Stephen A. Fanelli

Person

San Marcos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned collector heterojunction bipolar transistor (HBT)
- Patent number 11,355,617
- Issue date Jun 7, 2022
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated acoustic filter on complementary metal oxide semiconduct...
- Patent number 11,309,352
- Issue date Apr 19, 2022
- QUALCOMM Incorporated
- Sinan Goktepeli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optically powered switch and method for operating an optically powe...
- Patent number 11,277,677
- Issue date Mar 15, 2022
- QUALCOMM Incorporated
- George Pete Imthurn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Porous semiconductor handle substrate
- Patent number 10,784,348
- Issue date Sep 22, 2020
- QUALCOMM Incorporated
- Stephen Alan Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on insulator with multiple semiconductor thicknesses using...
- Patent number 10,748,934
- Issue date Aug 18, 2020
- QUALCOMM Incorporated
- Qingqing Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous silicon dicing
- Patent number 10,700,012
- Issue date Jun 30, 2020
- QUALCOMM Incorporated
- Stephen Alan Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency silicon-on-insulator integrated heterojunction bipo...
- Patent number 10,680,086
- Issue date Jun 9, 2020
- QUALCOMM Incorporated
- Sinan Goktepeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk layer transfer processing with backside silicidation
- Patent number 10,559,520
- Issue date Feb 11, 2020
- QUALCOMM Incorporated
- Sinan Goktepeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around gate structures and methods of forming wrap-around gate...
- Patent number 10,522,687
- Issue date Dec 31, 2019
- QUALCOMM Incorporated
- Ravi Pramod Kumar Vedula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising switches and filters
- Patent number 10,312,193
- Issue date Jun 4, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Utilization of backside silicidation to form dual side contacted ca...
- Patent number 10,290,579
- Issue date May 14, 2019
- QUALCOMM Incorporated
- Sinan Goktepeli
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Monolithic integration of antenna switch and diplexer
- Patent number 10,256,863
- Issue date Apr 9, 2019
- QUALCOMM Incorporated
- Shiqun Gu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Porous silicon post processing
- Patent number 10,134,837
- Issue date Nov 20, 2018
- QUALCOMM Incorporated
- Stephen Alan Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop region based fabrication of bonded semiconductor structures
- Patent number 9,865,747
- Issue date Jan 9, 2018
- QUALCOMM Incorporated
- Stephen A. Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Utilization of backside silicidation to form dual side contacted ca...
- Patent number 9,847,293
- Issue date Dec 19, 2017
- QUALCOMM Incorporated
- Sinan Goktepeli
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods of forming a device having semiconductor devices on two sid...
- Patent number 9,837,302
- Issue date Dec 5, 2017
- QUALCOMM Incorporated
- Sinan Goktepeli
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Deep trench active device with backside body contact
- Patent number 9,812,580
- Issue date Nov 7, 2017
- QUALCOMM Incorporated
- Sinan Goktepeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned back side features
- Patent number 9,515,181
- Issue date Dec 6, 2016
- QUALCOMM Incorporated
- Stephen A. Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch stop region based fabrication of bonded semiconductor structures
- Patent number 9,466,729
- Issue date Oct 11, 2016
- QUALCOMM Incorporated
- Stephen A. Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structure with SiGeC/SiGeBC layer as etch stop
- Patent number 9,269,608
- Issue date Feb 23, 2016
- QUALCOMM SWITCH CORP.
- Stephen A. Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structure with SiGeC layer as etch stop
- Patent number 9,105,689
- Issue date Aug 11, 2015
- Silanna Semiconductor U.S.A., Inc.
- Stephen A. Fanelli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CREATING AN IMPLANTED LAYER IN A SILICON-ON-INSULATOR (SOI) WAFER...
- Publication number 20210280452
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Ravi Pramod Kumar VEDULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED COLLECTOR HETEROJUNCTION BIPOLAR TRANSISTOR (HBT)
- Publication number 20210098600
- Publication date Apr 1, 2021
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH CHARGE CARRIER MOBILITY MATERIALS ON...
- Publication number 20200266266
- Publication date Aug 20, 2020
- QUALCOMM lncorporated
- Sinan GOKTEPELI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON ON INSULATOR WITH MULTIPLE SEMICONDUCTOR THICKNESSES USING...
- Publication number 20200075633
- Publication date Mar 5, 2020
- QUALCOMM Incorporated
- Qingqing LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM DEVICES
- Publication number 20200044621
- Publication date Feb 6, 2020
- QUALCOMM Incorporated
- Stephen Alan FANELLI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
RADIO FREQUENCY SILICON-ON-INSULATOR INTEGRATED HETEROJUNCTION BIPO...
- Publication number 20190386121
- Publication date Dec 19, 2019
- QUALCOMM Incorporated
- Sinan GOKTEPELI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ACOUSTIC FILTER ON COMPLEMENTARY METAL OXIDE SEMICONDUCT...
- Publication number 20190273116
- Publication date Sep 5, 2019
- QUALCOMM Incorporated
- Sinan GOKTEPELI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FORMING A MODIFIED LAYER WITHIN A RADIO FREQUENCY (RF) SUBSTRATE FO...
- Publication number 20190198461
- Publication date Jun 27, 2019
- QUALCOMM Incorporated
- Stephen Alan FANELLI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH HIGH CHARGE CARRIER MOBILITY MATERIALS ON...
- Publication number 20190181218
- Publication date Jun 13, 2019
- QUALCOMM Incorporated
- Sinan GOKTEPELI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STRAINED SILICON LAYERS ON POROUS SILICON
- Publication number 20190131454
- Publication date May 2, 2019
- QUALCOMM Incorporated
- Sinan GOKTEPELI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK LAYER TRANSFER PROCESSING WITH BACKSIDE SILICIDATION
- Publication number 20190103339
- Publication date Apr 4, 2019
- QUALCOMM Incorporated
- Sinan GOKTEPELI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS SILICON DICING
- Publication number 20180301419
- Publication date Oct 18, 2018
- QUALCOMM Incorporated
- Stephen Alan FANELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS SEMICONDUCTOR HANDLE SUBSTRATE
- Publication number 20180277632
- Publication date Sep 27, 2018
- QUALCOMM Incorporated
- Stephen Alan FANELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP-AROUND GATE STRUCTURES AND METHODS OF FORMING WRAP-AROUND GATE...
- Publication number 20180233600
- Publication date Aug 16, 2018
- QUALCOMM Incorporated
- Ravi Pramod Kumar Vedula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UTILIZATION OF BACKSIDE SILICIDATION TO FORM DUAL SIDE CONTACTED CA...
- Publication number 20180076137
- Publication date Mar 15, 2018
- QUALCOMM Incorporated
- Sinan GOKTEPELI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING TRAP RICH LAYER REGIONS
- Publication number 20180069079
- Publication date Mar 8, 2018
- QUALCOMM Incorporated
- Steve Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING SWITCHES AND FILTERS
- Publication number 20180047673
- Publication date Feb 15, 2018
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING VERTICAL ACCESS TO THE COLLECTOR...
- Publication number 20170373175
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC INTEGRATION OF ANTENNA SWITCH AND DIPLEXER
- Publication number 20170201291
- Publication date Jul 13, 2017
- QUALCOMM Incorporated
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Self-Aligned Back Side Features
- Publication number 20170047346
- Publication date Feb 16, 2017
- QUALCOMM Incorporated
- Stephen A. Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH STOP REGION BASED FABRICATION OF BONDED SEMICONDUCTOR STRUCTURES
- Publication number 20160329435
- Publication date Nov 10, 2016
- QUALCOMM Incoporated
- Stephen A. Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED BACK SIDE FEATURES
- Publication number 20160042967
- Publication date Feb 11, 2016
- Silanna Semiconductor U.S.A., Inc.
- Stephen A. Fanelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure with Multiple Active Layers in an SOI Wafer
- Publication number 20160043108
- Publication date Feb 11, 2016
- Silanna Semiconductor U.S.A., Inc.
- Stephen A. Fanelli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bonded Semiconductor Structure with SiGeC/SiGeBC Layer as Etch Stop
- Publication number 20150270161
- Publication date Sep 24, 2015
- Silanna Semiconductor U.S.A., Inc.
- Stephen A. Fanelli
- H01 - BASIC ELECTRIC ELEMENTS

