E. Kunkler et al.; Module With Removable Heat Transfer Members; IBM Technical Disclosure Bulletin; vol. 23, No. 9, Feb. 1981; pp. 4095-4096. |
S. Magdo; Semiconductor Encapsulation; IBM Technical Disclosure Bulletin; vol. 20, No. 10, Mar., 1978; pp. 3903-3905. |
TCM With Hollow Cylindrical Piston With Multiple Radial Fingers; IBM Technical Disclosure Bulletin; vol. 28, No. 3, Aug., 1985; p. 1215. |
A. B.Cistola; Multilayer Ceramic Scanner Device Packaging; IBM Technical Disclosure Bulletin; vol. 19, No. 4, Sep. 1976; p. 1183. |
J. Ameen; Thermally Enhanced High Performace Module; IBM Technical Disclosure Bulleting; vol. 31, No. 12; May 1989; pp. 410-411. |
R.J. Betz; Monolithic Circuit Package; IBM Technical Disclosure Bulletin; vol. 10, No. 7, Dec., 1967; p. 877. |
D.A. Bartlett et al.; Pinned Substrate For Circuit Chip Mounting; Research Disclosure, Jul. 1986, No. 267. |
J. Gow, et al.; Selective Connection of Circuit Elements in Multilayer Ceramic Structure; Research Disclosure, Oct., 1989; No. 306. |