SeungHyun Lee

Person

Incheon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated antenna-in-package structure
- Patent number 12,211,773
- Issue date Jan 28, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-in-package devices and methods of making
- Patent number 12,136,759
- Issue date Nov 5, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...
- Publication number 20250038059
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20250038058
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...
- Publication number 20250031317
- Publication date Jan 23, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Antenna-in-Package Devices and Methods of Making
- Publication number 20250023227
- Publication date Jan 16, 2025
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240421015
- Publication date Dec 19, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION
- Publication number 20240404911
- Publication date Dec 5, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Multi-Tier System-in-Pa...
- Publication number 20240371759
- Publication date Nov 7, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PARTIAL SHIELDING LAYER AND A METHOD FO...
- Publication number 20240355643
- Publication date Oct 24, 2024
- JCET STATS ChipPAC Korea Limited
- Bom LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRIP AND METHOD FOR FORMING A SEMICONDUCTOR...
- Publication number 20240347509
- Publication date Oct 17, 2024
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER ASSEMBLY FOR CARRYING SEMICONDUCTOR PACKAGE STRIPS WITH IMP...
- Publication number 20240332050
- Publication date Oct 3, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND METHOD FOR...
- Publication number 20240332114
- Publication date Oct 3, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20240321664
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- YeJin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3-D Stacked Semiconduc...
- Publication number 20240321783
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Compartment Shielding fo...
- Publication number 20240321845
- Publication date Sep 26, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fine Pitch Conductive Po...
- Publication number 20240312884
- Publication date Sep 19, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
- Publication number 20240120289
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE
- Publication number 20240120268
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240112981
- Publication date Apr 4, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240105638
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Antenna-In-Package Structure
- Publication number 20240096770
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240098907
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- HyoDong RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING ELECTRONIC PACKAGE
- Publication number 20240071991
- Publication date Feb 29, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240057249
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Structure for...
- Publication number 20240030154
- Publication date Jan 25, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20230402399
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Advanced Thermal Dissipation
- Publication number 20230402343
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FORMING SEMICONDUCTOR DEVICE
- Publication number 20230395449
- Publication date Dec 7, 2023
- STATS ChipPAC Pte Ltd.
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna-in-Package Devices and Methods of Making
- Publication number 20230140748
- Publication date May 4, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS

SeungHyun Lee

Person

Patents Grantslast 30 patents

Integrated antenna-in-package structure

Antenna-in-package devices and methods of making

Patents Applicationslast 30 patents

MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...

Semiconductor Device and Method of Forming an Antenna-in-Package St...

METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...

Antenna-in-Package Devices and Methods of Making

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION

Semiconductor Device and Method of Making a Multi-Tier System-in-Pa...

SEMICONDUCTOR DEVICE WITH A PARTIAL SHIELDING LAYER AND A METHOD FO...

SEMICONDUCTOR PACKAGE STRIP AND METHOD FOR FORMING A SEMICONDUCTOR...

CARRIER ASSEMBLY FOR CARRYING SEMICONDUCTOR PACKAGE STRIPS WITH IMP...

SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION AND METHOD FOR...

Semiconductor Device and Method of Forming an Antenna-in-Package St...

Semiconductor Device and Method of Forming a 3-D Stacked Semiconduc...

Semiconductor Device and Method of Forming Compartment Shielding fo...

Semiconductor Device and Method of Forming Fine Pitch Conductive Po...

ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME

METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Integrated Antenna-In-Package Structure

ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME

METHOD FOR MAKING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method of Forming Conductive Structure for...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method for Advanced Thermal Dissipation

METHOD AND APPARATUS FOR FORMING SEMICONDUCTOR DEVICE

Antenna-in-Package Devices and Methods of Making