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Shin-Puu Jeng
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Plano, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Low volatility solvent-based method for forming thin film nanoporou...
Patent number
6,645,878
Issue date
Nov 11, 2003
Texas Instruments Incorporated
Douglas M. Smith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aerogel thin film formation from multi-solvent systems
Patent number
6,437,007
Issue date
Aug 20, 2002
Texas Instruments Incorporated
Douglas M. Smith
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Low volatility solvent-based method for forming thin film nanoporou...
Patent number
6,380,105
Issue date
Apr 30, 2002
Texas Instruments Incorporated
Douglas M. Smith
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Grant
Nanoporous dielectric thin film formation using a post-deposition c...
Patent number
6,319,852
Issue date
Nov 20, 2001
Texas Instruments Incorporated
Douglas M. Smith
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Aerogel thin film formation from multi-solvent systems
Patent number
6,130,152
Issue date
Oct 10, 2000
Texas Instruments Incorporated
Douglas M. Smith
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Hydrogen silsesquioxane thin films for low capacitance structures i...
Patent number
6,114,186
Issue date
Sep 5, 2000
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nanoporous dielectric thin film surface modification
Patent number
6,063,714
Issue date
May 16, 2000
Texas Instruments Incorporated
Douglas M. Smith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low capacitance interconnect structures in integrated circuits havi...
Patent number
6,054,769
Issue date
Apr 25, 2000
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming diffusion barriers encapsulating copper
Patent number
6,008,117
Issue date
Dec 28, 1999
Texas Instruments Incorporated
Qi-Zhong Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing barrier-less plug structures
Patent number
5,985,763
Issue date
Nov 16, 1999
Texas Instruments Incorporated
Qi-Zhong Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low volatility solvent-based method for forming thin film nanoporou...
Patent number
5,955,140
Issue date
Sep 21, 1999
Texas Instruments Incorporated
Douglas M. Smith
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
TiSi.sub.2 /TiN clad interconnect technology
Patent number
5,936,306
Issue date
Aug 10, 1999
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilevel interconnect structure with air gaps formed between meta...
Patent number
5,936,295
Issue date
Aug 10, 1999
Texas Instruments Incorporated
Robert H. Havemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low capacitance interconnect structure for integrated circuits usin...
Patent number
5,923,074
Issue date
Jul 13, 1999
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Barrier-less plug structure
Patent number
5,892,282
Issue date
Apr 6, 1999
Texas Instruments Incorporated
Qi-Zhong Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Porous insulator for line-to-line capacitance reduction
Patent number
5,858,871
Issue date
Jan 12, 1999
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low capacitance interconnect structure for integrated circuits
Patent number
5,821,621
Issue date
Oct 13, 1998
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low capacitance interconnect structures in integrated circuits usin...
Patent number
5,818,111
Issue date
Oct 6, 1998
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect capacitance between metal leads
Patent number
5,814,558
Issue date
Sep 29, 1998
Texas Instruments Incorporated
Shin-puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a hydrogen-rich, low dielectric constant gate insu...
Patent number
5,772,485
Issue date
Jun 30, 1998
Texas Instruments Incorporated
Shin-Puu Jeng
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Rapid aging technique for aerogel thin films
Patent number
5,753,305
Issue date
May 19, 1998
Texas Instruments Incorporated
Douglas M. Smith
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Interconnect structure with an integrated low density dielectric
Patent number
5,747,880
Issue date
May 5, 1998
Texas Instruments Incorporated
Robert H. Havemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Highly thermally conductive interconnect structure for intergrated...
Patent number
5,744,865
Issue date
Apr 28, 1998
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming spacers for a flat display apparatus
Patent number
5,733,160
Issue date
Mar 31, 1998
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having damascene interconnects
Patent number
5,708,303
Issue date
Jan 13, 1998
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hydrogen-rich, low dielectric constant gate insulator for field emi...
Patent number
5,684,356
Issue date
Nov 4, 1997
Texas Instruments Incorporated
Shin-Puu Jeng
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Multilevel interconnect structure with air gaps formed between meta...
Patent number
5,668,398
Issue date
Sep 16, 1997
Texas Instruments Incorporated
Robert H. Havemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Diffusion barrier trilayer for minimizing reaction between metalliz...
Patent number
5,668,411
Issue date
Sep 16, 1997
Texas Instruments Incorporated
Qi-Zhong Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
TiSi.sub.2 /TiN clad interconnect technology
Patent number
5,654,575
Issue date
Aug 5, 1997
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
TiSi.sub.2 /TiN clad interconnect technology
Patent number
5,621,235
Issue date
Apr 15, 1997
Texas Instruments Incorporated
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Low volatility solvent-based method for forming thin film nanoporou...
Publication number
20030022524
Publication date
Jan 30, 2003
Douglas M. Smith
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL