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William J. Rudik
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Vestal, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of fabricating a BGA package having decreased adhesion
Patent number
7,615,477
Issue date
Nov 10, 2009
International Business Machines Corporation
John U. Knickerbocker
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making circuitized substrate with solder paste connections
Patent number
7,547,577
Issue date
Jun 16, 2009
Endicott Interconnect Technologies, Inc.
Norman A. Card
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Composite laminate circuit structure
Patent number
7,259,333
Issue date
Aug 21, 2007
International Business Machines Corporation
Robert Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for an organic package with improved BGA life
Patent number
7,148,566
Issue date
Dec 12, 2006
International Business Machines Corporation
John U. Knickerbocker
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing an electronic package possessing controlled im...
Patent number
6,845,557
Issue date
Jan 25, 2005
International Business Machines Corporation
Thomas R. Miller
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for reducing coefficient of thermal expansion in chip attach...
Patent number
6,841,026
Issue date
Jan 11, 2005
International Business Machines Corporation
Lawrence Robert Blumberg
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of fabricating a laminate circuit structure
Patent number
6,834,426
Issue date
Dec 28, 2004
International Business Machines Corporation
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit boards for electronic device packages having glass...
Patent number
6,781,064
Issue date
Aug 24, 2004
International Business Machines Corporation
Bernd K. Appelt
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process of fabricating a circuitized structure
Patent number
6,739,048
Issue date
May 25, 2004
International Business Machines Corporation
Gerald Walter Jones
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrical coupling of a stiffener to a chip carrier
Patent number
6,699,736
Issue date
Mar 2, 2004
International Business Machines Corporation
Terry J. Dornbos
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
LCD cover optical structure and method
Patent number
6,639,638
Issue date
Oct 28, 2003
International Business Machines Corporation
Ramesh R. Kodnani
G02 - OPTICS
Information
Patent Grant
Method for reducing coefficient of thermal expansion in chip attach...
Patent number
6,586,352
Issue date
Jul 1, 2003
International Business Machines Corporation
Lawrence Robert Blumberg
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrical coupling of a stiffener to a chip carrier
Patent number
6,534,848
Issue date
Mar 18, 2003
International Business Machines Corporation
Terry J. Dornbos
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Structure for high speed printed wiring boards with multiple differ...
Patent number
6,469,256
Issue date
Oct 22, 2002
International Business Machines Corporation
Thomas R. Miller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit package having low modulus, conformal mounting pads
Patent number
6,399,896
Issue date
Jun 4, 2002
International Business Machines Corporation
Frank J. Downes
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for reducing coefficient of thermal expansion in chip attach...
Patent number
6,387,830
Issue date
May 14, 2002
International Business Machines Corporation
Lawrence Robert Blumberg
B32 - LAYERED PRODUCTS
Information
Patent Grant
Flip chip assembly
Patent number
6,348,738
Issue date
Feb 19, 2002
International Business Machines Corporation
Jean Dery
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a flip chip assembly, and a flip chip assembly fo...
Patent number
6,306,683
Issue date
Oct 23, 2001
International Business Machines Corporation
Jean Dery
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for reducing coefficient of thermal expansion in chip attach...
Patent number
6,136,733
Issue date
Oct 24, 2000
International Business Machines Corporation
Lawrence Robert Blumberg
B32 - LAYERED PRODUCTS
Information
Patent Grant
Integrated manufacturing packaging process
Patent number
6,131,279
Issue date
Oct 17, 2000
International Business Machines Corporation
Gerald Walter Jones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Technique for forming resin-impregnated fiberglass sheets with impr...
Patent number
6,096,665
Issue date
Aug 1, 2000
International Business Machines Corporation
Bernd Karl Appelt
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of forming a flip chip assembly
Patent number
6,074,895
Issue date
Jun 13, 2000
International Business Machines Corporation
Jean Dery
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device packages having glass free non conductive layers
Patent number
5,981,880
Issue date
Nov 9, 1999
International Business Machines Corporation
Bernd Karl-Heinz Appelt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and process for improved die adhesion to organic chip car...
Patent number
5,955,782
Issue date
Sep 21, 1999
International Business Machines Corporation
Stephen John Kosteva
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Technique for forming resin-impregnated fiberglass sheets using mul...
Patent number
5,919,525
Issue date
Jul 6, 1999
International Business Macjines Coporation
Bernd Karl Appelt
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Technique for forming resin-impregnated fiberglass sheets using mul...
Patent number
5,874,370
Issue date
Feb 23, 1999
International Business Machines Corporation
Bernd Karl Appelt
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Technique for forming resin-impregnated fiberglass sheets with impr...
Patent number
5,871,819
Issue date
Feb 16, 1999
International Business Machines Corporation
Bernd Karl Appelt
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Technique for forming resin-impregnated fiberglass sheets using mul...
Patent number
5,866,203
Issue date
Feb 2, 1999
International Business Machines Corporation
Bernd Karl Appelt
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Technique for forming resin-impregnated fiberglass sheets with impr...
Patent number
5,858,461
Issue date
Jan 12, 1999
International Business Machines Corporation
Bernd Karl Appelt
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Technique for forming resin-impregnated fiberglass sheets using mul...
Patent number
5,780,366
Issue date
Jul 14, 1998
International Business Machines Corporation
Bernd Karl Appelt
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
Method of making circuitized substrate with solder paste connections
Publication number
20080110016
Publication date
May 15, 2008
Endicott Interconnect Technologies, Inc.
Norman A. Card
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and Structure for an Organic Package with Improved BGA Life
Publication number
20070099342
Publication date
May 3, 2007
John U. Knickerbocker
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COMPOSITE LAMINATE CIRCUIT STRUCTURE
Publication number
20050048408
Publication date
Mar 3, 2005
International Business Machines Corporation
Robert M. Japp
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electrical coupling of a stiffener to a chip carrier
Publication number
20030082853
Publication date
May 1, 2003
Terry J. Dornbos
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for reducing coefficient of thermal expansion in chip attach...
Publication number
20030000081
Publication date
Jan 2, 2003
International Business Machines Corporation
Lawrence Robert Blumberg
B32 - LAYERED PRODUCTS
Information
Patent Application
Structure for high speed printed wiring boards with multiple differ...
Publication number
20020189094
Publication date
Dec 19, 2002
International Business Machines Corporation
Thomas R. Miller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and structure for an organic package with improved BGA life
Publication number
20020137256
Publication date
Sep 26, 2002
International Business Machines Corporation
John U. Knickerbocker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS OF FABRICATING A CIRCUITZED STRUCTURE
Publication number
20020078562
Publication date
Jun 27, 2002
Gerald Walter Jones
H01 - BASIC ELECTRIC ELEMENTS