Stephen A. Fanelli

Person

Patents Grantslast 30 patents

Self-aligned collector heterojunction bipolar transistor (HBT)

Integrated acoustic filter on complementary metal oxide semiconduct...

Optically powered switch and method for operating an optically powe...

Porous semiconductor handle substrate

Silicon on insulator with multiple semiconductor thicknesses using...

Porous silicon dicing

Radio frequency silicon-on-insulator integrated heterojunction bipo...

Bulk layer transfer processing with backside silicidation

Wrap-around gate structures and methods of forming wrap-around gate...

Package comprising switches and filters

Utilization of backside silicidation to form dual side contacted ca...

Monolithic integration of antenna switch and diplexer

Porous silicon post processing

Etch stop region based fabrication of bonded semiconductor structures

Utilization of backside silicidation to form dual side contacted ca...

Methods of forming a device having semiconductor devices on two sid...

Deep trench active device with backside body contact

Semiconductor device with self-aligned back side features

Etch stop region based fabrication of bonded semiconductor structures

Bonded semiconductor structure with SiGeC/SiGeBC layer as etch stop

Bonded semiconductor structure with SiGeC layer as etch stop

Patents Applicationslast 30 patents

CREATING AN IMPLANTED LAYER IN A SILICON-ON-INSULATOR (SOI) WAFER...

SELF-ALIGNED COLLECTOR HETEROJUNCTION BIPOLAR TRANSISTOR (HBT)

SEMICONDUCTOR DEVICE WITH HIGH CHARGE CARRIER MOBILITY MATERIALS ON...

SILICON ON INSULATOR WITH MULTIPLE SEMICONDUCTOR THICKNESSES USING...

THIN FILM DEVICES

RADIO FREQUENCY SILICON-ON-INSULATOR INTEGRATED HETEROJUNCTION BIPO...

INTEGRATED ACOUSTIC FILTER ON COMPLEMENTARY METAL OXIDE SEMICONDUCT...

FORMING A MODIFIED LAYER WITHIN A RADIO FREQUENCY (RF) SUBSTRATE FO...

SEMICONDUCTOR DEVICE WITH HIGH CHARGE CARRIER MOBILITY MATERIALS ON...

SEMICONDUCTOR DEVICE WITH STRAINED SILICON LAYERS ON POROUS SILICON

BULK LAYER TRANSFER PROCESSING WITH BACKSIDE SILICIDATION

POROUS SILICON DICING

POROUS SEMICONDUCTOR HANDLE SUBSTRATE

WRAP-AROUND GATE STRUCTURES AND METHODS OF FORMING WRAP-AROUND GATE...

UTILIZATION OF BACKSIDE SILICIDATION TO FORM DUAL SIDE CONTACTED CA...

SEMICONDUCTOR DEVICES INCLUDING TRAP RICH LAYER REGIONS

PACKAGE COMPRISING SWITCHES AND FILTERS

SYSTEMS AND METHODS FOR PROVIDING VERTICAL ACCESS TO THE COLLECTOR...

MONOLITHIC INTEGRATION OF ANTENNA SWITCH AND DIPLEXER

Semiconductor Device With Self-Aligned Back Side Features

ETCH STOP REGION BASED FABRICATION OF BONDED SEMICONDUCTOR STRUCTURES

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED BACK SIDE FEATURES

Semiconductor Structure with Multiple Active Layers in an SOI Wafer

Bonded Semiconductor Structure with SiGeC/SiGeBC Layer as Etch Stop