Terry W. Davis

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Conformal shield on punch QFN semiconductor package
- Patent number 8,729,682
- Issue date May 20, 2014
- Amkor Technology, Inc.
- Terry W. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal shield on punch QFN semiconductor package
- Patent number 7,960,818
- Issue date Jun 14, 2011
- Amkor Technology, Inc.
- Terry W. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a fan-in leadframe semiconductor package
- Patent number 7,473,584
- Issue date Jan 6, 2009
- Amkor Technology, Inc.
- Terry W. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-in leadframe semiconductor package
- Patent number 7,217,991
- Issue date May 15, 2007
- Amkor Technology, Inc.
- Terry W. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with plated end leads
- Patent number 7,183,630
- Issue date Feb 27, 2007
- Amkor Technology, Inc.
- Harry J. Fogelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe strip having enhanced testability
- Patent number 7,008,825
- Issue date Mar 7, 2006
- Amkor Technology, Inc.
- Ludovico E. Bancod
- G01 - MEASURING TESTING
Information Patent Grant
Saw and etch singulation method for a chip package
- Patent number 6,841,414
- Issue date Jan 11, 2005
- Amkor Technology, Inc.
- Tom Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with singulation crease
- Patent number 6,611,047
- Issue date Aug 26, 2003
- Amkor Technology, Inc.
- Tom Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with plated end leads
- Patent number 6,608,366
- Issue date Aug 19, 2003
- Harry J. Fogelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Thin integrated circuit device packages for improved radio frequenc...
- Publication number 20070176287
- Publication date Aug 2, 2007
- Sean T. Crowley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with singulation crease
- Publication number 20030073265
- Publication date Apr 17, 2003
- Tom Hu
- H01 - BASIC ELECTRIC ELEMENTS

Terry W. Davis

Person

Patents Grantslast 30 patents

Conformal shield on punch QFN semiconductor package

Conformal shield on punch QFN semiconductor package

Method for fabricating a fan-in leadframe semiconductor package

Fan-in leadframe semiconductor package

Lead frame with plated end leads

Leadframe strip having enhanced testability

Saw and etch singulation method for a chip package

Semiconductor package with singulation crease

Lead frame with plated end leads

Patents Applicationslast 30 patents

Thin integrated circuit device packages for improved radio frequenc...

Semiconductor package with singulation crease