Wayne John Howell

Person

South Burlington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier for test, burn-in, and first level packaging
- Patent number 7,394,268
- Issue date Jul 1, 2008
- International Business Machines Corporation
- Claude L. Bertin
- G11 - INFORMATION STORAGE
Information Patent Grant
Carrier for test, burn-in, and first level packaging
- Patent number 7,132,841
- Issue date Nov 7, 2006
- International Business Machines Corporation
- Claude L. Bertin
- G11 - INFORMATION STORAGE
Information Patent Grant
Multi-chip stack and method of fabrication utilizing self-aligning...
- Patent number 6,921,018
- Issue date Jul 26, 2005
- International Business Machines Corporation
- Thomas George Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for dicing wafers, and semiconductor structures i...
- Patent number 6,915,795
- Issue date Jul 12, 2005
- International Business Machines Corporation
- Donald W. Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip stack and method of fabrication utilizing self-aligning...
- Patent number 6,858,941
- Issue date Feb 22, 2005
- International Business Machines Corporation
- Thomas George Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pad structure
- Patent number 6,806,578
- Issue date Oct 19, 2004
- International Business Machines Corporation
- Wayne J. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On chip alpha-particle detector
- Patent number 6,645,789
- Issue date Nov 11, 2003
- International Business Machines Corporation
- Kerry Bernstein
- G01 - MEASURING TESTING
Information Patent Grant
Chip-on-chip interconnections of varied characterstics
- Patent number 6,642,080
- Issue date Nov 4, 2003
- International Business Machines Corporation
- Thomas George Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip edge interconnect apparatus and method
- Patent number 6,611,050
- Issue date Aug 26, 2003
- International Business Machines Corporation
- Thomas G. Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond passivation pad connection using heated capillary
- Patent number 6,605,526
- Issue date Aug 12, 2003
- International Business Machines Corporation
- Wayne John Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and package including a chip having chamfer...
- Patent number 6,600,213
- Issue date Jul 29, 2003
- International Business Machines Corporation
- Donald W. Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for semiconductor testing using electrically cond...
- Patent number 6,559,666
- Issue date May 6, 2003
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
On chip alpha-particle detector
- Patent number 6,545,330
- Issue date Apr 8, 2003
- International Business Machines Corporation
- Kerry Bernstein
- G01 - MEASURING TESTING
Information Patent Grant
Micro-flex technology in semiconductor packages
- Patent number 6,455,778
- Issue date Sep 24, 2002
- International Business Machines Corporation
- Claude Louis Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-flex technology in semiconductor packages
- Patent number 6,444,490
- Issue date Sep 3, 2002
- International Business Machines Corporation
- Claude Louis Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for wafer level test and burn-in
- Patent number 6,426,904
- Issue date Jul 30, 2002
- International Business Machines Corporation
- John E. Barth
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming three-dimensional circuitization and circuits fo...
- Patent number 6,426,241
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-chip conductors for low inductance chip-to-chip integration...
- Patent number 6,410,431
- Issue date Jun 25, 2002
- International Business Machines Corporation
- Claude Louis Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rolling ball connector
- Patent number 6,358,627
- Issue date Mar 19, 2002
- International Business Machines Corporation
- Joseph A. Benenati
- G01 - MEASURING TESTING
Information Patent Grant
Micro-flex technology in semiconductor packages
- Patent number 6,300,687
- Issue date Oct 9, 2001
- International Business Machines Corporation
- Claude Louis Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly integrated chip-on-chip packaging
- Patent number 6,294,406
- Issue date Sep 25, 2001
- International Business Machines Corporation
- Claude Louis Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor testing using electrically conductive adhesives
- Patent number 6,288,559
- Issue date Sep 11, 2001
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for dicing wafers, and semiconductor structures i...
- Patent number 6,271,102
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Donald W. Brouillette
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and device for semiconductor testing using electrically cond...
- Patent number 6,268,739
- Issue date Jul 31, 2001
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Dual chip with heat sink
- Patent number 6,265,771
- Issue date Jul 24, 2001
- International Business Machines Corporation
- Thomas G. Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill preform interposer for joining chip to substrate
- Patent number 6,258,627
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Joseph A. Benenati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for wafer level test and burn-in
- Patent number 6,233,184
- Issue date May 15, 2001
- International Business Machines Corporation
- John E. Barth
- G01 - MEASURING TESTING
Information Patent Grant
Chip-on-chip interconnections of varied characteristics
- Patent number 6,225,699
- Issue date May 1, 2001
- International Business Machines Corporation
- Thomas George Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-chip conductors for low inductance chip-to-chip integration...
- Patent number 6,222,276
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Claude Louis Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rolling ball connector
- Patent number 6,177,729
- Issue date Jan 23, 2001
- International Business Machines Corporation
- Joseph A. Benenati
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CARRIER FOR TEST, BURN-IN, AND FIRST LEVEL PACKAGING
- Publication number 20070001708
- Publication date Jan 4, 2007
- International Business Machines Corporation
- Claude L. Bertin
- G01 - MEASURING TESTING
Information Patent Application
ULTRA-FINE CONTACT ALIGNMENT
- Publication number 20050161493
- Publication date Jul 28, 2005
- International Business Machines Corporation
- Thomas G. Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-FINE CONTACT ALIGNMENT
- Publication number 20050064697
- Publication date Mar 24, 2005
- International Business Machines Corporation
- Thomas G. Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip sack and method of fabrication utilizing self-aligning e...
- Publication number 20040108364
- Publication date Jun 10, 2004
- International Business Machines Corporation
- Thomas George Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for dicing wafers, and semiconductor structures i...
- Publication number 20030211707
- Publication date Nov 13, 2003
- Donald W. Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
On chip alpha-particle detector
- Publication number 20030020128
- Publication date Jan 30, 2003
- International Business Machines Corporation
- Kerry Bernstein
- G01 - MEASURING TESTING
Information Patent Application
Method for forming three-dimensional circuitization and circuits fo...
- Publication number 20020113324
- Publication date Aug 22, 2002
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip stack and method of fabrication utilizing self-aligning...
- Publication number 20020070438
- Publication date Jun 13, 2002
- Thomas George Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-fine contact alignment
- Publication number 20020068381
- Publication date Jun 6, 2002
- International Business Machines Corporation
- Thomas G. Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper pad structure
- Publication number 20020056910
- Publication date May 16, 2002
- Wayne J. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper pad structure
- Publication number 20010052644
- Publication date Dec 20, 2001
- International Business Machines Corporation
- Wayne J. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures for wafer level test and burn -in
- Publication number 20010046168
- Publication date Nov 29, 2001
- John E. Barth
- G01 - MEASURING TESTING
Information Patent Application
Micro-flex technology in semiconductor packages
- Publication number 20010039074
- Publication date Nov 8, 2001
- Claude Louis Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for semiconductor testing using electrically cond...
- Publication number 20010035759
- Publication date Nov 1, 2001
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Application
Micro-flex technology in semiconductor packages
- Publication number 20010035529
- Publication date Nov 1, 2001
- Claude Louis Bertin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for dicing wafers, and semiconductor structures i...
- Publication number 20010023979
- Publication date Sep 27, 2001
- Donald W. Brouvillette
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEMICONDUCTOR TESTING USING ELECTRICALLY CONDUCTIVE ADHESIVES
- Publication number 20010024127
- Publication date Sep 27, 2001
- WILLIAM E. BERNIER
- G01 - MEASURING TESTING
Information Patent Application
Rolling ball connector
- Publication number 20010002330
- Publication date May 31, 2001
- Joseph A. Benenati
- G01 - MEASURING TESTING
Information Patent Application
Through-chip conductors for low inductance chip-to-chip integration...
- Publication number 20010001292
- Publication date May 17, 2001
- Claude Louis Bertin
- H01 - BASIC ELECTRIC ELEMENTS

