Venkatesh Sundaram

Person

Norcross, GA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded semiconductor packages and methods thereof
- Patent number 12,027,453
- Issue date Jul 2, 2024
- Georgia Tech Research Corporation
- Nobuo Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-package-via (TPV) structures on inorganic interposer and me...
- Patent number 10,672,718
- Issue date Jun 2, 2020
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation process for semiconductor devices
- Patent number 10,615,057
- Issue date Apr 7, 2020
- Northrop Grumman Systems Corporation
- Leonard George Chorosinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with polymer-filled or polymer-lined optical through-via...
- Patent number 9,417,415
- Issue date Aug 16, 2016
- Georgia Tech Research Corporation
- Rao R. Tummala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-package-via (TPV) structures on inorganic interposer and me...
- Patent number 9,275,934
- Issue date Mar 1, 2016
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of making the same
- Patent number 9,173,282
- Issue date Oct 27, 2015
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin interposer assemblies with through vias
- Patent number 9,167,694
- Issue date Oct 20, 2015
- Georgia Tech Research Corporation
- Venkatesh V. Sundaram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress relieving second level interconnect structures and methods o...
- Patent number 8,970,036
- Issue date Mar 3, 2015
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect assemblies and methods of making and using same
- Patent number 8,633,601
- Issue date Jan 21, 2014
- Georgia Tech Research Corporation
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-last embedded interconnect structures
- Patent number 8,536,695
- Issue date Sep 17, 2013
- Georgia Tech Research Corporation
- Fuhan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film capacitor structures embedded in semiconductor packages a...
- Patent number 8,391,017
- Issue date Mar 5, 2013
- Georgia Tech Research Corporation
- David Ross McGregor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heterogeneous organic laminate stack ups for high frequency applica...
- Patent number 8,345,433
- Issue date Jan 1, 2013
- AVX Corporation
- George E. White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystalline polymer and multilayer polymer-based passive sig...
- Patent number 8,013,688
- Issue date Sep 6, 2011
- Georgia Tech Research Corporation
- George E. White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating three-dimensional all organic interconnect s...
- Patent number 7,805,834
- Issue date Oct 5, 2010
- Georgia Tech Research Corporation
- George E. White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystalline polymer and multilayer polymer-based passive sig...
- Patent number 7,795,995
- Issue date Sep 14, 2010
- Georgia Tech Research Corporation
- George E. White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for fabricating three-dimensional all organic interconnect...
- Patent number 7,260,890
- Issue date Aug 28, 2007
- Georgia Tech Research Corporation
- George E. White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated passive devices fabricated utilizing multi-layer, organi...
- Patent number 7,068,124
- Issue date Jun 27, 2006
- Georgia Tech Research Corporation
- George E. White
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stand-alone organic-based passive devices
- Patent number 6,987,307
- Issue date Jan 17, 2006
- Georgia Tech Research Corporation
- George E. White
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive devices fabricated utilizing multi-layer, organi...
- Patent number 6,900,708
- Issue date May 31, 2005
- Georgia Tech Research Corporation
- George E. White
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED SEMICONDUCTOR PACKAGES AND METHODS THEREOF
- Publication number 20240321703
- Publication date Sep 26, 2024
- Georgia Tech Research Corporation
- Novuo Ogura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFILTRATION AND DRYING UNDER PRESSURE FOR CONDUCTIVE POLYMER COATI...
- Publication number 20240312729
- Publication date Sep 19, 2024
- SARAS MICRO DEVICES, INC.
- JEN-CHWEN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM-BASED ANODE FOR LITHIUM-ION BATTERIES
- Publication number 20240282942
- Publication date Aug 22, 2024
- Novelis Inc.
- Matthew McDowell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM ANODE CURRENT COLLECTORS FOR LITHIUM ION BATTERIES
- Publication number 20230107273
- Publication date Apr 6, 2023
- Novelis Inc.
- Diptarka Majumdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED METAL FOIL CAPACITORS AND METHODS FOR MAKING SAME
- Publication number 20230073898
- Publication date Mar 9, 2023
- SARAS MICRO DEVICES, INC.
- Mehdi SHAFIEI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLANAR HIGH-DENSITY ALUMINUM CAPACITORS FOR STACKING AND EMBEDDING
