Yukihiro Ishimaru

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
IC current measuring apparatus and IC current measuring adapter
- Patent number 8,878,559
- Issue date Nov 4, 2014
- Panasonic Corporation
- Takeshi Nakayama
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor bonding structure body and manufacturing method of se...
- Patent number 8,810,035
- Issue date Aug 19, 2014
- Panasonic Corporation
- Taichi Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module board
- Patent number 8,675,369
- Issue date Mar 18, 2014
- Panasonic Corporation
- Masahiro Takatori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module board
- Patent number 8,077,478
- Issue date Dec 13, 2011
- Panasonic Corporation
- Masahiro Takatori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method and electronic component mount...
- Patent number 7,752,749
- Issue date Jul 13, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package equipped with semiconductor chip and method for producing same
- Patent number 7,649,267
- Issue date Jan 19, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slave device, master device and stacked device
- Patent number 7,346,051
- Issue date Mar 18, 2008
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Nakayama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board with built-in electronic component and method for man...
- Patent number 7,341,890
- Issue date Mar 11, 2008
- Matsushita Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit component built-in module and method for manufacturing the...
- Patent number 7,180,169
- Issue date Feb 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part, and electronic part mounting element and an proces...
- Patent number 7,151,306
- Issue date Dec 19, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mount assembly, optical transmission line and photoelectric circuit...
- Patent number 7,136,543
- Issue date Nov 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Tousaku Nishiyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Circuit board with built-in electronic component and method for man...
- Patent number 7,091,593
- Issue date Aug 15, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive, apparatus for mounting electronic component, a...
- Patent number 6,916,433
- Issue date Jul 12, 2005
- Matsushita Electric Industrial Co., Ltd.
- Tsutomi Mitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part, an electronic part mounting element and a process...
- Patent number 6,853,074
- Issue date Feb 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive agent, packaging structure, and method for manu...
- Patent number 6,814,893
- Issue date Nov 9, 2004
- Matsushita Electric Industiral Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive and connection structure using the same
- Patent number 6,749,774
- Issue date Jun 15, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of Manufacturing a multi-layer circuit board
- Patent number 6,687,985
- Issue date Feb 10, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kazunori Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounted member and repair method thereof
- Patent number 6,675,474
- Issue date Jan 13, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive and packaging structure using the same
- Patent number 6,666,994
- Issue date Dec 23, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive agent, packaging structure, and method for manu...
- Patent number 6,620,345
- Issue date Sep 16, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive and packaging structure using the same
- Patent number 6,524,721
- Issue date Feb 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive adhesive and connection structure using the same
- Patent number 6,521,144
- Issue date Feb 18, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounted member and repair method thereof
- Patent number 6,512,183
- Issue date Jan 28, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive resin, electronic module using conductive resin, and met...
- Patent number 6,510,059
- Issue date Jan 21, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered circuit board and method of manufacturing the same
- Patent number 6,281,446
- Issue date Aug 28, 2001
- Matsushita Electric Industrial Co., Ltd.
- Kazunori Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR BONDING STRUCTURE BODY AND MANUFACTURING METHOD OF SE...
- Publication number 20130241069
- Publication date Sep 19, 2013
- PANASONIC CORPORATION
- Taichi Nakamura
- B32 - LAYERED PRODUCTS
Information Patent Application
IC CURRENT MEASURING APPARATUS AND IC CURRENT MEASURING ADAPTER
- Publication number 20120112737
- Publication date May 10, 2012
- Takeshi Nakayama
- G01 - MEASURING TESTING
Information Patent Application
MODULE BOARD
- Publication number 20120063110
- Publication date Mar 15, 2012
- PANASONIC CORPORATION
- Masahiro TAKATORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR TESTING CIRCUIT BOARD, AND METHOD FOR MAN...
- Publication number 20090202142
- Publication date Aug 13, 2009
- Yukihiro Ishimaru
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MODULE HAVING BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...
- Publication number 20090115067
- Publication date May 7, 2009
- Matsushita Electric Industrial Co., Ltd.
- Rikiya Okimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Mounting Method and Electronic Component Mount...
- Publication number 20090049687
- Publication date Feb 26, 2009
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080296053
- Publication date Dec 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT-CONTAINING MODULE AND MANUFACTURING METHOD THE...
- Publication number 20080298023
- Publication date Dec 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Rikiya Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package Equipped with Semiconductor Chip and Method for Producing Same
- Publication number 20080265437
- Publication date Oct 30, 2008
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Module Board
- Publication number 20080205016
- Publication date Aug 28, 2008
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Takatori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20070124926
- Publication date Jun 7, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board embedded with spherical semiconductor element
- Publication number 20070069393
- Publication date Mar 29, 2007
- Toshiyuki Asahi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with built-in electronic component and method for man...
- Publication number 20060244119
- Publication date Nov 2, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Slave device, master device and stacked device
- Publication number 20050289269
- Publication date Dec 29, 2005
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takeshi Nakayama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuit board and method for manufacturing the same
- Publication number 20050199420
- Publication date Sep 15, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic part, and electronic part mounting element and an proces...
- Publication number 20050098338
- Publication date May 12, 2005
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit component built-in module and method for manufacturing the...
- Publication number 20050045369
- Publication date Mar 3, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board with in-built electronic component and method for man...
- Publication number 20050006142
- Publication date Jan 13, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yukihiro Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mount assembly, optical transmission line and photoelectric circuit...
- Publication number 20050002608
- Publication date Jan 6, 2005
- Tousaku Nishiyama
- G02 - OPTICS
Information Patent Application
Wiring board, method for manufacturing a wiring board and electroni...
- Publication number 20040194999
- Publication date Oct 7, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshihiro Tomita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive adhesive agent, packaging structure, and method for manu...
- Publication number 20040005459
- Publication date Jan 8, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD.
- Hiroaki Takezawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Conductive adhesive and connection structure using the same
- Publication number 20030127632
- Publication date Jul 10, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive adhesive and packaging structure using the same
- Publication number 20030116756
- Publication date Jun 26, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Takezawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounted member and repair method thereof
- Publication number 20030079896
- Publication date May 1, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Matani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive resin, electronic module using conductive resin, and met...
- Publication number 20020185306
- Publication date Dec 12, 2002
- Tsutomu Mitani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Conductive adhesive, apparatus for mounting electronic component, a...
- Publication number 20020158232
- Publication date Oct 31, 2002
- Tsutomu Mitani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Electronic component mounted member and repair method thereof
- Publication number 20020062988
- Publication date May 30, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Tsutomu Mitani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Conductive adhesive agent, packaging structrue, and method for manu...
- Publication number 20020050643
- Publication date May 2, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroaki Takezawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Conductive adhesive and packaging structure using the same
- Publication number 20020043652
- Publication date Apr 18, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Hiroaki Takezawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Multi-layer circuit board and method of manufacturing the same
- Publication number 20020020554
- Publication date Feb 21, 2002
- Kazunori Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS

