Swee Kheng CHUA

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Mobile control unit, facility management system, mobile unit contro...
- Patent number 11,854,354
- Issue date Dec 26, 2023
- CONCORDE ASIA PTE. LTD.
- Swee Kheng Chua
- G08 - SIGNALLING
Information Patent Grant
Mobile monitoring system, mobile monitoring unit, and mobile monito...
- Patent number 11,688,270
- Issue date Jun 27, 2023
- CONCORDE ASIA PTE, LTD.
- Swee Kheng Chua
- G08 - SIGNALLING
Information Patent Grant
Offshore security monitoring system and method
- Patent number 9,953,513
- Issue date Apr 24, 2018
- CONCORDE ASIA PTE. LTD.
- Swee Kheng Chua
- G08 - SIGNALLING
Information Patent Grant
Security control system for granting access and security control me...
- Patent number 9,786,106
- Issue date Oct 10, 2017
- CONCORDE ASIA PTE. LTD.
- Swee Kheng Chua
- G07 - CHECKING-DEVICES
Information Patent Grant
Stackable semiconductor assemblies and methods of manufacturing suc...
- Patent number 8,669,657
- Issue date Mar 11, 2014
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 8,564,106
- Issue date Oct 22, 2013
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging circuits
- Patent number 8,555,495
- Issue date Oct 15, 2013
- Micron Technology, Inc.
- Yong Poo Chia
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stackable semiconductor assemblies and methods of manufacturing suc...
- Patent number 8,518,747
- Issue date Aug 27, 2013
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 8,362,594
- Issue date Jan 29, 2013
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor assemblies and methods of manufacturing suc...
- Patent number 8,288,874
- Issue date Oct 16, 2012
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 8,106,488
- Issue date Jan 31, 2012
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging circuits
- Patent number 8,065,792
- Issue date Nov 29, 2011
- Micron Technology, Inc.
- Yong Poo Chia
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 7,915,711
- Issue date Mar 29, 2011
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor assemblies and methods of manufacturing suc...
- Patent number 7,863,722
- Issue date Jan 4, 2011
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 7,820,484
- Issue date Oct 26, 2010
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor die packages and associated systems and methods
- Patent number 7,816,750
- Issue date Oct 19, 2010
- Aptina Imaging Corporation
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging circuits and packaged circuits
- Patent number 7,712,211
- Issue date May 11, 2010
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 7,674,655
- Issue date Mar 9, 2010
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 7,553,697
- Issue date Jun 30, 2009
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multichip wafer level packages and computing syste...
- Patent number 7,485,562
- Issue date Feb 3, 2009
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a conductive via through a wafer
- Patent number 7,375,009
- Issue date May 20, 2008
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,304,375
- Issue date Dec 4, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless packaging for image sensor devices
- Patent number 7,274,094
- Issue date Sep 25, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,271,027
- Issue date Sep 18, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,193,312
- Issue date Mar 20, 2007
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 7,173,330
- Issue date Feb 6, 2007
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless packaging for image sensor devices and methods of assembly
- Patent number 7,112,471
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip wafer level packages and computing systems incorporating...
- Patent number 7,087,992
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package and method of fabricating same
- Patent number 6,987,031
- Issue date Jan 17, 2006
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip wafer level system packages and methods of forming same
- Patent number 6,964,881
- Issue date Nov 15, 2005
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Mobile Control Unit, Facility Management System, Mobile Unit Contro...
- Publication number 20240085925
- Publication date Mar 14, 2024
- CONCORDE ASIA PTE. LTD.
- Swee Kheng CHUA
- G05 - CONTROLLING REGULATING
Information Patent Application
MOBILE MONITORING SYSTEM, MOBILE MONITORING UNIT, AND MOBILE MONITO...
- Publication number 20210233379
- Publication date Jul 29, 2021
- CONCORDE ASIA PTE, LTD.
- Swee Kheng CHUA
- G08 - SIGNALLING
Information Patent Application
An Offshore Security Monitoring System and Method
- Publication number 20170287314
- Publication date Oct 5, 2017
- CONCORDE ASIA PTE. LTD.
- Swee Kheng Chua
- G08 - SIGNALLING
Information Patent Application
SECURITY CONTROL SYSTEM FOR GRANTING ACCESS AND SECURITY CONTROL ME...
- Publication number 20170140584
- Publication date May 18, 2017
- CONCORDE ASIA PTE. LTD.
- Swee Kheng CHUA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOBILE CONTROL UNIT, FACILITY MANAGEMENT SYSTEM, MOBILE UNIT CONTRO...
- Publication number 20160240076
- Publication date Aug 18, 2016
- CONCORDE ASIA PTE. LTD.
- Swee Kheng CHUA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACKABLE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUC...
- Publication number 20140008784
- Publication date Jan 9, 2014
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUC...
- Publication number 20130011966
- Publication date Jan 10, 2013
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING
- Publication number 20120119263
- Publication date May 17, 2012
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CIRCUITS
- Publication number 20120064697
- Publication date Mar 15, 2012
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEARING AID
- Publication number 20110211718
- Publication date Sep 1, 2011
- SIEMENS MEDICAL INSTRUMENTS PTE. LTD.
- Swee Kim Chua
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACKABLE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUC...
- Publication number 20110095407
- Publication date Apr 28, 2011
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING
- Publication number 20110018143
- Publication date Jan 27, 2011
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CIRCUITS AND PACKAGED CIRCUITS
- Publication number 20100146780
- Publication date Jun 17, 2010
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUC...
- Publication number 20100096737
- Publication date Apr 22, 2010
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING
- Publication number 20080211113
- Publication date Sep 4, 2008
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package
- Publication number 20070059862
- Publication date Mar 15, 2007
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060001143
- Publication date Jan 5, 2006
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package and method of fabricating same
- Publication number 20050236709
- Publication date Oct 27, 2005
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making multichip wafer level packages and computing syste...
- Publication number 20050116337
- Publication date Jun 2, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level packages and computing systems incorporating...
- Publication number 20050073029
- Publication date Apr 7, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package
- Publication number 20050006748
- Publication date Jan 13, 2005
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices and methods of packaging microelec...
- Publication number 20040238909
- Publication date Dec 2, 2004
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level system packages and methods of forming same
- Publication number 20040229400
- Publication date Nov 18, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for packaging circuits and packaged circuits
- Publication number 20040221451
- Publication date Nov 11, 2004
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless packaging for image sensor devices and methods of assembly
- Publication number 20040084741
- Publication date May 6, 2004
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level packages and computing systems incorporating...
- Publication number 20040046250
- Publication date Mar 11, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package and method of fabricating same
- Publication number 20040042190
- Publication date Mar 4, 2004
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless packaging for image sensor devices and methods of assembly
- Publication number 20040041221
- Publication date Mar 4, 2004
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip wafer level system packages and methods of forming same
- Publication number 20040043533
- Publication date Mar 4, 2004
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level packaging
- Publication number 20030232488
- Publication date Dec 18, 2003
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS

