Yoshie Kimura

Person

Castro Valley, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reducing roughness of extreme ultraviolet lithography resists
- Patent number 12,125,711
- Issue date Oct 22, 2024
- Lam Research Corporation
- Xiang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Synchronization of RF generators
- Patent number 12,046,450
- Issue date Jul 23, 2024
- Lam Research Corporation
- Ying Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition and etch in a single plasma chamber for cri...
- Patent number 11,211,253
- Issue date Dec 28, 2021
- Lam Research Corportation
- Xiang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition and etch for reducing roughness
- Patent number 11,170,997
- Issue date Nov 9, 2021
- Lam Research Corporation
- Xiang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas delivery system
- Patent number 10,957,561
- Issue date Mar 23, 2021
- Lam Research Corporation
- John Drewery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated atomic layer passivation in TCP etch chamber and in-situ...
- Patent number 10,950,454
- Issue date Mar 16, 2021
- Lam Research Corporation
- Xiang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition and etch in a single plasma chamber for cri...
- Patent number 10,734,238
- Issue date Aug 4, 2020
- Lam Research Corporation
- Xiang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition and etch for reducing roughness
- Patent number 10,658,174
- Issue date May 19, 2020
- Lam Research Corporation
- Xiang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition and etch in a single plasma chamber for fin...
- Patent number 10,515,815
- Issue date Dec 24, 2019
- Lam Research Corporation
- Xiang Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Internal plasma grid applications for semiconductor fabrication
- Patent number 9,633,846
- Issue date Apr 25, 2017
- Lam Research Corporation
- Alex Paterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing an upper surface of a semiconductor substrate...
- Patent number 9,589,853
- Issue date Mar 7, 2017
- Lam Research Corporation
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap spacer integration for improved fin device performance
- Patent number 9,515,156
- Issue date Dec 6, 2016
- Lam Research Corporation
- Paul Raymond Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal plasma grid applications for semiconductor fabrication in...
- Patent number 9,230,819
- Issue date Jan 5, 2016
- Lam Research Corporation
- Alex Paterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling CD and CD uniformity with trim time and temperature on...
- Patent number 9,012,243
- Issue date Apr 21, 2015
- Lam Research Corporation
- Yoshie Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling CD and CD uniformity with trim time and temperature on...
- Patent number 8,852,964
- Issue date Oct 7, 2014
- Lam Research Corporation
- Yoshie Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride dry trim without top pulldown
- Patent number 8,431,461
- Issue date Apr 30, 2013
- Lam Research Corporation
- Qinghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR ETCHING A CARBON CONTAINING LAYER
- Publication number 20240379375
- Publication date Nov 14, 2024
- LAM RESEARCH CORPORATION
- Xiaofeng SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYNCHRONIZATION OF RF GENERATORS
- Publication number 20240331976
- Publication date Oct 3, 2024
- LAM RESEARCH CORPORATION
- Ying Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYNCHRONIZATION OF RF GENERATORS
- Publication number 20230274913
- Publication date Aug 31, 2023
- LAM RESEARCH CORPORATION
- Ying Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ETCHING FEATURES USING A TARGETED DEPOSITION FOR SELECTI...
- Publication number 20220301853
- Publication date Sep 22, 2022
- LAM RESEARCH CORPORATION
- Wenchi LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCING ROUGHNESS OF EXTREME ULTRAVIOLET LITHOGRAPHY RESISTS
- Publication number 20220157617
- Publication date May 19, 2022
- LAM RESEARCH CORPORATION
- Xiang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ATOMIC LAYER PASSIVATION IN TCP ETCH CHAMBER AND IN-SITU...
- Publication number 20210287909
- Publication date Sep 16, 2021
- LAM RESEARCH CORPORATION
- Xiang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION AND ETCH IN A SINGLE PLASMA CHAMBER FOR CRI...
- Publication number 20200328087
- Publication date Oct 15, 2020
- LAM RESEARCH CORPORATION
- Xiang Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION AND ETCH FOR REDUCING ROUGHNESS
- Publication number 20200243326
- Publication date Jul 30, 2020
- LAM RESEARCH CORPORATION
- Xiang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION AND ETCH IN A SINGLE PLASMA CHAMBER FOR CRI...
- Publication number 20190157095
- Publication date May 23, 2019
- LAM RESEARCH CORPORATION
- Xiang Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION AND ETCH FOR REDUCING ROUGHNESS
- Publication number 20190157066
- Publication date May 23, 2019
- LAM RESEARCH CORPORATION
- Xiang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION AND ETCH IN A SINGLE PLASMA CHAMBER FOR FIN...
- Publication number 20190157096
- Publication date May 23, 2019
- LAM RESEARCH CORPORATION
- Xiang Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED ATOMIC LAYER PASSIVATION IN TCP ETCH CHAMBER AND IN-SITU...
- Publication number 20190043728
- Publication date Feb 7, 2019
- LAM RESEARCH CORPORATION
- Xiang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DELIVERY SYSTEM
- Publication number 20170032982
- Publication date Feb 2, 2017
- LAM RESEARCH CORPORATION
- John Drewery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP SPACER INTEGRATION FOR IMPROVED FIN DEVICE PERFORMANCE
- Publication number 20160111515
- Publication date Apr 21, 2016
- LAM RESEARCH CORPORATION
- Paul Raymond Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNAL PLASMA GRID APPLICATIONS FOR SEMICONDUCTOR FABRICATION
- Publication number 20160086795
- Publication date Mar 24, 2016
- LAM RESEARCH CORPORATION
- Alex Paterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PLANARIZING AN UPPER SURFACE OF A SEMICONDUCTOR SUBSTRATE...
- Publication number 20150249016
- Publication date Sep 3, 2015
- LAM RESEARCH CORPORATION
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING CD AND CD UNIFORMITY WITH TRIM TIME AND TEMPERATURE ON...
- Publication number 20150053347
- Publication date Feb 26, 2015
- LAM RESEARCH CORPORATION
- Yoshie Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNAL PLASMA GRID APPLICATIONS FOR SEMICONDUCTOR FABRICATION
- Publication number 20140302678
- Publication date Oct 9, 2014
- Alex Paterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING CD AND CD UNIFORMITY WITH TRIM TIME AND TEMPERATURE ON...
- Publication number 20140220709
- Publication date Aug 7, 2014
- LAM RESEARCH CORPORATION
- Yoshie Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU METAL RESIDUE CLEAN
- Publication number 20140179106
- Publication date Jun 26, 2014
- LAM RESEARCH CORPORATION
- Qinghua ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH WITH MIXED MODE PULSING
- Publication number 20140051256
- Publication date Feb 20, 2014
- LAM RESEARCH CORPORATION
- Qinghua ZHONG
- H01 - BASIC ELECTRIC ELEMENTS

