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Weston C. Roth
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Portland, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Mainboard assembly including a package overlying a die directly att...
Patent number
10,555,417
Issue date
Feb 4, 2020
Intel Corporation
Damion Searls
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mainboard assembly including a package overlying a die directly att...
Patent number
10,251,273
Issue date
Apr 2, 2019
Intel Corporation
Damion Searls
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Apparatus and method for improving AC coupling on circuit boards
Patent number
7,495,318
Issue date
Feb 24, 2009
Intel Corporation
Weston Roth
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatuses and methods to route line to line
Patent number
7,361,988
Issue date
Apr 22, 2008
Intel Corporation
Thomas O. Morgan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Apparatus and method for improving coupling across plane discontinu...
Patent number
7,334,325
Issue date
Feb 26, 2008
Intel Corporation
Weston Roth
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for improving coupling across plane discontinuities on ci...
Patent number
7,282,647
Issue date
Oct 16, 2007
Intel Corporation
Weston Roth
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electro-optic surface mount light pipe and connector
Patent number
7,255,492
Issue date
Aug 14, 2007
Intel Corporation
Weston C. Roth
G02 - OPTICS
Information
Patent Grant
Surface mount solder method and apparatus for decoupling capacitanc...
Patent number
7,135,758
Issue date
Nov 14, 2006
Intel Corporation
Damion T. Searls
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ceramic embedded wireless antenna
Patent number
7,122,891
Issue date
Oct 17, 2006
Intel Corporation
Terrance Dishongh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for improving AC coupling on circuit boards
Patent number
6,905,979
Issue date
Jun 14, 2005
Intel Corporation
Weston Roth
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Socket with multiple contact pad area socket contacts
Patent number
6,884,087
Issue date
Apr 26, 2005
Intel Corporation
Damion Searls
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ganged land grid array socket contacts for improved power delivery
Patent number
6,793,503
Issue date
Sep 21, 2004
Intel Corporation
Terrance J. Dishongh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ganged land grid array socket contacts for improved power delivery
Patent number
6,793,505
Issue date
Sep 21, 2004
Intel Corporation
Terrance J. Dishongh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Surface mount solder method and apparatus for decoupling capacitanc...
Patent number
6,713,871
Issue date
Mar 30, 2004
Intel Corporation
Damion T. Searls
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD...
Publication number
20120224331
Publication date
Sep 6, 2012
Weston Roth
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Mainboard assembly including a package overlying a die directly att...
Publication number
20100061056
Publication date
Mar 11, 2010
Damion Searls
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Low profile solder grid array technology for printed circuit board...
Publication number
20090310320
Publication date
Dec 17, 2009
Weston Roth
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Surface Mount Components Joined Between a Package Substrate and a P...
Publication number
20090051004
Publication date
Feb 26, 2009
Weston C. Roth
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Apparatus and method for optical interconnects on a carrier substrate
Publication number
20060024060
Publication date
Feb 2, 2006
Weston C. Roth
G02 - OPTICS
Information
Patent Application
Electro-optic surface mount light pipe and connector
Publication number
20060024002
Publication date
Feb 2, 2006
Weston C. Roth
G02 - OPTICS
Information
Patent Application
Apparatus and method for improving AC coupling on circuit boards
Publication number
20050195579
Publication date
Sep 8, 2005
Intel Corporation
Weston Roth
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Apparatuses and methods to route line to line
Publication number
20050138592
Publication date
Jun 23, 2005
Thomas O. Morgan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Ceramic embedded wireless antenna
Publication number
20050134507
Publication date
Jun 23, 2005
Terrance Dishongh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and method for improving coupling across plane discontinu...
Publication number
20050082088
Publication date
Apr 21, 2005
Weston Roth
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electro-optic through-hole mount light pipe and connector
Publication number
20050068788
Publication date
Mar 31, 2005
Weston C. Roth
G02 - OPTICS
Information
Patent Application
SOCKET WITH MULTIPLE CONTACT PAD AREA SOCKET CONTACTS
Publication number
20050064739
Publication date
Mar 24, 2005
Damion Searls
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Surface mount solder method and apparatus for decoupling capacitanc...
Publication number
20040155335
Publication date
Aug 12, 2004
Intel Corporation
Damion T. Searls
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Apparatus and method for improving coupling across plane discontinu...
Publication number
20040118597
Publication date
Jun 24, 2004
Intel Corporation
Weston Roth
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Apparatus and method for improving AC coupling on circuit boards
Publication number
20040119147
Publication date
Jun 24, 2004
Intel Corporation
Weston Roth
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Surface mount solder method and apparatus for decoupling capacitanc...
Publication number
20030218235
Publication date
Nov 27, 2003
Intel Corporation
Damion T. Searls
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Ganged land grid array socket contacts for improved power delivery
Publication number
20030207598
Publication date
Nov 6, 2003
Terrance J. Dishongh
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Ganged land grid array socket contacts for improved power delivery
Publication number
20030186568
Publication date
Oct 2, 2003
Terrance J. Dishongh
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
METHOD AND APPARATUS FOR THERMALLY CONTROLLING MULTIPLE ELECTRONIC...
Publication number
20030117772
Publication date
Jun 26, 2003
Damion T. Searls
H01 - BASIC ELECTRIC ELEMENTS