 26, 2017
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 9,721,872
- Issue date Aug 1, 2017
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin bonded interposer package
- Patent number 9,711,485
- Issue date Jul 18, 2017
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 9,543,242
- Issue date Jan 10, 2017
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package and method
- Patent number 9,496,210
- Issue date Nov 15, 2016
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Column and stacking balls package fabrication method and structure
- Patent number 8,890,337
- Issue date Nov 18, 2014
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked inverted flip chip package and fabrication method
- Patent number 8,836,115
- Issue date Sep 16, 2014
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out build up substrate stackable package and method
- Patent number 8,796,561
- Issue date Aug 5, 2014
- Amkor Technology, Inc.
- Christopher M. Scanlan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip bump structure and fabrication method
- Patent number 8,704,369
- Issue date Apr 22, 2014
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill contacting stacking balls package fabrication method and...
- Patent number 8,633,598
- Issue date Jan 21, 2014
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package in package device for RF transceiver module
- Patent number 8,558,365
- Issue date Oct 15, 2013
- Amkor Technology, Inc.
- Fernando Roa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable package and method
- Patent number 8,482,134
- Issue date Jul 9, 2013
- Amkor Technology, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bump structure and fabrication method
- Patent number 8,390,116
- Issue date Mar 5, 2013
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding for a semiconductor package
- Patent number 8,129,824
- Issue date Mar 6, 2012
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with fast power-up cycle and method of making...
- Patent number 8,084,868
- Issue date Dec 27, 2011
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic component package having film-on-wire spacer
- Patent number 8,072,083
- Issue date Dec 6, 2011
- Amkor Technology, Inc.
- Roger D. St. Amand
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20240387230
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240162131
- Publication date May 16, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230282560
- Publication date Sep 7, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220319969
- Publication date Oct 6, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20220059387
- Publication date Feb 24, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210272887
- Publication date Sep 2, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20210217692
- Publication date Jul 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...
- Publication number 20210166992
- Publication date Jun 3, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN BONDED INTERPOSER PACKAGE
- Publication number 20210111151
- Publication date Apr 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20200402830
- Publication date Dec 24, 2020
- Amkor Technology, Inc.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...
- Publication number 20190371706
- Publication date Dec 5, 2019
- Amkor Technology, Inc.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN BONDED INTERPOSER PACKAGE
- Publication number 20190348395
- Publication date Nov 14, 2019
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20190189552
- Publication date Jun 20, 2019
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20180240744
- Publication date Aug 23, 2018
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20170133310
- Publication date May 11, 2017
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATED UNIT SUBSTRATE FOR A SEMICONDCUTOR DEVICE
- Publication number 20150303170
- Publication date Oct 22, 2015
- Amkor Technology, Inc.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SANDWICH EMBEDDED PACKAGE
- Publication number 20150221570
- Publication date Aug 6, 2015
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked electronic component package having single-sided film spacer
- Publication number 20080237824
- Publication date Oct 2, 2008
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wireless control and/or data acquisition system in an integrated ci...
- Publication number 20030060185
- Publication date Mar 27, 2003
- Richard J. Fisher
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method and apparatus using directional antenna or learning modes fo...
- Publication number 20020092345
- Publication date Jul 18, 2002
- Jan Van Niekerk
- G01 - MEASURING TESTING
Information Patent Application
Radio frequency identification tag tire inflation pressure monitori...
- Publication number 20020092347
- Publication date Jul 18, 2002
- Jan Van Niekerk
- B60 - VEHICLES IN GENERAL

Roger St. Amand

Person

Patents Grantslast 30 patents

Carrier assisted substrate method of manufacturing an electronic de...

Stackable package and method

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor package with front side and back side redistribution...

Thin bonded interposer package

Methods and structures for increasing the allowable die size in TMV...

Semiconductor devices and methods of manufacturing semiconductor de...

Carrier assisted substrate method of manufacturing an electronic de...

Semiconductor package and fabricating method thereof

Thin bonded interposer package

Semiconductor devices and methods of making semiconductor devices

Methods and structures for increasing the allowable die size in TMV...

Thin bonded interposer package

Semiconductor package and fabricating method thereof

Semiconductor package and fabricating method thereof

Methods and structures for increasing the allowable die size in TMV...

Thin bonded interposer package

Semiconductor package and fabricating method thereof

Stackable package and method

Column and stacking balls package fabrication method and structure

Stacked inverted flip chip package and fabrication method

Fan out build up substrate stackable package and method

Flip chip bump structure and fabrication method

Underfill contacting stacking balls package fabrication method and...

Package in package device for RF transceiver module

Stackable package and method

Flip chip bump structure and fabrication method

Shielding for a semiconductor package

Semiconductor package with fast power-up cycle and method of making...

Stacked electronic component package having film-on-wire spacer

Patents Applicationslast 30 patents

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...

THIN BONDED INTERPOSER PACKAGE

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...

THIN BONDED INTERPOSER PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SINGULATED UNIT SUBSTRATE FOR A SEMICONDCUTOR DEVICE

THIN SANDWICH EMBEDDED PACKAGE

Stacked electronic component package having single-sided film spacer

Wireless control and/or data acquisition system in an integrated ci...

Method and apparatus using directional antenna or learning modes fo...

Radio frequency identification tag tire inflation pressure monitori...