Yoichi Kubota

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic interconnect element with decreased conductor spacing
- Patent number 9,856,135
- Issue date Jan 2, 2018
- Invensas Corporation
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic interconnect element with decreased conductor spacing
- Patent number 9,524,947
- Issue date Dec 20, 2016
- Invensas Corporation
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making a microelectronic interconnect element with decrea...
- Patent number 8,900,464
- Issue date Dec 2, 2014
- Invensas Corporation
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fine pitch microcontacts and method for forming thereof
- Patent number 8,641,913
- Issue date Feb 4, 2014
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a connection component with posts and pads
- Patent number 8,604,348
- Issue date Dec 10, 2013
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic interconnect element with decreased conductor spacing
- Patent number 8,461,460
- Issue date Jun 11, 2013
- Invensas Corporation
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 8,329,581
- Issue date Dec 11, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a connection component with posts and pads
- Patent number 8,046,912
- Issue date Nov 1, 2011
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 7,999,397
- Issue date Aug 16, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of mountable capped chips
- Patent number 7,754,537
- Issue date Jul 13, 2010
- Tessera, Inc.
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectonic packages and methods therefor
- Patent number 7,745,943
- Issue date Jun 29, 2010
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a flexible microelectronic assembly and a method of f...
- Patent number 7,659,617
- Issue date Feb 9, 2010
- Tessera, Inc.
- Teck-Gyu Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 7,554,206
- Issue date Jun 30, 2009
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Grant
Components with posts and pads
- Patent number 7,495,179
- Issue date Feb 24, 2009
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacture of mountable capped chips
- Patent number 7,462,932
- Issue date Dec 9, 2008
- Tessera, Inc.
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 7,453,157
- Issue date Nov 18, 2008
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages and methods therefor
- Patent number 7,176,043
- Issue date Feb 13, 2007
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Grant
High frequency chip packages with connecting elements
- Patent number 7,176,506
- Issue date Feb 13, 2007
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having stacked semiconductor chips and methods of making...
- Patent number 7,071,547
- Issue date Jul 4, 2006
- Tessera, Inc.
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING
- Publication number 20170096329
- Publication date Apr 6, 2017
- Invensas Corporation
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING
- Publication number 20150087146
- Publication date Mar 26, 2015
- Invensas Corporation
- Chang Myung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection Component with Posts and Pads
- Publication number 20140262460
- Publication date Sep 18, 2014
- Tessera, Inc.
- YOICHI KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF
- Publication number 20140145329
- Publication date May 29, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Making a Microelectronic Interconnect Element With Decrea...
- Publication number 20130341299
- Publication date Dec 26, 2013
- Chang Myung RYU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20110269272
- Publication date Nov 3, 2011
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS
- Publication number 20110260320
- Publication date Oct 27, 2011
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS THEREFOR
- Publication number 20100258956
- Publication date Oct 14, 2010
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic interconnect element with decreased conductor spacing
- Publication number 20100009554
- Publication date Jan 14, 2010
- Tessera, Inc.
- Chang Myung Ryu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Components with posts and pads
- Publication number 20090133254
- Publication date May 28, 2009
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate for a flexible microelectronic assembly and a method of f...
- Publication number 20080128886
- Publication date Jun 5, 2008
- Tessera, Inc.
- Teck-Gyu Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fine pitch microcontacts and method for forming thereof
- Publication number 20080003402
- Publication date Jan 3, 2008
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20070205496
- Publication date Sep 6, 2007
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency chip packages with connecting elements
- Publication number 20070096160
- Publication date May 3, 2007
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture of mountable capped chips
- Publication number 20070096296
- Publication date May 3, 2007
- Tessera, Inc.
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20070077677
- Publication date Apr 5, 2007
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Application
Molding method for foldover package
- Publication number 20060223227
- Publication date Oct 5, 2006
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Components with posts and pads
- Publication number 20050284658
- Publication date Dec 29, 2005
- Tessera, Inc.
- Yoichi Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20050285246
- Publication date Dec 29, 2005
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189622
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaged acoustic and electromagnetic transducer chips
- Publication number 20050189635
- Publication date Sep 1, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectronic packages and methods therefor
- Publication number 20050181544
- Publication date Aug 18, 2005
- Tessera, Inc.
- Belgacem Haba
- G01 - MEASURING TESTING
Information Patent Application
Manufacture of mountable capped chips
- Publication number 20050017348
- Publication date Jan 27, 2005
- Tessera, Inc.
- Belgacem Haba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
High frequency chip packages with connecting elements
- Publication number 20040238857
- Publication date Dec 2, 2004
- Tessera, Inc.
- Masud Beroz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array with bumps
- Publication number 20040222518
- Publication date Nov 11, 2004
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies having stacked semiconductor chips and methods of making...
- Publication number 20040099938
- Publication date May 27, 2004
- Tessera, Inc.
- Teck-Gyu Kang
- H01 - BASIC ELECTRIC ELEMENTS

Yoichi Kubota

Person

Patents Grantslast 30 patents

Microelectronic interconnect element with decreased conductor spacing

Microelectronic interconnect element with decreased conductor spacing

Method of making a microelectronic interconnect element with decrea...

Fine pitch microcontacts and method for forming thereof

Method of making a connection component with posts and pads

Microelectronic interconnect element with decreased conductor spacing

Microelectronic packages and methods therefor

Method of making a connection component with posts and pads

Microelectronic packages and methods therefor

Manufacture of mountable capped chips

Microelectonic packages and methods therefor

Substrate for a flexible microelectronic assembly and a method of f...

Microelectronic packages and methods therefor

Components with posts and pads

Manufacture of mountable capped chips

Microelectronic packages and methods therefor

Microelectronic packages and methods therefor

High frequency chip packages with connecting elements

Assemblies having stacked semiconductor chips and methods of making...

Patents Applicationslast 30 patents

MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING

MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING

Connection Component with Posts and Pads

FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF

Method of Making a Microelectronic Interconnect Element With Decrea...

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

Microelectronic interconnect element with decreased conductor spacing

Components with posts and pads

Substrate for a flexible microelectronic assembly and a method of f...

Fine pitch microcontacts and method for forming thereof

Microelectronic packages and methods therefor

High frequency chip packages with connecting elements

Manufacture of mountable capped chips

Microelectronic packages and methods therefor

Molding method for foldover package

Components with posts and pads

Microelectronic packages and methods therefor

Packaged acoustic and electromagnetic transducer chips

Packaged acoustic and electromagnetic transducer chips

Microelectronic packages and methods therefor

Manufacture of mountable capped chips

High frequency chip packages with connecting elements

Ball grid array with bumps

Assemblies having stacked semiconductor chips and methods of making...