William Paul Mazotti

Person

San Martin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical sub-assembly packaging techniques that incorporate optical...
- Patent number 7,431,516
- Issue date Oct 7, 2008
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Grant
Two-layer electrical substrate for optical devices
- Patent number 7,432,575
- Issue date Oct 7, 2008
- National Semiconductor Corporation
- Neeraj Anil Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic optical sub-assembly for optoelectronic modules
- Patent number 7,269,027
- Issue date Sep 11, 2007
- National Semiconductor Corporation
- Jia Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for joining an opto-electronic module to a semiconductor...
- Patent number 7,247,942
- Issue date Jul 24, 2007
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for joining an opto-electronic module to a semiconductor...
- Patent number 7,199,440
- Issue date Apr 3, 2007
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for protecting photonic devices in optoelectronic package...
- Patent number 7,195,955
- Issue date Mar 27, 2007
- National Semiconductor Corporation
- Luu Thanh Nguyen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Opto-electronic module form factor having adjustable optical plane...
- Patent number 7,156,562
- Issue date Jan 2, 2007
- National Semiconductor Corporation
- William Paul Mazotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical sub-assembly for opto-electronic modules
- Patent number 7,086,788
- Issue date Aug 8, 2006
- National Semiconductor Corporation
- William Paul Mazotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical sub-assembly packaging techniques that incorporate optical...
- Patent number 7,073,961
- Issue date Jul 11, 2006
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Grant
Ceramic optical sub-assembly for optoelectronic modules
- Patent number 7,023,705
- Issue date Apr 4, 2006
- National Semiconductor Corporation
- Jia Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for protecting photonic devices in optoelectronic package...
- Patent number 7,001,083
- Issue date Feb 21, 2006
- National Semiconductor Corporation
- Luu Thanh Nguyen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Techniques for manufacturing flash-free contacts on a semiconductor...
- Patent number 6,989,122
- Issue date Jan 24, 2006
- National Semiconductor Corporation
- Ken Pham
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multi-purpose optical light pipe
- Patent number 6,985,668
- Issue date Jan 10, 2006
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Grant
Techniques for attaching rotated photonic devices to an optical sub...
- Patent number 6,973,225
- Issue date Dec 6, 2005
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sub-assembly for optoelectronic modules
- Patent number 6,916,121
- Issue date Jul 12, 2005
- National Semiconductor Corporation
- William Paul Mazotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical sub-assembly packaging techniques that incorporate optical...
- Patent number 6,863,450
- Issue date Mar 8, 2005
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Grant
Techniques for joining an opto-electronic module to a semiconductor...
- Patent number 6,858,468
- Issue date Feb 22, 2005
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for joining an opto-electronic module to a semiconductor...
- Patent number 6,838,317
- Issue date Jan 4, 2005
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Miniature form-factor connecter for fiber optic modules
- Patent number 6,830,382
- Issue date Dec 14, 2004
- National Semiconductor Corporation
- Peter Deane
- G02 - OPTICS
Information Patent Grant
Electrical connector for opto-electronic modules
- Patent number 6,802,654
- Issue date Oct 12, 2004
- National Semiconductor Corporation
- Bruce C. Roberts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-layer electrical substrate for optical devices
- Patent number 6,765,275
- Issue date Jul 20, 2004
- National Semiconductor Corporation
- Neeraj Anil Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for electro-optical packages that facilitate t...
- Patent number 6,749,345
- Issue date Jun 15, 2004
- National Semiconductor Corporation
- Stephen Andrew Gee
- G02 - OPTICS
Information Patent Grant
Optoelectronic package with dam structure to provide fiber standoff
- Patent number 6,655,854
- Issue date Dec 2, 2003
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for joining an opto-electronic module to a semiconductor...
- Patent number 6,642,613
- Issue date Nov 4, 2003
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for maintaining parallelism between optical and chip sub...
- Patent number 6,628,000
- Issue date Sep 30, 2003
- National Semiconductor Corporation
- Ken Pham
- G02 - OPTICS
Information Patent Grant
Miniature semiconductor package for opto-electronic devices
- Patent number 6,624,507
- Issue date Sep 23, 2003
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic package with controlled fiber standoff
- Patent number 6,595,699
- Issue date Jul 22, 2003
- National Semiconductor Corporation
- Luu Thanh Nguyen
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Optical sub-assembly packaging techniques that incorporate optical...
- Publication number 20070071391
- Publication date Mar 29, 2007
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Application
Ceramic optical sub-assembly for optoelectronic modules
- Publication number 20060140534
- Publication date Jun 29, 2006
- National Semiconductor Corporation
- Jia Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having flash-free contacts and techniques for...
- Publication number 20060055080
- Publication date Mar 16, 2006
- National Semiconductor Corporation
- Ken Pham
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Technique for protecting photonic devices in optoelectronic package...
- Publication number 20060001183
- Publication date Jan 5, 2006
- National Semiconductor Corporation, A Delaware Corp.
- Luu Thanh Nguyen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Optical sub-assembly for opto-electronic modules
- Publication number 20050175297
- Publication date Aug 11, 2005
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Application
Optical sub-assembly packaging techniques that incorporate optical...
- Publication number 20050157990
- Publication date Jul 21, 2005
- National Semiconductor Corporation, a Delaware Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Application
Techniques for joining an opto-electronic module to a semiconductor...
- Publication number 20050117835
- Publication date Jun 2, 2005
- National Semiconductor Corporation, A Delaware Corp.
- Luu Thanh Nguyen
- G02 - OPTICS
Information Patent Application
Techniques for joining an opto-electronic module to a semiconductor...
- Publication number 20050100294
- Publication date May 12, 2005
- National Semiconductor Corporation
- Luu Thanh Nguyen
- G02 - OPTICS
Information Patent Application
Opto-electronic module form factor having adjustable optical plane...
- Publication number 20050013560
- Publication date Jan 20, 2005
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Application
Multi-purpose optical light pipe
- Publication number 20050013581
- Publication date Jan 20, 2005
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Application
Two-layer electrical substrate for optical devices
- Publication number 20040216918
- Publication date Nov 4, 2004
- National Semiconductor Corporation, A Delaware Corp.
- Neeraj Anil Pendse
- G02 - OPTICS
Information Patent Application
Optical sub-assembly packaging techniques that incorporate optical...
- Publication number 20040109649
- Publication date Jun 10, 2004
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Application
Techniques for joining an opto-electronic module to a semiconductor...
- Publication number 20040048417
- Publication date Mar 11, 2004
- National Semiconductor Corporation, A Delaware Corp.
- Luu Thanh Nguyen
- G02 - OPTICS
Information Patent Application
Techniques for joining an opto-electronic module to a semiconductor...
- Publication number 20030189214
- Publication date Oct 9, 2003
- National Semiconductor Corporation, A Delaware Corp.
- Luu Thanh Nguyen
- G02 - OPTICS
Information Patent Application
Techniques for attaching rotated photonic devices to an optical sub...
- Publication number 20030057535
- Publication date Mar 27, 2003
- National Semiconductor Corporation
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical sub-assembly for optoelectronic modules
- Publication number 20030026556
- Publication date Feb 6, 2003
- National Semiconductor Corporation
- William Paul Mazotti
- G02 - OPTICS
Information Patent Application
Ceramic optical sub-assembly for optoelectronic modules
- Publication number 20030026081
- Publication date Feb 6, 2003
- National Semiconductor Corporation
- Jia Liu
- G02 - OPTICS

