Xiang Li

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ball grid array card edge connector
- Patent number 12,341,279
- Issue date Jun 24, 2025
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DIMM retention assembly for compression mount technology and land g...
- Patent number 12,334,674
- Issue date Jun 17, 2025
- Intel Corporation
- Xiang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
DIMM socket with seating floor to meet both longer length edge cont...
- Patent number 12,315,587
- Issue date May 27, 2025
- Intel Corporation
- Xiang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual in-line memory module (DIMM) socket that prevents improper DIM...
- Patent number 12,300,931
- Issue date May 13, 2025
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Closed loop compressed connector pin
- Patent number 12,294,167
- Issue date May 6, 2025
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid pitch through hole connector
- Patent number 12,267,957
- Issue date Apr 1, 2025
- Intel Corporation
- Xiang Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Device-to-device connection with multiple parallel ground pins
- Patent number 12,237,620
- Issue date Feb 25, 2025
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced vertical profile ejector for liquid cooled modules
- Patent number 12,144,110
- Issue date Nov 12, 2024
- Intel Corporation
- Guixiang Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector with staggered pin orientation
- Patent number 12,040,568
- Issue date Jul 16, 2024
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retention latch with spring mechanism
- Patent number 11,984,685
- Issue date May 14, 2024
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector retention mechanism for improved structural reliability
- Patent number 11,587,597
- Issue date Feb 21, 2023
- Intel Corporation
- Xiang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual in-line memory module (DIMM) socket circuit to detect improper...
- Patent number 11,588,279
- Issue date Feb 21, 2023
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual in-line memory modules (DIMM) connector towers with removable...
- Patent number 11,228,126
- Issue date Jan 18, 2022
- Intel Corporation
- Guixiang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete circuit having cross-talk noise cancellation circuitry and...
- Patent number 11,116,072
- Issue date Sep 7, 2021
- Intel Corporation
- Jun Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Connector with active circuit
- Patent number 10,965,047
- Issue date Mar 30, 2021
- Intel Corporation
- Jong-Ru Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module connector, memory module, and pivotable latch
- Patent number 10,950,958
- Issue date Mar 16, 2021
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packed interconnect structure with reduced cross coupled noise
- Patent number 10,950,536
- Issue date Mar 16, 2021
- Intel Corporation
- Zhen Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Snap-on electromagnetic interference (EMI)-shielding without mother...
- Patent number 10,938,161
- Issue date Mar 2, 2021
- Intel Corporation
- Jaejin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk reducing connector pin geometry
- Patent number 10,923,859
- Issue date Feb 16, 2021
- Intel Corporation
- Jaejin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retention of dual in-line memory modules
- Patent number 10,888,010
- Issue date Jan 5, 2021
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector with relaxation mechanism for latch
- Patent number 10,790,603
- Issue date Sep 29, 2020
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shielding having a magnetically attrac...
- Patent number 10,736,246
- Issue date Aug 4, 2020
- Apple Inc.
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device, system and method to mitigate signal noise in communication...
- Patent number 10,729,002
- Issue date Jul 28, 2020
- Intel Corporation
- Jun Liao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Connector with anchoring power pin
- Patent number 10,727,618
- Issue date Jul 28, 2020
- Intel Corporation
- Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB) with three-dimensional interconnects to...
- Patent number 10,617,000
- Issue date Apr 7, 2020
- Intel Corporation
- Daqiao Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal solution on latch for sodimm connector
- Patent number 10,553,974
- Issue date Feb 4, 2020
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory channel having more than one DIMM per motherboard DIMM conne...
- Patent number 10,467,160
- Issue date Nov 5, 2019
- Intel Corporation
- Xiang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory device with insertable portion
- Patent number 10,342,132
- Issue date Jul 2, 2019
- Intel Corporation
- Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive structures for crosstalk reduction
- Patent number 10,317,932
- Issue date Jun 11, 2019
- Intel Corporation
- Zhichao Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connector design for high density platforms
- Patent number 10,305,207
- Issue date May 28, 2019
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTIPLE SLOT CARD EDGE CONNECTOR
- Publication number 20250141134
- Publication date May 1, 2025