- Publication number 20230067888
- Publication date Mar 2, 2023
- SARAS MICRO DEVICES, INC.
- Venkatesh SUNDARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR PACKAGES AND METHODS THEREOF
- Publication number 20220230948
- Publication date Jul 21, 2022
- Georgia Tech Research Corporation
- Nobuo OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTINUOUS COILS CONTAINING A THIN ANODIZED FILM LAYER AND SYSTEMS...
- Publication number 20200082972
- Publication date Mar 12, 2020
- Novelis Inc.
- Michael Jackson Bull
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND ME...
- Publication number 20160141257
- Publication date May 19, 2016
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-LEVEL ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURES FOR...
- Publication number 20160113108
- Publication date Apr 21, 2016
- Georgia Tech Research Corporation
- Venkatesh SUNDARAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL INTERCONNECTS AND METHODS OF FABRICATING SAME
- Publication number 20160109653
- Publication date Apr 21, 2016
- Georgia Tech Research Corporation
- William A. Vis
- G02 - OPTICS
Information Patent Application
NEW STRUCTURE OF MICROELECTRONIC PACKAGES WITH EDGE PROTECTION BY C...
- Publication number 20160111380
- Publication date Apr 21, 2016
- Georgia Tech Research Corporation
- Venkatesh SUNDARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Glass-Polymer Optical Interposer
- Publication number 20140355931
- Publication date Dec 4, 2014
- Georgia Tech Research Corporation
- Rao R. Tummala
- G02 - OPTICS
Information Patent Application
MAGNETIC DEVICE UTILIZING NANOCOMPOSITE FILMS LAYERED WITH ADHESIVES
- Publication number 20140347157
- Publication date Nov 27, 2014
- Georgia Tech Research Corporation
- Markondeya Raj Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Package-Via (TPV) Structures On Inorganic Interposer And Me...
- Publication number 20130119555
- Publication date May 16, 2013
- Georgia Tech Research Corporation
- Venkatesh Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME
- Publication number 20130107485
- Publication date May 2, 2013
- Georgia Tech Research Corporation
- Pulugurtha Markondeya Raj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH PACKAGE VIA STRUCTURES IN PANEL-BASED SILICON SUBSTRATES AN...
- Publication number 20120261805
- Publication date Oct 18, 2012
- Georgia Tech Research Corporation
- VENKATESH V. SUNDARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-LAST EMBEDDED INTERCONNECT STRUCTURES AND METHODS OF MAKING TH...
- Publication number 20120228754
- Publication date Sep 13, 2012
- Georgia Tech Research Corporation
- FUHAN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN INTERPOSER ASSEMBLIES WITH THROUGH VIAS
- Publication number 20120106117
- Publication date May 3, 2012
- Georgia Tech Research Corporation
- Venkatesh V. Sundaram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Crystalline Polymer and Multilayer Polymer-Based Passive Sig...
- Publication number 20110006861
- Publication date Jan 13, 2011
- Georgia Tech Research Corporation
- George E. White
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES A...
- Publication number 20100270646
- Publication date Oct 28, 2010
- GEORGIA TECH RESEARCH CORPORATION
- Cheong-Wo Hunter Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES A...
- Publication number 20100270645
- Publication date Oct 28, 2010
- GEORGIA TECH RESEARCH CORPORATION
- DAVID ROSS MCGREGOR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for Fabricating Three-Dimensional All Organic Interconnect...
- Publication number 20070267138
- Publication date Nov 22, 2007
- George E. White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid crystalline polymer and multilayer polymer-based passive sig...
- Publication number 20070085108
- Publication date Apr 19, 2007
- George E. White
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Heterogeneous organic laminate stack ups for high frequency applica...
- Publication number 20060017152
- Publication date Jan 26, 2006
- George E. White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated passive devices fabricated utilizing multi-layer, organi...
- Publication number 20050231304
- Publication date Oct 20, 2005
- Georgia Tech Research Corporation
- George E. White
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Integrated passive devices fabricated utilizing multi-layer, organi...
- Publication number 20040000968
- Publication date Jan 1, 2004
- George E. White
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Methods for fabricating three-dimensional all organic interconnect...
- Publication number 20040000425
- Publication date Jan 1, 2004
- George E. White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stand-alone organic-based passive devices
- Publication number 20040000701
- Publication date Jan 1, 2004
- George E. White
- H01 - BASIC ELECTRIC ELEMENTS

