Steven T. Mayer

Person

Aurora, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer shielding for prevention of lipseal plate-out
- Patent number 12,241,173
- Issue date Mar 4, 2025
- Lam Research Corporation
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electro-oxidative metal removal in through mask interconnect fabric...
- Patent number 11,610,782
- Issue date Mar 21, 2023
- Lam Research Corporation
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus for tailored uniformity profile
- Patent number 11,549,192
- Issue date Jan 10, 2023
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning electroplating substrate holders using reverse current dep...
- Patent number 11,542,630
- Issue date Jan 3, 2023
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic modulation of cross flow manifold during elecroplating
- Patent number 11,047,059
- Issue date Jun 29, 2021
- Lam Research Corporation
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for flow isolation and focusing during electr...
- Patent number 11,001,934
- Issue date May 11, 2021
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for measuring condition of electroplating cell components...
- Patent number 10,989,747
- Issue date Apr 27, 2021
- Lam Research Corporation
- Mark E. Emerson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated elastomeric lipseal and cup bottom for reducing wafer st...
- Patent number 10,982,346
- Issue date Apr 20, 2021
- Lam Research Corporation
- Aaron Berke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Protecting anodes from passivation in alloy plating systems
- Patent number 10,954,605
- Issue date Mar 23, 2021
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for electrodeposition of metals with the use o...
- Patent number 10,923,340
- Issue date Feb 16, 2021
- Lam Research Corporation
- Burhanuddin Kagajwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating apparatus for tailored uniformity profile
- Patent number 10,920,335
- Issue date Feb 16, 2021
- Novellus Systems, Inc.
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wetting pretreatment for enhanced damascene metal filling
- Patent number 10,840,101
- Issue date Nov 17, 2020
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Monitoring electrolytes during electroplating
- Patent number 10,774,438
- Issue date Sep 15, 2020
- Lam Research Corporation
- Matthew Sherman Thorum
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for achieving uniformity across a redistributio...
- Patent number 10,714,436
- Issue date Jul 14, 2020
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electro-oxidative metal removal in through mask interconnect fabric...
- Patent number 10,692,735
- Issue date Jun 23, 2020
- Lam Research Corporation
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for electroplating and seed layer detection
- Patent number 10,669,644
- Issue date Jun 2, 2020
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Enhancement of electrolyte hydrodynamics for efficient mass transfe...
- Patent number 10,662,545
- Issue date May 26, 2020
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning electroplating substrate holders using reverse current dep...
- Patent number 10,538,855
- Issue date Jan 21, 2020
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
TSV bath evaluation using field versus feature contrast
- Patent number 10,508,359
- Issue date Dec 17, 2019
- Lam Research Corporation
- Lee Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolyte concentration control system for high rate electroplating
- Patent number 10,472,730
- Issue date Nov 12, 2019
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for measuring condition of electroplating cell components...
- Patent number 10,436,829
- Issue date Oct 8, 2019
- Lam Research Corporation
- Mark E. Emerson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Remote detection of plating on wafer holding apparatus
- Patent number 10,416,092
- Issue date Sep 17, 2019
- Lam Research Corporation
- Rajan Arora
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for electroplating and seed layer detection
- Patent number 10,407,794
- Issue date Sep 10, 2019
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic modulation of cross flow manifold during elecroplating
- Patent number 10,364,505
- Issue date Jul 30, 2019
- Lam Research Corporation
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and process for wafer level packaging
- Patent number 10,309,024
- Issue date Jun 4, 2019
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for wetting pretreatment for through resist m...
- Patent number 10,301,738
- Issue date May 28, 2019
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Bubble and foam solutions using a completely immersed air-free feed...
- Patent number 10,208,395
- Issue date Feb 19, 2019
- Lam Research Corporation
- Richard Abraham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for electroplating and seed layer detection
- Patent number 10,196,753
- Issue date Feb 5, 2019
- Lam Research Corporation
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatuses and methods for maintaining pH in nickel electroplating...
- Patent number 10,190,232
- Issue date Jan 29, 2019
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cross flow manifold for electroplating apparatus
- Patent number 10,190,230
- Issue date Jan 29, 2019