Wayne John Howell

Person

Patents Grantslast 30 patents

Carrier for test, burn-in, and first level packaging

Carrier for test, burn-in, and first level packaging

Multi-chip stack and method of fabrication utilizing self-aligning...

Method and system for dicing wafers, and semiconductor structures i...

Multi-chip stack and method of fabrication utilizing self-aligning...

Copper pad structure

On chip alpha-particle detector

Chip-on-chip interconnections of varied characterstics

Chip edge interconnect apparatus and method

Wirebond passivation pad connection using heated capillary

Semiconductor structure and package including a chip having chamfer...

Method and device for semiconductor testing using electrically cond...

On chip alpha-particle detector

Micro-flex technology in semiconductor packages

Micro-flex technology in semiconductor packages

Structures for wafer level test and burn-in

Method for forming three-dimensional circuitization and circuits fo...

Through-chip conductors for low inductance chip-to-chip integration...

Rolling ball connector

Micro-flex technology in semiconductor packages

Highly integrated chip-on-chip packaging

Semiconductor testing using electrically conductive adhesives

Method and system for dicing wafers, and semiconductor structures i...

Method and device for semiconductor testing using electrically cond...

Dual chip with heat sink

Underfill preform interposer for joining chip to substrate

Structures for wafer level test and burn-in

Chip-on-chip interconnections of varied characteristics

Through-chip conductors for low inductance chip-to-chip integration...

Rolling ball connector

Patents Applicationslast 30 patents

CARRIER FOR TEST, BURN-IN, AND FIRST LEVEL PACKAGING

ULTRA-FINE CONTACT ALIGNMENT

ULTRA-FINE CONTACT ALIGNMENT

Multi-chip sack and method of fabrication utilizing self-aligning e...

Method and system for dicing wafers, and semiconductor structures i...

On chip alpha-particle detector

Method for forming three-dimensional circuitization and circuits fo...

Multi-chip stack and method of fabrication utilizing self-aligning...

Ultra-fine contact alignment

Copper pad structure

Copper pad structure

Structures for wafer level test and burn -in

Micro-flex technology in semiconductor packages

Method and device for semiconductor testing using electrically cond...

Micro-flex technology in semiconductor packages

Method and system for dicing wafers, and semiconductor structures i...

SEMICONDUCTOR TESTING USING ELECTRICALLY CONDUCTIVE ADHESIVES

Rolling ball connector

Through-chip conductors for low inductance chip-to-chip integration...