William Paul Mazotti

Person

Patents Grantslast 30 patents

Optical sub-assembly packaging techniques that incorporate optical...

Two-layer electrical substrate for optical devices

Ceramic optical sub-assembly for optoelectronic modules

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for joining an opto-electronic module to a semiconductor...

Technique for protecting photonic devices in optoelectronic package...

Opto-electronic module form factor having adjustable optical plane...

Optical sub-assembly for opto-electronic modules

Optical sub-assembly packaging techniques that incorporate optical...

Ceramic optical sub-assembly for optoelectronic modules

Technique for protecting photonic devices in optoelectronic package...

Techniques for manufacturing flash-free contacts on a semiconductor...

Multi-purpose optical light pipe

Techniques for attaching rotated photonic devices to an optical sub...

Optical sub-assembly for optoelectronic modules

Optical sub-assembly packaging techniques that incorporate optical...

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for joining an opto-electronic module to a semiconductor...

Miniature form-factor connecter for fiber optic modules

Electrical connector for opto-electronic modules

Two-layer electrical substrate for optical devices

Apparatus and method for electro-optical packages that facilitate t...

Optoelectronic package with dam structure to provide fiber standoff

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for maintaining parallelism between optical and chip sub...

Miniature semiconductor package for opto-electronic devices

Optoelectronic package with controlled fiber standoff

Patents Applicationslast 30 patents

Optical sub-assembly packaging techniques that incorporate optical...

Ceramic optical sub-assembly for optoelectronic modules

Semiconductor package having flash-free contacts and techniques for...

Technique for protecting photonic devices in optoelectronic package...

Optical sub-assembly for opto-electronic modules

Optical sub-assembly packaging techniques that incorporate optical...

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for joining an opto-electronic module to a semiconductor...

Opto-electronic module form factor having adjustable optical plane...

Multi-purpose optical light pipe

Two-layer electrical substrate for optical devices

Optical sub-assembly packaging techniques that incorporate optical...

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for joining an opto-electronic module to a semiconductor...

Techniques for attaching rotated photonic devices to an optical sub...

Optical sub-assembly for optoelectronic modules

Ceramic optical sub-assembly for optoelectronic modules