Stanford W. Crane JR.

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Prefabricated semiconductor chip carrier
- Patent number 6,828,511
- Issue date Dec 7, 2004
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die package having mesh power and ground planes
- Patent number 6,803,650
- Issue date Oct 12, 2004
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die package for connection to a substrate
- Patent number 6,797,882
- Issue date Sep 28, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro grid array semiconductor die package
- Patent number 6,734,546
- Issue date May 11, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular semiconductor die package and method of manufacturing thereof
- Patent number 6,700,138
- Issue date Mar 2, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G02 - OPTICS
Information Patent Grant
Electrical connector having electrically conductive shielding
- Patent number 6,679,733
- Issue date Jan 20, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic packaging assembly
- Patent number 6,663,294
- Issue date Dec 16, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,603,193
- Issue date Aug 5, 2003
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip carrier affording a high-density external interface
- Patent number 6,577,003
- Issue date Jun 10, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular architecture for high bandwidth computers
- Patent number 6,574,726
- Issue date Jun 3, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-density electrical interconnect system
- Patent number 6,554,651
- Issue date Apr 29, 2003
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open-cavity semiconductor die package
- Patent number 6,475,832
- Issue date Nov 5, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Female contact pin including flexible contact portion
- Patent number 6,461,197
- Issue date Oct 8, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module having interconnect dies
- Patent number 6,421,254
- Issue date Jul 16, 2002
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prefabricated semiconductor chip carrier
- Patent number 6,339,191
- Issue date Jan 15, 2002
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector having staggered hold-down tabs
- Patent number 6,334,794
- Issue date Jan 1, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open-cavity semiconductor die package
- Patent number 6,307,258
- Issue date Oct 23, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated connector and semiconductor die package
- Patent number 6,305,987
- Issue date Oct 23, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer cabinet
- Patent number D447143
- Issue date Aug 28, 2001
- Silicon Bandwidth
- Stanford W. Crane
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Multi-chip module having interconnect dies
- Patent number 6,266,246
- Issue date Jul 24, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly with a female electrical connector ha...
- Patent number 6,247,972
- Issue date Jun 19, 2001
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density electrical interconnect system
- Patent number 6,203,347
- Issue date Mar 20, 2001
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method of manufacturing a semiconductor die carrier
- Patent number 6,141,869
- Issue date Nov 7, 2000
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer cabinet
- Patent number D430565
- Issue date Sep 5, 2000
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Semiconductor chip carrier including an interconnect component inte...
- Patent number 6,097,086
- Issue date Aug 1, 2000
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive backplane capable of being configured to a variable data pa...
- Patent number 6,092,139
- Issue date Jul 18, 2000
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor die package for mounting in horizontal and upright co...
- Patent number 6,078,102
- Issue date Jun 20, 2000
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer system having a modular architecture
- Patent number 6,073,229
- Issue date Jun 6, 2000
- The Panda Project
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical connector having staggered hold-down tabs
- Patent number 6,050,850
- Issue date Apr 18, 2000
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system for semiconductor die carrier
- Patent number 6,031,720
- Issue date Feb 29, 2000
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Backplane system having high-density electrical connectors
- Publication number 20080005442
- Publication date Jan 3, 2008
- The Panda Project
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Backplane system having high-density electrical connectors
- Publication number 20060282593
- Publication date Dec 14, 2006
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Decoupling capacitor for an integrated circuit and method of manufa...
- Publication number 20060279904
- Publication date Dec 14, 2006
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular coaxial electrical interconnect system and method of making...
- Publication number 20060105636
- Publication date May 18, 2006
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decoupling capacitor for an integrated circuit and method of manufa...
- Publication number 20060067031
- Publication date Mar 30, 2006
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Prefabricated semiconductor chip carrier
- Publication number 20050280158
- Publication date Dec 22, 2005
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optoelectronic packaging assembly
- Publication number 20040252953
- Publication date Dec 16, 2004
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Die package for connection to a substrate
- Publication number 20040232447
- Publication date Nov 25, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Semiconductor die package having mesh power and ground planes
- Publication number 20040222514
- Publication date Nov 11, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connector having staggered hold-down tabs
- Publication number 20040203281
- Publication date Oct 14, 2004
- The Panda Project, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Prefabricated semiconductor chip carrier
- Publication number 20040140542
- Publication date Jul 22, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flex circuit package
- Publication number 20040042183
- Publication date Mar 4, 2004
- Vicente D. Alcaria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modular semiconductor die package and method of manufacturing thereof
- Publication number 20040026757
- Publication date Feb 12, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Modular coaxial electrical interconnect system and method of making...
- Publication number 20040014360
- Publication date Jan 22, 2004
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip carrier affording a high-density external interface
- Publication number 20040007774
- Publication date Jan 15, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular architecture for high bandwidth computers
- Publication number 20040010638
- Publication date Jan 15, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High-density electrical interconnect system
- Publication number 20030194909
- Publication date Oct 16, 2003
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modular semiconductor die package and method of manufacturing thereof
- Publication number 20030160314
- Publication date Aug 28, 2003
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Micro grid array semiconductor die package
- Publication number 20030162319
- Publication date Aug 28, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20030042582
- Publication date Mar 6, 2003
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic packaging assembly
- Publication number 20030044128
- Publication date Mar 6, 2003
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Semiconductor package
- Publication number 20030042596
- Publication date Mar 6, 2003
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance optoelectronic packaging assembly
- Publication number 20030044130
- Publication date Mar 6, 2003
- Stanford W. Crane
- G02 - OPTICS
Information Patent Application
Hermetic seal
- Publication number 20030042598
- Publication date Mar 6, 2003
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Open-cavity semiconductor die package
- Publication number 20030003626
- Publication date Jan 2, 2003
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip module having interconnect dies
- Publication number 20020176238
- Publication date Nov 28, 2002
- The Panda Project, Inc.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modular architecture for high bandwidth computers
- Publication number 20020166040
- Publication date Nov 7, 2002
- Stanford W. Crane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Prefabricated semiconductor chip carrier
- Publication number 20020053455
- Publication date May 9, 2002
- SILICON BANDWIDTH INC.
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical connector having staggered hold-down tabs
- Publication number 20020042225
- Publication date Apr 11, 2002
- The Panda Project
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-density electrical interconnect system
- Publication number 20020028589
- Publication date Mar 7, 2002
- Stanford W. Crane
- H01 - BASIC ELECTRIC ELEMENTS