Yoshie Kimura

Person

Patents Grantslast 30 patents

Reducing roughness of extreme ultraviolet lithography resists

Synchronization of RF generators

Atomic layer deposition and etch in a single plasma chamber for cri...

Atomic layer deposition and etch for reducing roughness

Gas delivery system

Integrated atomic layer passivation in TCP etch chamber and in-situ...

Atomic layer deposition and etch in a single plasma chamber for cri...

Atomic layer deposition and etch for reducing roughness

Atomic layer deposition and etch in a single plasma chamber for fin...

Internal plasma grid applications for semiconductor fabrication

Method of planarizing an upper surface of a semiconductor substrate...

Air gap spacer integration for improved fin device performance

Internal plasma grid applications for semiconductor fabrication in...

Controlling CD and CD uniformity with trim time and temperature on...

Controlling CD and CD uniformity with trim time and temperature on...

Silicon nitride dry trim without top pulldown

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR ETCHING A CARBON CONTAINING LAYER

SYNCHRONIZATION OF RF GENERATORS

SYNCHRONIZATION OF RF GENERATORS

METHOD FOR ETCHING FEATURES USING A TARGETED DEPOSITION FOR SELECTI...

REDUCING ROUGHNESS OF EXTREME ULTRAVIOLET LITHOGRAPHY RESISTS

INTEGRATED ATOMIC LAYER PASSIVATION IN TCP ETCH CHAMBER AND IN-SITU...

ATOMIC LAYER DEPOSITION AND ETCH IN A SINGLE PLASMA CHAMBER FOR CRI...

ATOMIC LAYER DEPOSITION AND ETCH FOR REDUCING ROUGHNESS

ATOMIC LAYER DEPOSITION AND ETCH IN A SINGLE PLASMA CHAMBER FOR CRI...

ATOMIC LAYER DEPOSITION AND ETCH FOR REDUCING ROUGHNESS

ATOMIC LAYER DEPOSITION AND ETCH IN A SINGLE PLASMA CHAMBER FOR FIN...

INTEGRATED ATOMIC LAYER PASSIVATION IN TCP ETCH CHAMBER AND IN-SITU...

GAS DELIVERY SYSTEM

AIR GAP SPACER INTEGRATION FOR IMPROVED FIN DEVICE PERFORMANCE

INTERNAL PLASMA GRID APPLICATIONS FOR SEMICONDUCTOR FABRICATION

METHOD OF PLANARIZING AN UPPER SURFACE OF A SEMICONDUCTOR SUBSTRATE...

CONTROLLING CD AND CD UNIFORMITY WITH TRIM TIME AND TEMPERATURE ON...

INTERNAL PLASMA GRID APPLICATIONS FOR SEMICONDUCTOR FABRICATION

CONTROLLING CD AND CD UNIFORMITY WITH TRIM TIME AND TEMPERATURE ON...

IN-SITU METAL RESIDUE CLEAN

ETCH WITH MIXED MODE PULSING