Tsorng-Dih Yuan

Person

Hopewell Jct., NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat stud for stacked chip package
- Patent number 7,361,986
- Issue date Apr 22, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsorng-Dih Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric semiconductor device and process for fabricating the...
- Patent number 7,329,600
- Issue date Feb 12, 2008
- International Business Machines Corporation
- Lawrence Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural design for flip-chip assembly
- Patent number 7,138,300
- Issue date Nov 21, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsorng-Dih Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased efficiency in liquid and gaseous planar device cooling te...
- Patent number 7,134,484
- Issue date Nov 14, 2006
- International Business Machines Corporation
- Lawrence Shungwei Mok
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and structure for providing improved thermal conduction for...
- Patent number 7,052,937
- Issue date May 30, 2006
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device with multiple compliant elements
- Patent number 6,778,393
- Issue date Aug 17, 2004
- International Business Machines Corporation
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device utilizing alignment marks for globally alignin...
- Patent number 6,617,702
- Issue date Sep 9, 2003
- IBM Corporation
- Louis L. Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging system and method using deposited diamond film
- Patent number 6,579,743
- Issue date Jun 17, 2003
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging system and method using deposited diamond film
- Patent number 6,337,513
- Issue date Jan 8, 2002
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer structure having a buried insulation layer
- Patent number 5,366,923
- Issue date Nov 22, 1994
- International Business Machines Corporation
- Klaus D. Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer structure having a buried insulation layer
- Patent number 5,276,338
- Issue date Jan 4, 1994
- International Business Machines Corporation
- Klaus Beyer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Spacer Structures for Semiconductor Package Devices
- Publication number 20060170088
- Publication date Aug 3, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat stud for stacked chip package
- Publication number 20060113663
- Publication date Jun 1, 2006
- Tsorng-Dih Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structural design for flip-chip assembly
- Publication number 20060063300
- Publication date Mar 23, 2006
- Tsorng-Dih Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader for non-uniform power dissipation
- Publication number 20060060952
- Publication date Mar 23, 2006
- Tsorng-Dih Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low dielectric semiconductor device and process for fabricating the...
- Publication number 20050227480
- Publication date Oct 13, 2005
- International Business Machines Corporation (IBM)
- Lawrence Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal enhanced extended surface tape for integrated circuit heat...
- Publication number 20050017350
- Publication date Jan 27, 2005
- International Business Machines Corporation
- William D. Corti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE WITH MULTIPLE COMPLIANT ELEMENTS
- Publication number 20040105234
- Publication date Jun 3, 2004
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for providing improved thermal conduction for...
- Publication number 20030189231
- Publication date Oct 9, 2003
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal enhanced extended surface tape for integrated circuit heat...
- Publication number 20020195228
- Publication date Dec 26, 2002
- International Business Machines Corporation
- William D. Corti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR PROVIDING IMPROVED THERMAL CONDUCTION FOR...
- Publication number 20020113288
- Publication date Aug 22, 2002
- LAWRENCE A. CLEVENGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for globally aligning the front and back sides...
- Publication number 20020096359
- Publication date Jul 25, 2002
- International Business Machines Corporation
- Louis L. Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip packaging system and method using deposited diamond film
- Publication number 20020089055
- Publication date Jul 11, 2002
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increased efficiency in liquid and gaseous planar device cooling te...
- Publication number 20020070006
- Publication date Jun 13, 2002
- Lawrence Shungwei Mok
- F28 - HEAT EXCHANGE IN GENERAL

Tsorng-Dih Yuan

Person

Patents Grantslast 30 patents

Heat stud for stacked chip package

Low dielectric semiconductor device and process for fabricating the...

Structural design for flip-chip assembly

Increased efficiency in liquid and gaseous planar device cooling te...

Method and structure for providing improved thermal conduction for...

Cooling device with multiple compliant elements

Semiconductor device utilizing alignment marks for globally alignin...

Chip packaging system and method using deposited diamond film

Chip packaging system and method using deposited diamond film

Bonded wafer structure having a buried insulation layer

Bonded wafer structure having a buried insulation layer

Patents Applicationslast 30 patents

Spacer Structures for Semiconductor Package Devices

Heat stud for stacked chip package

Structural design for flip-chip assembly

Heat spreader for non-uniform power dissipation

Low dielectric semiconductor device and process for fabricating the...

Thermal enhanced extended surface tape for integrated circuit heat...

COOLING DEVICE WITH MULTIPLE COMPLIANT ELEMENTS

Method and structure for providing improved thermal conduction for...

Thermal enhanced extended surface tape for integrated circuit heat...

METHOD AND STRUCTURE FOR PROVIDING IMPROVED THERMAL CONDUCTION FOR...

Method and apparatus for globally aligning the front and back sides...

Chip packaging system and method using deposited diamond film

Increased efficiency in liquid and gaseous planar device cooling te...