Yukihiro Ishimaru

Person

Patents Grantslast 30 patents

IC current measuring apparatus and IC current measuring adapter

Semiconductor bonding structure body and manufacturing method of se...

Module board

Module board

Electronic component mounting method and electronic component mount...

Package equipped with semiconductor chip and method for producing same

Slave device, master device and stacked device

Circuit board with built-in electronic component and method for man...

Circuit component built-in module and method for manufacturing the...

Electronic part, and electronic part mounting element and an proces...

Mount assembly, optical transmission line and photoelectric circuit...

Circuit board with built-in electronic component and method for man...

Conductive adhesive, apparatus for mounting electronic component, a...

Electronic part, an electronic part mounting element and a process...

Conductive adhesive agent, packaging structure, and method for manu...

Conductive adhesive and connection structure using the same

Method of Manufacturing a multi-layer circuit board

Electronic component mounted member and repair method thereof

Conductive adhesive and packaging structure using the same

Conductive adhesive agent, packaging structure, and method for manu...

Conductive adhesive and packaging structure using the same

Conductive adhesive and connection structure using the same

Electronic component mounted member and repair method thereof

Conductive resin, electronic module using conductive resin, and met...

Multi-layered circuit board and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR BONDING STRUCTURE BODY AND MANUFACTURING METHOD OF SE...

IC CURRENT MEASURING APPARATUS AND IC CURRENT MEASURING ADAPTER

MODULE BOARD

CIRCUIT BOARD, METHOD FOR TESTING CIRCUIT BOARD, AND METHOD FOR MAN...

MODULE HAVING BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...

Electronic Component Mounting Method and Electronic Component Mount...

ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT-CONTAINING MODULE AND MANUFACTURING METHOD THE...

Package Equipped with Semiconductor Chip and Method for Producing Same

Module Board

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Wiring board embedded with spherical semiconductor element

Circuit board with built-in electronic component and method for man...

Slave device, master device and stacked device

Circuit board and method for manufacturing the same

Electronic part, and electronic part mounting element and an proces...

Circuit component built-in module and method for manufacturing the...

Circuit board with in-built electronic component and method for man...

Mount assembly, optical transmission line and photoelectric circuit...

Wiring board, method for manufacturing a wiring board and electroni...

Conductive adhesive agent, packaging structure, and method for manu...

Conductive adhesive and connection structure using the same

Conductive adhesive and packaging structure using the same

Electronic component mounted member and repair method thereof

Conductive resin, electronic module using conductive resin, and met...

Conductive adhesive, apparatus for mounting electronic component, a...

Electronic component mounted member and repair method thereof

Conductive adhesive agent, packaging structrue, and method for manu...

Conductive adhesive and packaging structure using the same

Multi-layer circuit board and method of manufacturing the same