Ryan David Lane

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package comprising integrated devices coupled through a metallizati...
- Patent number 11,784,157
- Issue date Oct 10, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and a high-density interconnect inte...
- Patent number 11,605,594
- Issue date Mar 14, 2023
- QUALCOMM Incorporated
- Ryan Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch substrate configured as a shield located over a cavity of a b...
- Patent number 11,452,246
- Issue date Sep 20, 2022
- QUALCOMM Incorporated
- Charles David Paynter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit (IC) module comprising an integrated circuit (IC...
- Patent number 10,321,575
- Issue date Jun 11, 2019
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered power structure in a power distribution network (PDN)
- Patent number 10,231,324
- Issue date Mar 12, 2019
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Toroid inductor with reduced electromagnetic field leakage
- Patent number 10,170,232
- Issue date Jan 1, 2019
- QUALCOMM Incorporated
- Yue Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded layered inductor
- Patent number 10,051,741
- Issue date Aug 14, 2018
- QUALCOMM Incorporated
- Young Kyu Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor embedded in a package substrate
- Patent number 10,008,316
- Issue date Jun 26, 2018
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL)...
- Patent number 9,577,025
- Issue date Feb 21, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for shielding differential signal pin pairs
- Patent number 9,514,966
- Issue date Dec 6, 2016
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for thermal dissipation
- Patent number 9,484,281
- Issue date Nov 1, 2016
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package substrate capacitor with configurable/controllable...
- Patent number 9,449,762
- Issue date Sep 20, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System, apparatus, and method for split die interconnection
- Patent number 9,379,090
- Issue date Jun 28, 2016
- QUALCOMM Incorporated
- Ahmer Raza Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality factor filter implemented in wafer level packaging (WL...
- Patent number 9,373,583
- Issue date Jun 21, 2016
- QUALCOMM Incorporated
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package (PoP) integrated device comprising a capacitor i...
- Patent number 9,368,566
- Issue date Jun 14, 2016
- QUALCOMM Incorporated
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) on substrate
- Patent number 9,362,218
- Issue date Jun 7, 2016
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Toroid inductor in an integrated device
- Patent number 9,324,779
- Issue date Apr 26, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor
- Patent number 9,263,186
- Issue date Feb 16, 2016
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor design on floating UBM balls for wafer level package (WLP)
- Patent number 9,245,940
- Issue date Jan 26, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Toroid inductor in redistribution layers (RDL) of an integrated device
- Patent number 9,209,131
- Issue date Dec 8, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package (PoP) integrated device comprising a redistribut...
- Patent number 9,153,560
- Issue date Oct 6, 2015
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency package on package circuit
- Patent number 9,131,634
- Issue date Sep 8, 2015
- QUALCOMM Incorporated
- Aristotele Hadjichristos
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High quality factor inductor implemented in wafer level packaging (...
- Patent number 9,035,421
- Issue date May 19, 2015
- QUALCOMM Incorporated
- Young K. Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to optimize and reduce integrated circuit, package design, a...
- Patent number 8,890,143
- Issue date Nov 18, 2014
- QUALCOMM Incorporated
- Ryan D. Lane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid package construction with wire bond and through silicon vias
- Patent number 8,803,305
- Issue date Aug 12, 2014
- QUALCOMM Incorporated
- Ratibor Radojcic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized power delivery to high speed, high pin-count devices
- Patent number 7,612,449
- Issue date Nov 3, 2009
- QUALCOMM Incorporated
- Justin Joseph Rosen Gagne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for accommodating small minimum die in wire bonded area arra...
- Patent number 6,891,275
- Issue date May 10, 2005
- QUALCOMM Incorporated
- Ryan Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area array package with non-electrically connected solder balls
- Patent number 6,762,495
- Issue date Jul 13, 2004
- QUALCOMM Incorporated
- Edward Reyes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES
- Publication number 20240421128
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...
- Publication number 20240371736
