SeungHyun Lee

Person

Incheon, KR

People

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
- Publication number 20240120289
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE
- Publication number 20240120268
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240112981
- Publication date Apr 4, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240105638
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Antenna-In-Package Structure
- Publication number 20240096770
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240098907
- Publication date Mar 21, 2024
- JCET STATS ChipPAC Korea Limited
- HyoDong RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING ELECTRONIC PACKAGE
- Publication number 20240071991
- Publication date Feb 29, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240057249
- Publication date Feb 15, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Structure for...
- Publication number 20240030154
- Publication date Jan 25, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20230402399
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Advanced Thermal Dissipation
- Publication number 20230402343
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FORMING SEMICONDUCTOR DEVICE
- Publication number 20230395449
- Publication date Dec 7, 2023
- STATS ChipPAC Pte Ltd.
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna-in-Package Devices and Methods of Making
- Publication number 20230140748
- Publication date May 4, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS

SeungHyun Lee

Person

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME

METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Integrated Antenna-In-Package Structure

ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME

METHOD FOR MAKING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method of Forming Conductive Structure for...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method for Advanced Thermal Dissipation

METHOD AND APPARATUS FOR FORMING SEMICONDUCTOR DEVICE

Antenna-in-Package Devices and Methods of Making