Sanjeev Balwant Sathe

Person

Binghamton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of inspecting articles using imaging inspection apparatus wi...
- Patent number 7,510,324
- Issue date Mar 31, 2009
- Endicott Interconnect Technologies, Inc.
- Ashwinkumar C. Bhatt
- G01 - MEASURING TESTING
Information Patent Grant
Method of making wirebond electronic package with enhanced chip pad...
- Patent number 7,510,912
- Issue date Mar 31, 2009
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an imaging inspection apparatus with improved cooling
- Patent number 7,490,984
- Issue date Feb 17, 2009
- Endicott Interconnect Technologies, Inc.
- Ashwinkumar C. Bhatt
- G01 - MEASURING TESTING
Information Patent Grant
Imaging inspection apparatus with improved cooling
- Patent number 7,354,197
- Issue date Apr 8, 2008
- Endicott Interconnect Technologies, Inc.
- Ashwinkumar C. Bhatt
- G01 - MEASURING TESTING
Information Patent Grant
Wafer scale thin film package
- Patent number 7,348,261
- Issue date Mar 25, 2008
- International Business Machines Corporation
- David Vincent Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging inspection apparatus with directional cooling
- Patent number 7,261,466
- Issue date Aug 28, 2007
- Endicott Interconnect Technologies, Inc.
- Ashwinkumar C. Bhatt
- G01 - MEASURING TESTING
Information Patent Grant
Wirebond electronic package with enhanced chip pad design, method o...
- Patent number 7,253,518
- Issue date Aug 7, 2007
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced lid for multichip modules
- Patent number 7,186,590
- Issue date Mar 6, 2007
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with thermally-enhanced lid
- Patent number 7,183,642
- Issue date Feb 27, 2007
- International Business Machines Corporation
- Anandaroop Bhattacharya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar surface for semiconductor chips
- Patent number 7,037,753
- Issue date May 2, 2006
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and packaging structure for optimizing warpage of flip chip...
- Patent number 7,026,706
- Issue date Apr 11, 2006
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having a thermal stretching layer
- Patent number 6,992,379
- Issue date Jan 31, 2006
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
- Patent number 6,989,607
- Issue date Jan 24, 2006
- International Business Machines Corporation
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with semiconductor chips mounted thereon
- Patent number 6,967,389
- Issue date Nov 22, 2005
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate substrate containing fiber optic cables
- Patent number 6,788,859
- Issue date Sep 7, 2004
- International Business Machines Corporation
- Voya R. Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip module and method of manufacture of same
- Patent number 6,759,270
- Issue date Jul 6, 2004
- International Buisness Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip module and method of manufacture of same
- Patent number 6,756,662
- Issue date Jun 29, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and packaging structure for optimizing warpage of flip chip...
- Patent number 6,747,331
- Issue date Jun 8, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar surface for semiconductor chips
- Patent number 6,731,012
- Issue date May 4, 2004
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced lid for multichip modules
- Patent number 6,665,187
- Issue date Dec 16, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
- Patent number 6,639,302
- Issue date Oct 28, 2003
- International Business Machines Corporation
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with thermally conductive standoff
- Patent number 6,631,078
- Issue date Oct 7, 2003
- International Business Machines Corporation
- David J. Alcoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer scale thin film package
- Patent number 6,627,998
- Issue date Sep 30, 2003
- International Business Machines Corporation
- David Vincent Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink structure with pyramidic and base-plate cut-outs
- Patent number 6,622,786
- Issue date Sep 23, 2003
- International Business Machines Corporation
- Varaprasad V. Calmidi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Solder interconnect techniques
- Patent number 6,347,901
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Seungbae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal deformation management for chip carriers
- Patent number 6,291,776
- Issue date Sep 18, 2001
- International Business Machines Corporation
- Voya R. Markovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electronic package with compressible heatsink stru...
- Patent number 6,255,136
- Issue date Jul 3, 2001
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Free standing, three dimensional, multi-chip, carrier package with...
- Patent number 6,256,203
- Issue date Jul 3, 2001
- International Business Machines Corporation
- Anthony P. Ingraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with compressible heatsink structure
- Patent number 6,245,186
- Issue date Jun 12, 2001
- International Business Machines Corporation
- David James Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for using pulsating flow to improve thermal transport in sys...
- Patent number 6,219,234
- Issue date Apr 17, 2001
- International Business Corporation
- Bahgat G. Sammakia
- F26 - DRYING