- Novellus Systems, Inc.
- Richard Abraham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...
- Publication number 20240279839
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Steven T. MAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...
- Publication number 20240141541
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL ASSEMBLY FOR FORMING SEMICONDUCTOR FEATURES
- Publication number 20240084473
- Publication date Mar 14, 2024
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS KIT DE-BUBBLING
- Publication number 20230407514
- Publication date Dec 21, 2023
- LAM RESEARCH CORPORATION
- James Isaac Fortner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...
- Publication number 20230340686
- Publication date Oct 26, 2023
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...
- Publication number 20230230847
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER
- Publication number 20230212773
- Publication date Jul 6, 2023
- LAM RESEARCH CORPORATION
- Justin OBERST
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH-SPEED 3D METAL PRINTING OF SEMICONDUCTOR METAL INTERCONNECTS
- Publication number 20230035849
- Publication date Feb 2, 2023
- LAM RESEARCH CORPORATION
- Steven T. MAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING...
- Publication number 20230026818
- Publication date Jan 26, 2023
- LAM RESEARCH CORPORATION
- Jae Shin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER SHIELDING FOR PREVENTION OF LIPSEAL PLATE-OUT
- Publication number 20220396894
- Publication date Dec 15, 2022
- LAM RESEARCH CORPORATION
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BYPRODUCT REMOVAL FROM ELECTROPLATING SOLUTIONS
- Publication number 20220307152
- Publication date Sep 29, 2022
- LAM RESEARCH CORPORATION
- Joseph Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS
- Publication number 20220275531
- Publication date Sep 1, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GOLD THROUGH SILICON MASK PLATING
- Publication number 20220216104
- Publication date Jul 7, 2022
- LAM RESEARCH CORPORATION
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE
- Publication number 20210148001
- Publication date May 20, 2021
- Novellus Systems, Inc.
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OXIDATIVE METAL REMOVAL IN THROUGH MASK INTERCONNECT FABRIC...
- Publication number 20200279754
- Publication date Sep 3, 2020
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING ELECTROPLATING SUBSTRATE HOLDERS USING REVERSE CURRENT DEP...
- Publication number 20200115816
- Publication date Apr 16, 2020
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus for Measuring Condition of Electroplating Cell Components...
- Publication number 20200011914
- Publication date Jan 9, 2020
- LAM RESEARCH CORPORATION
- Mark E. Emerson
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUSES FOR ELECTROPLATING AND SEED LAYER DETECTION
- Publication number 20190352792
- Publication date Nov 21, 2019
- LAM RESEARCH CORPORATION
- Daniel Mark Dinneen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC MODULATION OF CROSS FLOW MANIFOLD DURING ELECROPLATING
- Publication number 20190301042
- Publication date Oct 3, 2019
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND APPARATUSES FOR ELECTROPLATING AND SEED LAYER DETECTION
- Publication number 20190127873
- Publication date May 2, 2019
- LAM RESEARCH CORPORATION
- Daniel Mark Dinneen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTIBATH PLATING OF A SINGLE METAL
- Publication number 20190122890
- Publication date Apr 25, 2019
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND APPARATUS FOR FLOW ISOLATION AND FOCUSING DURING ELECTR...
- Publication number 20190055665
- Publication date Feb 21, 2019
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED ELASTOMERIC LIPSEAL AND CUP BOTTOM FOR REDUCING WAFER ST...
- Publication number 20190040544
- Publication date Feb 7, 2019
- LAM RESEARCH CORPORATION
- Aaron Berke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRO-OXIDATIVE METAL REMOVAL IN THROUGH MASK INTERCONNECT FABRIC...
- Publication number 20190035640
- Publication date Jan 31, 2019
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MONITORING ELECTROLYTES DURING ELECTROPLATING
- Publication number 20190010626
- Publication date Jan 10, 2019
- LAM RESEARCH CORPORATION
- Matthew Sherman Thorum
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS
- Publication number 20180371637
- Publication date Dec 27, 2018
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR MODULATING AZIMUTHAL UNIFORMITY IN ELECTRO...
- Publication number 20180312991
- Publication date Nov 1, 2018
- LAM RESEARCH CORPORATION
- Gabriel Hay Graham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE
- Publication number 20180291517
- Publication date Oct 11, 2018
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR ELECTRODEPOSITION OF METALS WITH THE USE O...
- Publication number 20180286660
- Publication date Oct 4, 2018
- LAM RESEARCH CORPORATION
- Burhanuddin Kagajwala
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTE DELIVERY AND GENERATION EQUIPMENT
- Publication number 20180274123
- Publication date Sep 27, 2018
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Steven T. Mayer

Person

Patents Grantslast 30 patents

Wafer shielding for prevention of lipseal plate-out

Electro-oxidative metal removal in through mask interconnect fabric...