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...
- Publication number 20240107665
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
- Publication number 20240072032
- Publication date Feb 29, 2024
- QUALCOMM Incorporated
- Yanmei SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORT...
- Publication number 20240071993
- Publication date Feb 29, 2024
- QUALCOMM Incorporated
- Yanmei SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED STACKED TRENCH CAPACIT...
- Publication number 20240038831
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Ryan LANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...
- Publication number 20220392867
- Publication date Dec 8, 2022
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CAVITY FOR ENHANCED DEVICE PERFORMANCE WITH AN INTEGRATED P...
- Publication number 20210375845
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- William Michael STONE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATCH SUBSTRATE CONFIGURED AS A SHIELD LOCATED OVER A CAVITY OF A...
- Publication number 20210307218
- Publication date Sep 30, 2021
- QUALCOMM Incorporated
- Charles David PAYNTER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTE...
- Publication number 20210296246
- Publication date Sep 23, 2021
- QUALCOMM Incorporated
- Ryan LANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THERMAL ENHANCEMENT STRUCTURES FOR MOLDED INTEGRATED CIRCU...
- Publication number 20190139852
- Publication date May 9, 2019
- QUALCOMM Incorporated
- Youmin YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOROID INDUCTOR WITH REDUCED ELECTROMAGNETIC FIELD LEAKAGE
- Publication number 20170125152
- Publication date May 4, 2017
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) MODULE COMPRISING AN INTEGRATED CIRCUIT (IC...
- Publication number 20170064837
- Publication date Mar 2, 2017
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR THERMAL DISSIPATION
- Publication number 20160049349
- Publication date Feb 18, 2016
- QUALCOMM Incorporated
- Ryan David LANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR I...
- Publication number 20160020193
- Publication date Jan 21, 2016
- QUALCOMM Incorporated
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOM ORIENTATION OF SOCKET PINS TO ACHIEVE HIGH ISOLATION BETWEEN...
- Publication number 20150372425
- Publication date Dec 24, 2015
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE SUBSTRATE CAPACITOR WITH CONFIGURABLE/CONTROLLABLE...
- Publication number 20150325375
- Publication date Nov 12, 2015
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGGERED POWER STRUCTURE IN A POWER DISTRIBUTION NETWORK (PDN)
- Publication number 20150313006
- Publication date Oct 29, 2015
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR SHIELDING DIFFERENTIAL SIGNAL PIN PAIRS
- Publication number 20150294945
- Publication date Oct 15, 2015
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR EMBEDDED IN A PACKAGE SUBTRATE
- Publication number 20150279545
- Publication date Oct 1, 2015
- QUALCOMM Incorporated
- Siamak Fazelpour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR DESIGN ON FLOATING UBM BALLS FOR WAFER LEVEL PACKAGE (WLP)
- Publication number 20150228707
- Publication date Aug 13, 2015
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR IN REDISTRIBUTION LAYER (RDL)...
- Publication number 20150221714
- Publication date Aug 6, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOROID INDUCTOR IN REDISTRIBUTION LAYERS (RDL) OF AN INTEGRATED DEVICE
- Publication number 20150206837
- Publication date Jul 23, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A REDISTRIBUT...
- Publication number 20150206854
- Publication date Jul 23, 2015
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LAYERED INDUCTOR
- Publication number 20150124418
- Publication date May 7, 2015
- QUALCOMM Incorporated
- Young Kyu Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOROID INDUCTOR IN AN INTEGRATED DEVICE
- Publication number 20150115403
- Publication date Apr 30, 2015
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR PLACEMENT FOR A SUBSTRATE INTEGRATED WITH A TOROIDAL INDU...
- Publication number 20150092314
- Publication date Apr 2, 2015
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE (IPD) ON SUBTRATE
- Publication number 20150048480
- Publication date Feb 19, 2015
- QUALCOMM Incorporated
- Daeik Daniel Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH QUALITY FACTOR FILTER IMPLEMENTED IN WAFER LEVEL PACKAGING (WL...
- Publication number 20140319652
- Publication date Oct 30, 2014
- Jong-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC/ AC DUAL FUNCTION POWER DELIVERY NETWORK (PDN) DECOUPLING CAPACITOR
- Publication number 20140252544
- Publication date Sep 11, 2014
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS

Ryan David Lane

Person

Patents Grantslast 30 patents

Providing a lower inductance path in a routing substrate for a capa...