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULES AND SOCKETS
- Publication number 20250126714
- Publication date Apr 17, 2025
- Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tall DIMM Structural Retention
- Publication number 20250071924
- Publication date Feb 27, 2025
- Intel Corporation
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUES FOR A MODULE CONNECTOR DESIGN TO IMPROVE PIN CONNECTION
- Publication number 20240421516
- Publication date Dec 19, 2024
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...
- Publication number 20240397628
- Publication date Nov 28, 2024
- Intel Corporation
- Landon HANKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMM CONNECTOR PIN WITH MULTI-SPRING (DUAL BEND DIRECTION) LEVERS
- Publication number 20240364037
- Publication date Oct 31, 2024
- Intel Corporation
- Landon HANKS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMM COOLING ASSEMBLIES
- Publication number 20240260233
- Publication date Aug 1, 2024
- Intel Corporation
- Ming Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL IN-LINE MEMORY MODULE RETAINER
- Publication number 20240242740
- Publication date Jul 18, 2024
- Intel Corporation
- Phil GENG
- G11 - INFORMATION STORAGE
Information Patent Application
CONNECTOR PINS FOR REDUCING CROSSTALK
- Publication number 20240145996
- Publication date May 2, 2024
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERPOSERS WITH MODULAR MEMORY UNITS
- Publication number 20240080988
- Publication date Mar 7, 2024
- Intel Corporation
- Todd A. HINCK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid-Proof Edge Connector Designs for Immersion Cooling
- Publication number 20230318211
- Publication date Oct 5, 2023
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL IN-LINE MEMORY MODULE COVER
- Publication number 20230273654
- Publication date Aug 31, 2023
- Intel Corporation
- Xiang LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COIL STRUCTURE TO CONTROL VIA IMPEDANCE
- Publication number 20230137619
- Publication date May 4, 2023
- Intel Corporation
- Landon HANKS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIMM COOLING ASSEMBLY WITH HEAT SPREADER ANTI-ROTATION MECHANISM
- Publication number 20230092972
- Publication date Mar 23, 2023
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LGA SOCKET PINS FOR IMPROVED DIFFERENTIAL SIGNALING PERFORMANCE
- Publication number 20230046581
- Publication date Feb 16, 2023
- Xiang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-CHANNEL MEMORY MODULE
- Publication number 20230044892
- Publication date Feb 9, 2023
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS
- Publication number 20230006374
- Publication date Jan 5, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ON PACKAGE (MOP) WITH REVERSE CAMM (COMPRESSION ATTACHED MEM...
- Publication number 20230005882
- Publication date Jan 5, 2023
- Intel Corporation
- George VERGIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GDDR MEMORY EXPANDER USING CMT CONNECTOR
- Publication number 20230007775
- Publication date Jan 5, 2023
- Intel Corporation
- Xiang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRACE DESIGN TO REDUCE THE CONNECTOR CROSSTALK
- Publication number 20220418090
- Publication date Dec 29, 2022
- Intel Corporation
- Landon HANKS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTER CARD WITH COMPRESSION ATTACHED MEMORY MODULES
- Publication number 20220368047
- Publication date Nov 17, 2022
- Intel Corporation
- George VERGIS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY MODULE ADAPTER CARD WITH MULTIPLEXER CIRCUITRY
- Publication number 20220358072
- Publication date Nov 10, 2022
- Intel Corporation
- George VERGIS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIFFERENTIAL I/O CARD USING CMT CONNECTOR
- Publication number 20220360002
- Publication date Nov 10, 2022
- Intel Corporation
- Xiang LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER CONVERSION MODULE USING CMT CONNECTOR
- Publication number 20220361328
- Publication date Nov 10, 2022
- Intel Corporation
- Xiang LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKABLE MEMORY MODULE WITH DOUBLE-SIDED COMPRESSION CONTACT PADS
- Publication number 20220353991
- Publication date Nov 3, 2022
- Intel Corporation
- Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GOLD FINGER DESIGN FOR DIFFERENTIAL EDGE CARDS
- Publication number 20220336986
- Publication date Oct 20, 2022
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal Serial Bus (USB) cable paddle card design for wire termin...
- Publication number 20220337004
- Publication date Oct 20, 2022
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CABLE STRUCTURE AND WIRE TERMINATION
- Publication number 20220336989
- Publication date Oct 20, 2022
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD TO REDUCE FAR END CROSS TALK
- Publication number 20220304142
- Publication date Sep 22, 2022
- Intel Corporation
- Xiang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED SOCKET PIN FOR DEVICE-TO-DEVICE CONNECTION
- Publication number 20220263262
- Publication date Aug 18, 2022
- Intel Corporation
- Landon HANKS
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Ball grid array card edge connector

DIMM retention assembly for compression mount technology and land g...