Venkatesh Sundaram

Person

Patents Grantslast 30 patents

Embedded semiconductor packages and methods thereof

Through-package-via (TPV) structures on inorganic interposer and me...

Encapsulation process for semiconductor devices

Interposer with polymer-filled or polymer-lined optical through-via...

Through-package-via (TPV) structures on inorganic interposer and me...

Interconnect structures and methods of making the same

Ultra-thin interposer assemblies with through vias

Stress relieving second level interconnect structures and methods o...

Interconnect assemblies and methods of making and using same

Chip-last embedded interconnect structures

Thin-film capacitor structures embedded in semiconductor packages a...

Heterogeneous organic laminate stack ups for high frequency applica...

Liquid crystalline polymer and multilayer polymer-based passive sig...

Method for fabricating three-dimensional all organic interconnect s...

Liquid crystalline polymer and multilayer polymer-based passive sig...

Methods for fabricating three-dimensional all organic interconnect...

Integrated passive devices fabricated utilizing multi-layer, organi...

Stand-alone organic-based passive devices

Integrated passive devices fabricated utilizing multi-layer, organi...

Patents Applicationslast 30 patents

EMBEDDED SEMICONDUCTOR PACKAGES AND METHODS THEREOF

INFILTRATION AND DRYING UNDER PRESSURE FOR CONDUCTIVE POLYMER COATI...

ALUMINUM-BASED ANODE FOR LITHIUM-ION BATTERIES

ALUMINUM ANODE CURRENT COLLECTORS FOR LITHIUM ION BATTERIES

MODIFIED METAL FOIL CAPACITORS AND METHODS FOR MAKING SAME

PLANAR HIGH-DENSITY ALUMINUM CAPACITORS FOR STACKING AND EMBEDDING

EMBEDDED SEMICONDUCTOR PACKAGES AND METHODS THEREOF

CONTINUOUS COILS CONTAINING A THIN ANODIZED FILM LAYER AND SYSTEMS...

THROUGH-PACKAGE-VIA (TPV) STRUCTURES ON INORGANIC INTERPOSER AND ME...

PACKAGE-LEVEL ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURES FOR...

OPTICAL INTERCONNECTS AND METHODS OF FABRICATING SAME

NEW STRUCTURE OF MICROELECTRONIC PACKAGES WITH EDGE PROTECTION BY C...

Glass-Polymer Optical Interposer

MAGNETIC DEVICE UTILIZING NANOCOMPOSITE FILMS LAYERED WITH ADHESIVES

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

Through-Package-Via (TPV) Structures On Inorganic Interposer And Me...

INTERCONNECT STRUCTURES AND METHODS OF MAKING THE SAME

THROUGH PACKAGE VIA STRUCTURES IN PANEL-BASED SILICON SUBSTRATES AN...

CHIP-LAST EMBEDDED INTERCONNECT STRUCTURES AND METHODS OF MAKING TH...

ULTRA-THIN INTERPOSER ASSEMBLIES WITH THROUGH VIAS

Liquid Crystalline Polymer and Multilayer Polymer-Based Passive Sig...

THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES A...

THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES A...

Methods for Fabricating Three-Dimensional All Organic Interconnect...

Liquid crystalline polymer and multilayer polymer-based passive sig...

Heterogeneous organic laminate stack ups for high frequency applica...

Integrated passive devices fabricated utilizing multi-layer, organi...

Integrated passive devices fabricated utilizing multi-layer, organi...

Methods for fabricating three-dimensional all organic interconnect...

Stand-alone organic-based passive devices