Electroplating apparatus for tailored uniformity profile

Cleaning electroplating substrate holders using reverse current dep...

Dynamic modulation of cross flow manifold during elecroplating

Methods and apparatus for flow isolation and focusing during electr...

Apparatus for measuring condition of electroplating cell components...

Integrated elastomeric lipseal and cup bottom for reducing wafer st...

Protecting anodes from passivation in alloy plating systems

Apparatus and method for electrodeposition of metals with the use o...

Electroplating apparatus for tailored uniformity profile

Wetting pretreatment for enhanced damascene metal filling

Monitoring electrolytes during electroplating

Systems and methods for achieving uniformity across a redistributio...

Electro-oxidative metal removal in through mask interconnect fabric...

Methods and apparatuses for electroplating and seed layer detection

Enhancement of electrolyte hydrodynamics for efficient mass transfe...

Cleaning electroplating substrate holders using reverse current dep...

TSV bath evaluation using field versus feature contrast

Electrolyte concentration control system for high rate electroplating

Apparatus for measuring condition of electroplating cell components...

Remote detection of plating on wafer holding apparatus

Methods and apparatuses for electroplating and seed layer detection

Dynamic modulation of cross flow manifold during elecroplating

Electroplating apparatus and process for wafer level packaging

Methods and apparatus for wetting pretreatment for through resist m...

Bubble and foam solutions using a completely immersed air-free feed...

Methods and apparatuses for electroplating and seed layer detection

Apparatuses and methods for maintaining pH in nickel electroplating...

Cross flow manifold for electroplating apparatus

Patents Applicationslast 30 patents

MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...

ELECTRODEPOSITION OF METALS USING AN IONICALLY RESISTIVE IONICALLY...

ELECTROCHEMICAL ASSEMBLY FOR FORMING SEMICONDUCTOR FEATURES

PROCESS KIT DE-BUBBLING

ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...

ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...

SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER

HIGH-SPEED 3D METAL PRINTING OF SEMICONDUCTOR METAL INTERCONNECTS

TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING...

WAFER SHIELDING FOR PREVENTION OF LIPSEAL PLATE-OUT

BYPRODUCT REMOVAL FROM ELECTROPLATING SOLUTIONS

DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS

GOLD THROUGH SILICON MASK PLATING

ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE

ELECTRO-OXIDATIVE METAL REMOVAL IN THROUGH MASK INTERCONNECT FABRIC...

CLEANING ELECTROPLATING SUBSTRATE HOLDERS USING REVERSE CURRENT DEP...

Apparatus for Measuring Condition of Electroplating Cell Components...

METHODS AND APPARATUSES FOR ELECTROPLATING AND SEED LAYER DETECTION

DYNAMIC MODULATION OF CROSS FLOW MANIFOLD DURING ELECROPLATING

METHODS AND APPARATUSES FOR ELECTROPLATING AND SEED LAYER DETECTION

MULTIBATH PLATING OF A SINGLE METAL

METHODS AND APPARATUS FOR FLOW ISOLATION AND FOCUSING DURING ELECTR...

INTEGRATED ELASTOMERIC LIPSEAL AND CUP BOTTOM FOR REDUCING WAFER ST...

ELECTRO-OXIDATIVE METAL REMOVAL IN THROUGH MASK INTERCONNECT FABRIC...

MONITORING ELECTROLYTES DURING ELECTROPLATING

PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS

APPARATUS AND METHOD FOR MODULATING AZIMUTHAL UNIFORMITY IN ELECTRO...

ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE

APPARATUS AND METHOD FOR ELECTRODEPOSITION OF METALS WITH THE USE O...

ELECTROLYTE DELIVERY AND GENERATION EQUIPMENT