Claims
- 1. A semiconductor structure comprising:a first chip comprising at least one semiconductor component formed in a silicon substrate and having a first surface and a second surface; a first chip diamond layer disposed on said second surface; at least one connector formed at said second surface of said first chip; and a bonded structure having a first bonded structure surface bonded to said at least one connector and a second bonded structure surface.
- 2. The structure of claim 1 wherein said bonded structure additionally comprises a second bonded structure diamond layer disposed on said first bonded structure surface.
- 3. The structure of claim 2 wherein said bonded structure comprises at least one bonding site and wherein said second diamond layer comprises a conformal layer having a pattern of at least one hole for exposing said at least one bonding site.
- 4. The structure of claim 1 further comprising an intermediate diamond layer disposed between said first chip and said bonded structure.
- 5. The structure of claim 4 wherein said intermediate diamond layer additionally comprises a plurality of heat conduction channels disposed in said intermediate diamond layer.
- 6. The structure of claim 5 further comprising cooling fluid disposed in said heat conduction channels.
- 7. The structure of claim 2 further comprising an intermediate diamond layer disposed between said first chip and said bonded structure.
- 8. The structure of claim 7 wherein said intermediate diamond layer additionally comprises a plurality of heat conduction channels disposed in said intermediate diamond layer.
- 9. The structure of claim 8 further comprising cooling fluid disposed in said heat conduction channels.
- 10. The structure of claim 3 further comprising an intermediate diamond layer disposed between said first chip and said bonded structure.
- 11. The structure of claim 10 wherein said intermediate diamond layer additionally comprises a plurality of heat conduction channels disposed in said intermediate diamond layer.
- 12. The structure of claim 11 further comprising cooling fluid disposed in said heat conduction channels.
- 13. The structure of claim 1 wherein said at least one connector comprises a first plurality of electrical connectors and a second plurality of thermal connectors.
- 14. The structure of claim 1 wherein said at least one connector comprises at least two connectors and further comprising a second chip bonded to said first chip by at least one of said at least two connectors.
- 15. The structure of claim 1 further comprising a heat sink bonded to the second surface of said first chip.
- 16. The structure of claim 14 further comprising a heat sink bonded to the second surface of said first chip.
- 17. The structure of claim 16 wherein said bonded structure comprises at least one additional connector at its second bonded structure surface and further comprising a printed circuit card connected to said at least one additional connector.
CROSS REFERENCE TO RELATED APPLICATION
This application is related to U.S. patent application, Ser. No. 09/362,399, entitled “Method and Structure for Providing Improved Thermal Conduction for Silicon Semiconductor Devices”, which was filed on Jul. 28, 1999 and is assigned to the present assignee.
The present application is also related to U.S. patent application Ser. No. 09/006,575, of Joshi, et al, entitled “Embedded Thermal Conductors for Semiconductor Chips”, filed on Jan. 13, 1998 and currently under allowance, and its divisional case Ser. No. 09/296,846 filed Apr. 22, 1999, both of which are assigned to the present assignee.
US Referenced Citations (26)