Seng Kim Ye

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for reducing the size of a semiconductor assembly
- Patent number 11,942,460
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit wire bonded to a multi-layer substrate having an...
- Patent number 11,929,351
- Issue date Mar 12, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor packages, including hybrid substrates...
- Patent number 11,894,289
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount device bonded to an inner layer of a multi-layer subs...
- Patent number 11,723,150
- Issue date Aug 8, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with systems and methods for managing high...
- Patent number 11,710,722
- Issue date Jul 25, 2023
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices with multiple substrates and die stacks
- Patent number 11,562,987
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for semiconductor packages, including hybrid substrates...
- Patent number 11,527,459
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit wire bonded to a multi-layer substrate having an...
- Patent number 11,282,811
- Issue date Mar 22, 2022
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 11,239,128
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,101,244
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,101,262
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device packages, stacked microelectronic device pac...
- Patent number 10,861,824
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating microelectronic devices including a controller
- Patent number 10,811,387
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 10,727,206
- Issue date Jul 28, 2020
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 10,658,336
- Issue date May 19, 2020
- Micron Technology Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 10,504,881
- Issue date Dec 10, 2019
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,431,513
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a controller and methods of forming...
- Patent number 10,304,808
- Issue date May 28, 2019
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device packages, stacked microelectronic device pac...
- Patent number 10,153,254
- Issue date Dec 11, 2018
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 10,128,217
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of manufacturing a semiconductor device package including a...
- Patent number 10,014,281
- Issue date Jul 3, 2018
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 9,985,000
- Issue date May 29, 2018
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages including a controller element
- Patent number 9,761,562
- Issue date Sep 12, 2017
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices
- Patent number 9,640,458
- Issue date May 2, 2017
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 9,627,367
- Issue date Apr 18, 2017
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic device packages, stacked microelectronic device pac...
- Patent number 9,583,476
- Issue date Feb 28, 2017
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 9,418,974
- Issue date Aug 16, 2016
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED COMPOUND PATTERNS ON PACKAGE BALL SIDE TO MITIGATE COPLANARI...
- Publication number 20240332216
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...
- Publication number 20240312890
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICE PACKAGES AND ELE...
- Publication number 20240304598
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH DOWNSET
- Publication number 20240282751
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION
- Publication number 20240268132
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVI...
- Publication number 20240260281
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Wen Wei LUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND R...
- Publication number 20240234390
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC PACKAGES INCLUDING INTERPOSER STRUCTURES AN...
- Publication number 20240234403
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Seng Kim Dalson Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY
- Publication number 20240203963
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE
- Publication number 20240203842
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Seng Kim YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES
- Publication number 20240194547
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- Ling PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
- Publication number 20240194630
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE
- Publication number 20240162207
- Publication date May 16, 2024
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE
- Publication number 20240162206
- Publication date May 16, 2024
- Micron Technology, Inc.
- Seng Kim YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...
- Publication number 20240128163
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN
- Publication number 20240128182
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION
- Publication number 20240071886
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND M...
- Publication number 20240072024
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...
- Publication number 20240071980
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20240071869
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE
- Publication number 20240071880
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT
- Publication number 20240074048
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...
- Publication number 20240072022
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM FOR BONDING A FLIP CHIP DIE TO A SUBSTRATE
- Publication number 20240063201
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERPOSER FOR SEMICONDUCTOR DIES
- Publication number 20240063135
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Hong Wan NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING FOR STACKED MEMORY DIES
- Publication number 20240063168
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MAKING THE SAME
- Publication number 20240047423
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS

Seng Kim Ye

Person

Patents Grantslast 30 patents

Systems and methods for reducing the size of a semiconductor assembly

Integrated circuit wire bonded to a multi-layer substrate having an...

Substrates for semiconductor packages, including hybrid substrates...

Stacked semiconductor die assemblies with support members and assoc...

Stacked semiconductor die assemblies with die support members and a...

Surface mount device bonded to an inner layer of a multi-layer subs...

Semiconductor assemblies with systems and methods for managing high...

Memory devices with controllers under memory packages and associate...

Semiconductor devices with multiple substrates and die stacks

Substrates for semiconductor packages, including hybrid substrates...

Integrated circuit wire bonded to a multi-layer substrate having an...

Microelectronic devices, stacked microelectronic devices, and metho...

Stacked semiconductor die assemblies with die support members and a...

Stacked semiconductor die assemblies with support members and assoc...

Microelectronic device packages, stacked microelectronic device pac...

Methods of operating microelectronic devices including a controller

Memory devices with controllers under memory packages and associate...

Stacked semiconductor die assemblies with die support members and a...

Stacked semiconductor die assemblies with support members and assoc...

Microelectronic devices, stacked microelectronic devices, and metho...

Semiconductor devices including a controller and methods of forming...

Microelectronic device packages, stacked microelectronic device pac...

Memory devices with controllers under memory packages and associate...

Methods of manufacturing a semiconductor device package including a...

Stacked semiconductor die assemblies with die support members and a...

Semiconductor device packages including a controller element

Stacked microelectronic devices

Memory devices with controllers under memory packages and associate...

Microelectronic device packages, stacked microelectronic device pac...

Stacked semiconductor die assemblies with support members and assoc...

Patents Applicationslast 30 patents

MOLDED COMPOUND PATTERNS ON PACKAGE BALL SIDE TO MITIGATE COPLANARI...

SEMICONDUCTOR DEVICE ASSEMBLIES WITH CROSS-STACK STRUCTURES, AND AS...

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICE PACKAGES AND ELE...

SUBSTRATES WITH DOWNSET

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

LEGGED SUPPORT STRUCTURE TO MITIGATE STACKED DIE OVERHANG DEFLECTION

MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVI...

STACKED MICROELECTRONIC PACKAGE WITH STACK MOUNTED COMPONENTS AND R...

STACKED MICROELECTRONIC PACKAGES INCLUDING INTERPOSER STRUCTURES AN...

SYSTEMS AND METHODS FOR REDUCING THE SIZE OF A SEMICONDUCTOR ASSEMBLY

SEMICONDUCTOR DEVICE ASSEMBLY WITH A CIRCULAR SEGMENTED PACKAGE EDGE

SUBSTRATES FOR SEMICONDUCTOR PACKAGES

BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE

PASSIVE ELECTRONIC COMPONENTS ON A SEMICONDUCTOR DIE

LOAD SWITCH MOUNTING FOR A SEMICONDUCTOR PACKAGE

SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN

MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION

MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND M...

WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...

SPLIT VIA STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGING

PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT

STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...

NON-CONDUCTIVE FILM FOR BONDING A FLIP CHIP DIE TO A SUBSTRATE

FLEXIBLE INTERPOSER FOR SEMICONDUCTOR DIES

WIRE BONDING FOR STACKED MEMORY DIES

NESTED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MAKING THE SAME