Thurston Bryce Youngs Jr.

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Floating interposer
- Patent number 6,774,315
- Issue date Aug 10, 2004
- International Business Machines Corporation
- Mark Vincent Pierson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Economical high density chip carrier
- Patent number 6,753,612
- Issue date Jun 22, 2004
- International Business Machines Corporation
- Sylvia Adae-Amoakoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a metallization feature on an edge of an IC chip
- Patent number 6,156,165
- Issue date Dec 5, 2000
- International Business Machines Corporation
- Mark Vincent Pierson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for high density edge mounting of chips
- Patent number 6,059,939
- Issue date May 9, 2000
- International Business Machines Corporation
- Mark Vincent Pierson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density edge mounting of chips
- Patent number 5,903,437
- Issue date May 11, 1999
- International Business Machines Corporation
- Mark Vincent Pierson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced chip packaging structure for memory card applications
- Patent number 5,889,654
- Issue date Mar 30, 1999
- International Business Machines Corporation
- Mark V. Pierson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal display tile interconnected to a tile carrier and me...
- Patent number 5,875,011
- Issue date Feb 23, 1999
- International Business Machines Corporation
- Mark Vincent Pierson
- G02 - OPTICS
Information Patent Grant
Chip stacking by edge metallization
- Patent number 5,818,107
- Issue date Oct 6, 1998
- International Business Machines Corporation
- Mark Vincent Pierson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electronic multilayer printed circuit boards or c...
- Patent number 5,743,004
- Issue date Apr 28, 1998
- International Business Machines Corporation
- Ivan Ivor Chobot
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-annular lands
- Patent number 5,713,127
- Issue date Feb 3, 1998
- International Business Machines Corporation
- Ivan Ivor Chobot
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-annular lands
- Patent number 5,539,156
- Issue date Jul 23, 1996
- International Business Machines Corporation
- Ivan I Chobot
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming electronic multi-layer printed circuit boards an...
- Patent number 5,473,813
- Issue date Dec 12, 1995
- International Business Machines Corporation
- Ivan I. Chobot
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple wiring and X section printed circuit board technique
- Patent number 5,418,690
- Issue date May 23, 1995
- International Business Machines Corporation
- Robert B. Conn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board or card thermal mass design
- Patent number 5,363,280
- Issue date Nov 8, 1994
- International Business Machines Corporation
- Ivan I. Chobot
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Floating interposer
- Publication number 20040201396
- Publication date Oct 14, 2004
- Mark Vincent Pierson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Economical high density chip carrier
- Publication number 20040099960
- Publication date May 27, 2004
- Sylvia Adae-Amoakoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board construction
- Publication number 20020166697
- Publication date Nov 14, 2002
- International Business Machines Corporation
- Mark L. Janecek
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and structure for economical high density chip carrier
- Publication number 20020145203
- Publication date Oct 10, 2002
- International Business Machines Corporation
- Sylvia Adae-Amoakoh
- H01 - BASIC ELECTRIC ELEMENTS

Thurston Bryce Youngs Jr.

Person

Patents Grantslast 30 patents

Floating interposer

Economical high density chip carrier

Method of forming a metallization feature on an edge of an IC chip

Method for high density edge mounting of chips

High density edge mounting of chips

Advanced chip packaging structure for memory card applications

Liquid crystal display tile interconnected to a tile carrier and me...

Chip stacking by edge metallization

Method of forming electronic multilayer printed circuit boards or c...

Non-annular lands

Non-annular lands

Methods of forming electronic multi-layer printed circuit boards an...

Multiple wiring and X section printed circuit board technique

Printed circuit board or card thermal mass design

Patents Applicationslast 30 patents

Floating interposer

Economical high density chip carrier

Circuit board construction

Method and structure for economical high density chip carrier