Stanford W. Crane JR.

Person

Patents Grantslast 30 patents

Prefabricated semiconductor chip carrier

Semiconductor die package having mesh power and ground planes

Die package for connection to a substrate

Micro grid array semiconductor die package

Modular semiconductor die package and method of manufacturing thereof

Electrical connector having electrically conductive shielding

Optoelectronic packaging assembly

Semiconductor package

Semiconductor chip carrier affording a high-density external interface

Modular architecture for high bandwidth computers

High-density electrical interconnect system

Open-cavity semiconductor die package

Female contact pin including flexible contact portion

Multi-chip module having interconnect dies

Prefabricated semiconductor chip carrier

Electrical connector having staggered hold-down tabs

Open-cavity semiconductor die package

Integrated connector and semiconductor die package

Computer cabinet

Multi-chip module having interconnect dies

Electrical connector assembly with a female electrical connector ha...

High-density electrical interconnect system

Apparatus for and method of manufacturing a semiconductor die carrier

Computer cabinet

Semiconductor chip carrier including an interconnect component inte...

Passive backplane capable of being configured to a variable data pa...

Semiconductor die package for mounting in horizontal and upright co...

Computer system having a modular architecture

Electrical connector having staggered hold-down tabs

Cooling system for semiconductor die carrier

Patents Applicationslast 30 patents

Backplane system having high-density electrical connectors

Backplane system having high-density electrical connectors

Decoupling capacitor for an integrated circuit and method of manufa...

Modular coaxial electrical interconnect system and method of making...

Decoupling capacitor for an integrated circuit and method of manufa...

Prefabricated semiconductor chip carrier

Optoelectronic packaging assembly

Die package for connection to a substrate

Semiconductor die package having mesh power and ground planes

Electrical connector having staggered hold-down tabs

Prefabricated semiconductor chip carrier

Flex circuit package

Modular semiconductor die package and method of manufacturing thereof

Modular coaxial electrical interconnect system and method of making...

Semiconductor chip carrier affording a high-density external interface

Modular architecture for high bandwidth computers

High-density electrical interconnect system

Modular semiconductor die package and method of manufacturing thereof

Micro grid array semiconductor die package

Semiconductor package

Optoelectronic packaging assembly

Semiconductor package

High performance optoelectronic packaging assembly

Hermetic seal

Open-cavity semiconductor die package

Multi-chip module having interconnect dies

Modular architecture for high bandwidth computers

Prefabricated semiconductor chip carrier

Electrical connector having staggered hold-down tabs

High-density electrical interconnect system