Patents Applicationslast 30 patents

Information Patent Application
Method of inspecting articles using imaging inspection apparatus wi...
- Publication number 20080170670
- Publication date Jul 17, 2008
- Endicott Interconnect Technologies , Inc.
- Ashwinkumar C. Bhatt
- G01 - MEASURING TESTING
Information Patent Application
Method of making an imaging inspection apparatus with improved cooling
- Publication number 20080144768
- Publication date Jun 19, 2008
- Endicott Interconnect Technologies, Inc.
- Ashwinkumar C. Bhatt
- G01 - MEASURING TESTING
Information Patent Application
WAFER SCALE THIN FILM PACKAGE
- Publication number 20080119029
- Publication date May 22, 2008
- David Vincent Caletka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder Interconnect Joints For A Semiconductor Package
- Publication number 20080029888
- Publication date Feb 7, 2008
- International Business Machines Corporation
- Seungbae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making wirebond electronic package with enhanced chip pad...
- Publication number 20070254408
- Publication date Nov 1, 2007
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Imaging inspection apparatus with directional cooling
- Publication number 20070009084
- Publication date Jan 11, 2007
- Endicott Interconnect Technologies, Inc.
- Ashwinkumar C. Bhatt
- G01 - MEASURING TESTING
Information Patent Application
Wirebond electronic package with enhanced chip pad design, method o...
- Publication number 20060284304
- Publication date Dec 21, 2006
- Endicott Interconnect Technologies, Inc.
- David V. Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Imaging inspection apparatus with improved cooling
- Publication number 20060274891
- Publication date Dec 7, 2006
- Endicott Interconnect Technologies, Inc.
- Ashwinkumar C. Bhatt
- G01 - MEASURING TESTING
Information Patent Application
Method and packaging structure for optimizing warpage of flip chip...
- Publication number 20040155339
- Publication date Aug 12, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-planar surface for semiconductor chips
- Publication number 20040142508
- Publication date Jul 22, 2004
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer with semiconductor chips mounted thereon
- Publication number 20040135245
- Publication date Jul 15, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip module and method of manufacture of same
- Publication number 20040058474
- Publication date Mar 25, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP MODULE AND METHOD OF MANUFACTURE OF SAME
- Publication number 20040056347
- Publication date Mar 25, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally enhanced lid for multichip modules
- Publication number 20040057214
- Publication date Mar 25, 2004
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package with thermally-enhanced lid
- Publication number 20040046249
- Publication date Mar 11, 2004
- International Business Machines Corporation
- Anandaroop Bhattacharya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
- Publication number 20040021205
- Publication date Feb 5, 2004
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and packaging structure for optimizing warpage of flip chip...
- Publication number 20040012086
- Publication date Jan 22, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer scale thin film package
- Publication number 20030199121
- Publication date Oct 23, 2003
- David Vincent Caletka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STRESS REDUCTION IN FLIP-CHIP PBGA PACKAGING BY UTILIZING SEGMENTED...
- Publication number 20030178649
- Publication date Sep 25, 2003
- International Business Machines Corporation
- Krishna Darbha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH THERMALLY CONDUCTIVE STANDOFF
- Publication number 20030129863
- Publication date Jul 10, 2003
- International Business Machines Corporation
- David J. Alcoe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic package having a thermal stretching layer
- Publication number 20030047807
- Publication date Mar 13, 2003
- International Business Machines Corporation
- David J. Alcoe
- H01 - BASIC ELECTRIC ELEMENTS

Sanjeev Balwant Sathe

Person

Patents Grantslast 30 patents

Method of inspecting articles using imaging inspection apparatus wi...

Method of making wirebond electronic package with enhanced chip pad...

Method of making an imaging inspection apparatus with improved cooling

Imaging inspection apparatus with improved cooling

Wafer scale thin film package

Imaging inspection apparatus with directional cooling

Wirebond electronic package with enhanced chip pad design, method o...

Thermally enhanced lid for multichip modules

Electronic package with thermally-enhanced lid

Non-planar surface for semiconductor chips

Method and packaging structure for optimizing warpage of flip chip...

Electronic package having a thermal stretching layer

Stress reduction in flip-chip PBGA packaging by utilizing segmented...

Wafer with semiconductor chips mounted thereon

Laminate substrate containing fiber optic cables

Semiconductor chip module and method of manufacture of same

Semiconductor chip module and method of manufacture of same

Method and packaging structure for optimizing warpage of flip chip...

Non-planar surface for semiconductor chips

Thermally enhanced lid for multichip modules

Stress reduction in flip-chip PBGA packaging by utilizing segmented...

Electronic package with thermally conductive standoff

Wafer scale thin film package

Heat sink structure with pyramidic and base-plate cut-outs

Solder interconnect techniques

Thermal deformation management for chip carriers

Method of making electronic package with compressible heatsink stru...

Free standing, three dimensional, multi-chip, carrier package with...

Electronic package with compressible heatsink structure

Method for using pulsating flow to improve thermal transport in sys...

Patents Applicationslast 30 patents

Method of inspecting articles using imaging inspection apparatus wi...

Method of making an imaging inspection apparatus with improved cooling

WAFER SCALE THIN FILM PACKAGE

Solder Interconnect Joints For A Semiconductor Package

Method of making wirebond electronic package with enhanced chip pad...

Imaging inspection apparatus with directional cooling

Wirebond electronic package with enhanced chip pad design, method o...

Imaging inspection apparatus with improved cooling

Method and packaging structure for optimizing warpage of flip chip...

Non-planar surface for semiconductor chips

Wafer with semiconductor chips mounted thereon

Semiconductor chip module and method of manufacture of same

SEMICONDUCTOR CHIP MODULE AND METHOD OF MANUFACTURE OF SAME

Thermally enhanced lid for multichip modules

Electronic package with thermally-enhanced lid

Stress reduction in flip-chip PBGA packaging by utilizing segmented...

Method and packaging structure for optimizing warpage of flip chip...

Wafer scale thin film package

STRESS REDUCTION IN FLIP-CHIP PBGA PACKAGING BY UTILIZING SEGMENTED...

ELECTRONIC PACKAGE WITH THERMALLY CONDUCTIVE STANDOFF

Electronic package having a thermal stretching layer