DIMM socket with seating floor to meet both longer length edge cont...

Dual in-line memory module (DIMM) socket that prevents improper DIM...

Closed loop compressed connector pin

Hybrid pitch through hole connector

Device-to-device connection with multiple parallel ground pins

Reduced vertical profile ejector for liquid cooled modules

Connector with staggered pin orientation

Retention latch with spring mechanism

Connector retention mechanism for improved structural reliability

Dual in-line memory module (DIMM) socket circuit to detect improper...

Dual in-line memory modules (DIMM) connector towers with removable...

Discrete circuit having cross-talk noise cancellation circuitry and...

Connector with active circuit

Memory module connector, memory module, and pivotable latch

Packed interconnect structure with reduced cross coupled noise

Snap-on electromagnetic interference (EMI)-shielding without mother...

Crosstalk reducing connector pin geometry

Retention of dual in-line memory modules

Connector with relaxation mechanism for latch

Electromagnetic interference shielding having a magnetically attrac...

Device, system and method to mitigate signal noise in communication...

Connector with anchoring power pin

Printed circuit board (PCB) with three-dimensional interconnects to...

Thermal solution on latch for sodimm connector

Memory channel having more than one DIMM per motherboard DIMM conne...

Memory device with insertable portion

Capacitive structures for crosstalk reduction

Connector design for high density platforms

Patents Applicationslast 30 patents

MULTIPLE SLOT CARD EDGE CONNECTOR

MEMORY MODULES AND SOCKETS

Tall DIMM Structural Retention

TECHNIQUES FOR A MODULE CONNECTOR DESIGN TO IMPROVE PIN CONNECTION

CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...

CAMM CONNECTOR PIN WITH MULTI-SPRING (DUAL BEND DIRECTION) LEVERS

DIMM COOLING ASSEMBLIES

DUAL IN-LINE MEMORY MODULE RETAINER

CONNECTOR PINS FOR REDUCING CROSSTALK

HIGH DENSITY INTERPOSERS WITH MODULAR MEMORY UNITS

Liquid-Proof Edge Connector Designs for Immersion Cooling

DUAL IN-LINE MEMORY MODULE COVER

COIL STRUCTURE TO CONTROL VIA IMPEDANCE

DIMM COOLING ASSEMBLY WITH HEAT SPREADER ANTI-ROTATION MECHANISM

LGA SOCKET PINS FOR IMPROVED DIFFERENTIAL SIGNALING PERFORMANCE

MULTI-CHANNEL MEMORY MODULE

MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS

MEMORY ON PACKAGE (MOP) WITH REVERSE CAMM (COMPRESSION ATTACHED MEM...

GDDR MEMORY EXPANDER USING CMT CONNECTOR

TRACE DESIGN TO REDUCE THE CONNECTOR CROSSTALK

ADAPTER CARD WITH COMPRESSION ATTACHED MEMORY MODULES

MEMORY MODULE ADAPTER CARD WITH MULTIPLEXER CIRCUITRY

DIFFERENTIAL I/O CARD USING CMT CONNECTOR

POWER CONVERSION MODULE USING CMT CONNECTOR

STACKABLE MEMORY MODULE WITH DOUBLE-SIDED COMPRESSION CONTACT PADS

GOLD FINGER DESIGN FOR DIFFERENTIAL EDGE CARDS

Universal Serial Bus (USB) cable paddle card design for wire termin...

HIGH DENSITY CABLE STRUCTURE AND WIRE TERMINATION

CIRCUIT BOARD TO REDUCE FAR END CROSS TALK

SHIELDED SOCKET PIN FOR DEVICE-TO-DEVICE CONNECTION