Ronald R. Uttecht

Person

Essex Junction, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Insulator for integrated circuits and process
- Patent number 6,559,046
- Issue date May 6, 2003
- International Business Machines Corporation
- Stephan Alan Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-conductor personalization structure and method
- Patent number 6,093,630
- Issue date Jul 25, 2000
- International Business Machines Corporation
- Robert Michael Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fusible links formed on interconnects which are at least twice as l...
- Patent number 6,054,339
- Issue date Apr 25, 2000
- International Business Machines Corporation
- Richard A. Gilmour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Personalization structure for semiconductor devices
- Patent number 5,883,435
- Issue date Mar 16, 1999
- International Business Machines Corporation
- Robert Michael Geffken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated pad and fuse structure for planar copper metallurgy
- Patent number 5,795,819
- Issue date Aug 18, 1998
- International Business Machines Corporation
- William Thomas Motsiff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fusible links with improved interconnect structure
- Patent number 5,760,674
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Richard A. Gilmour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated pad and fuse structure for planar copper metallurgy
- Patent number 5,731,624
- Issue date Mar 24, 1998
- International Business Machines Corporation
- William Thomas Motsiff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array protection devices and method
- Patent number 5,723,898
- Issue date Mar 3, 1998
- International Business Machines Corp.
- Richard Alfred Gilmour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Personalized area leadframe coining or half etching for reduced mec...
- Patent number 5,576,246
- Issue date Nov 19, 1996
- International Business Machines, Corporation
- Harold W. Conru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Personalized area leadframe coining or half etching for reduced mec...
- Patent number 5,545,921
- Issue date Aug 13, 1996
- International Business Machines, Corporation
- Harold W. Conru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-free hydrogen silsesquioxane with dielectric constant less t...
- Patent number 5,530,293
- Issue date Jun 25, 1996
- International Business Machines Corporation
- Stephan A. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array protection devices and fabrication method
- Patent number 5,523,253
- Issue date Jun 4, 1996
- International Business Machines Corp.
- Richard A. Gilmour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array fuse damage protection devices and fabrication method
- Patent number 5,420,455
- Issue date May 30, 1995
- International Business Machines Corp.
- Richard A. Gilmour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarizing ladder-type silsequioxane polymer insulation layer
- Patent number 5,286,572
- Issue date Feb 15, 1994
- International Business Machines Corporation
- Donna J. Clodgo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plural level chip masking
- Patent number 5,126,006
- Issue date Jun 30, 1992
- International Business Machines Corp.
- John E. Cronin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Planarizing ladder-type silsesquioxane polymer insulation layer
- Patent number 4,981,530
- Issue date Jan 1, 1991
- International Business Machines Corporation
- Donna J. Clodgo
- H01 - BASIC ELECTRIC ELEMENTS

Ronald R. Uttecht

Person

Patents Grantslast 30 patents

Insulator for integrated circuits and process

Semi-conductor personalization structure and method

Fusible links formed on interconnects which are at least twice as l...

Personalization structure for semiconductor devices

Integrated pad and fuse structure for planar copper metallurgy

Fusible links with improved interconnect structure

Integrated pad and fuse structure for planar copper metallurgy

Array protection devices and method

Personalized area leadframe coining or half etching for reduced mec...

Personalized area leadframe coining or half etching for reduced mec...

Carbon-free hydrogen silsesquioxane with dielectric constant less t...

Array protection devices and fabrication method

Array fuse damage protection devices and fabrication method

Planarizing ladder-type silsequioxane polymer insulation layer

Plural level chip masking

Planarizing ladder-type silsesquioxane polymer insulation layer