Swee Kheng CHUA

Person

Patents Grantslast 30 patents

Mobile control unit, facility management system, mobile unit contro...

Mobile monitoring system, mobile monitoring unit, and mobile monito...

Offshore security monitoring system and method

Security control system for granting access and security control me...

Stackable semiconductor assemblies and methods of manufacturing suc...

Wafer level packaging

Method for packaging circuits

Stackable semiconductor assemblies and methods of manufacturing suc...

Semiconductor assemblies and methods of manufacturing such assembli...

Stackable semiconductor assemblies and methods of manufacturing suc...

Wafer level packaging

Method for packaging circuits

Semiconductor assemblies and methods of manufacturing such assembli...

Stackable semiconductor assemblies and methods of manufacturing suc...

Wafer level packaging

Thin semiconductor die packages and associated systems and methods

Method for packaging circuits and packaged circuits

Semiconductor assemblies and methods of manufacturing such assembli...

Multiple chip semiconductor package

Method of making multichip wafer level packages and computing syste...

Method of forming a conductive via through a wafer

Castellation wafer level packaging of integrated circuit chips

Leadless packaging for image sensor devices

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Multiple chip semiconductor package

Leadless packaging for image sensor devices and methods of assembly

Multichip wafer level packages and computing systems incorporating...

Multiple chip semiconductor package and method of fabricating same

Multi-chip wafer level system packages and methods of forming same

Patents Applicationslast 30 patents

Mobile Control Unit, Facility Management System, Mobile Unit Contro...

MOBILE MONITORING SYSTEM, MOBILE MONITORING UNIT, AND MOBILE MONITO...

An Offshore Security Monitoring System and Method

SECURITY CONTROL SYSTEM FOR GRANTING ACCESS AND SECURITY CONTROL ME...

MOBILE CONTROL UNIT, FACILITY MANAGEMENT SYSTEM, MOBILE UNIT CONTRO...

STACKABLE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUC...

STACKABLE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUC...

WAFER LEVEL PACKAGING

METHOD FOR PACKAGING CIRCUITS

HEARING AID

STACKABLE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUC...

WAFER LEVEL PACKAGING

METHOD FOR PACKAGING CIRCUITS AND PACKAGED CIRCUITS

STACKABLE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUC...

WAFER LEVEL PACKAGING

Multiple chip semiconductor package

Castellation wafer level packaging of integrated circuit chips

Multiple chip semiconductor package and method of fabricating same

Method of making multichip wafer level packages and computing syste...

Multichip wafer level packages and computing systems incorporating...

Multiple chip semiconductor package

Packaged microelectronic devices and methods of packaging microelec...

Multichip wafer level system packages and methods of forming same

Method for packaging circuits and packaged circuits

Leadless packaging for image sensor devices and methods of assembly

Multichip wafer level packages and computing systems incorporating...

Multiple chip semiconductor package and method of fabricating same

Leadless packaging for image sensor devices and methods of assembly

Multi-chip wafer level system packages and methods of forming same

Wafer level packaging