Takafumi Konno

Person

Hakodate, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,466,540
- Issue date Jun 18, 2013
- Renesas Electronics Corporation
- Shigeki Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lead frame and semiconductor device using the lead frame and method...
- Patent number 6,909,179
- Issue date Jun 21, 2005
- Renesas Technology Corp.
- Shigeki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package including forming a r...
- Patent number 6,887,739
- Issue date May 3, 2005
- Renesas Technology Corp.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,803,258
- Issue date Oct 12, 2004
- Renesas Technology Corp.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a resin encapsulated semiconductor device t...
- Patent number 6,764,878
- Issue date Jul 20, 2004
- Renesas Technology Corp.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having resin sealing body
- Patent number 6,759,279
- Issue date Jul 6, 2004
- Renesas Technology Corp.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device having improved heat radiatio...
- Patent number 6,673,655
- Issue date Jan 6, 2004
- Hitachi, Ltd.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type semiconductor package having a flexible substrate
- Patent number 6,590,275
- Issue date Jul 8, 2003
- Hitachi, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,551,862
- Issue date Apr 22, 2003
- Hitachi, Ltd.
- Riyouichi Oota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type semiconductor package having a flexible substrate
- Patent number 6,476,466
- Issue date Nov 5, 2002
- Hitachi Hokkai Semiconductor, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,448,111
- Issue date Sep 10, 2002
- Hitachi Hokkai Semiconductor, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array type semiconductor package having a flexible substrate
- Patent number 6,437,428
- Issue date Aug 20, 2002
- Hitachi Hokkai Semiconductor, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,396,142
- Issue date May 28, 2002
- Hitachi, Ltd.
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device using the lead frame and method...
- Patent number 6,265,762
- Issue date Jul 24, 2001
- Hitachi, Ltd.
- Shigeki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a chip mounted on a flexible substrate...
- Patent number 6,232,650
- Issue date May 15, 2001
- Hitachi, Ltd.
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Manufacturing Method Therefor
- Publication number 20100193923
- Publication date Aug 5, 2010
- Renesas Technology Corp.
- Shigeki Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device
- Publication number 20040262752
- Publication date Dec 30, 2004
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040126932
- Publication date Jul 1, 2004
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20040005733
- Publication date Jan 8, 2004
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20020192872
- Publication date Dec 19, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020192871
- Publication date Dec 19, 2002
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a resin encapsulated semiconductor device t...
- Publication number 20020182776
- Publication date Dec 5, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020137262
- Publication date Sep 26, 2002
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20020137261
- Publication date Sep 26, 2002
- Fujio Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array type semiconductor package having a flexible substrate
- Publication number 20020079579
- Publication date Jun 27, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array type semiconductor package having a flexible substrate
- Publication number 20020070462
- Publication date Jun 13, 2002
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020050642
- Publication date May 2, 2002
- Riyouichi Oota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame and semiconductor device using the lead frame and method...
- Publication number 20010050419
- Publication date Dec 13, 2001
- Shigeki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20010015489
- Publication date Aug 23, 2001
- Atsushi Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS

Takafumi Konno

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method therefor

Lead frame and semiconductor device using the lead frame and method...

Method of manufacturing semiconductor package including forming a r...

Semiconductor device

Method of manufacturing a resin encapsulated semiconductor device t...

Method of manufacturing semiconductor device having resin sealing body

Method of making semiconductor device having improved heat radiatio...

Ball grid array type semiconductor package having a flexible substrate

Semiconductor device and method of manufacturing the same

Ball grid array type semiconductor package having a flexible substrate

Method of manufacturing a semiconductor device

Ball grid array type semiconductor package having a flexible substrate

Semiconductor device

Lead frame and semiconductor device using the lead frame and method...

Semiconductor device having a chip mounted on a flexible substrate...

Patents Applicationslast 30 patents

Semiconductor Device and Manufacturing Method Therefor

Semiconductor device

Semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device

Method of manufacturing a resin encapsulated semiconductor device t...

Semiconductor device

Semiconductor device

Ball grid array type semiconductor package having a flexible substrate

Ball grid array type semiconductor package having a flexible substrate

Semiconductor device and method of manufacturing the same

Lead frame and semiconductor device using the lead frame and method...

Semiconductor device and its manufacturing method