Package comprising integrated devices coupled through a metallizati...

Package comprising a substrate and a high-density interconnect inte...

Patch substrate configured as a shield located over a cavity of a b...

Integrated circuit (IC) module comprising an integrated circuit (IC...

Staggered power structure in a power distribution network (PDN)

Toroid inductor with reduced electromagnetic field leakage

Embedded layered inductor

Inductor embedded in a package substrate

Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL)...

Apparatus and methods for shielding differential signal pin pairs

Systems and methods for thermal dissipation

Embedded package substrate capacitor with configurable/controllable...

System, apparatus, and method for split die interconnection

High quality factor filter implemented in wafer level packaging (WL...

Package on package (PoP) integrated device comprising a capacitor i...

Integrated passive device (IPD) on substrate

Toroid inductor in an integrated device

DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor

Inductor design on floating UBM balls for wafer level package (WLP)

Toroid inductor in redistribution layers (RDL) of an integrated device

Package on package (PoP) integrated device comprising a redistribut...

Radio frequency package on package circuit

High quality factor inductor implemented in wafer level packaging (...

Method to optimize and reduce integrated circuit, package design, a...

Hybrid package construction with wire bond and through silicon vias

Optimized power delivery to high speed, high pin-count devices

Method for accommodating small minimum die in wire bonded area arra...

Area array package with non-electrically connected solder balls

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES

SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...

PROVIDING A LOWER INDUCTANCE PATH IN A ROUTING SUBSTRATE FOR A CAPA...

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORT...

PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED STACKED TRENCH CAPACIT...

PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...

PACKAGE CAVITY FOR ENHANCED DEVICE PERFORMANCE WITH AN INTEGRATED P...

PATCH SUBSTRATE CONFIGURED AS A SHIELD LOCATED OVER A CAVITY OF A...

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTE...

EMBEDDED THERMAL ENHANCEMENT STRUCTURES FOR MOLDED INTEGRATED CIRCU...

TOROID INDUCTOR WITH REDUCED ELECTROMAGNETIC FIELD LEAKAGE

INTEGRATED CIRCUIT (IC) MODULE COMPRISING AN INTEGRATED CIRCUIT (IC...

SYSTEMS AND METHODS FOR THERMAL DISSIPATION

PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR I...

CUSTOM ORIENTATION OF SOCKET PINS TO ACHIEVE HIGH ISOLATION BETWEEN...

EMBEDDED PACKAGE SUBSTRATE CAPACITOR WITH CONFIGURABLE/CONTROLLABLE...

STAGGERED POWER STRUCTURE IN A POWER DISTRIBUTION NETWORK (PDN)

APPARATUS AND METHODS FOR SHIELDING DIFFERENTIAL SIGNAL PIN PAIRS

INDUCTOR EMBEDDED IN A PACKAGE SUBTRATE

INDUCTOR DESIGN ON FLOATING UBM BALLS FOR WAFER LEVEL PACKAGE (WLP)

METAL-INSULATOR-METAL (MIM) CAPACITOR IN REDISTRIBUTION LAYER (RDL)...

TOROID INDUCTOR IN REDISTRIBUTION LAYERS (RDL) OF AN INTEGRATED DEVICE

PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A REDISTRIBUT...

EMBEDDED LAYERED INDUCTOR

TOROID INDUCTOR IN AN INTEGRATED DEVICE

CONNECTOR PLACEMENT FOR A SUBSTRATE INTEGRATED WITH A TOROIDAL INDU...

INTEGRATED PASSIVE DEVICE (IPD) ON SUBTRATE

HIGH QUALITY FACTOR FILTER IMPLEMENTED IN WAFER LEVEL PACKAGING (WL...

DC/ AC DUAL FUNCTION POWER DELIVERY NETWORK (PDN) DECOUPLING CAPACITOR