Zhuowen Sun

Person

Campbell, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra high performance interposer
- Patent number 10,700,002
- Issue date Jun 30, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 10,559,537
- Issue date Feb 11, 2020
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 10,522,457
- Issue date Dec 31, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dies-on-package devices and methods therefor
- Patent number 10,354,976
- Issue date Jul 16, 2019
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra high performance interposer
- Patent number 10,332,833
- Issue date Jun 25, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires for vertical integration with separate sur...
- Patent number 10,325,877
- Issue date Jun 18, 2019
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 10,177,086
- Issue date Jan 8, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 10,115,678
- Issue date Oct 30, 2018
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure for signal equalization
- Patent number 10,103,093
- Issue date Oct 16, 2018
- Invensas Corporation
- Zhuowen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra high performance interposer
- Patent number 10,032,715
- Issue date Jul 24, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-bandwidth memory application with controlled impedance loading
- Patent number 10,026,467
- Issue date Jul 17, 2018
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for reduced load memory module
- Patent number 10,007,622
- Issue date Jun 26, 2018
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Grant
Package-on-package devices with same level WLP components and metho...
- Patent number 9,991,233
- Issue date Jun 5, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package devices with upper RDL of WLPS and methods therefor
- Patent number 9,991,235
- Issue date Jun 5, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package devices with multiple levels and methods therefor
- Patent number 9,985,007
- Issue date May 29, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires for vertical integration with separate sur...
- Patent number 9,984,992
- Issue date May 29, 2018
- Invensas Corporation
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged components and methods therefor
- Patent number 9,972,573
- Issue date May 15, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package devices with WLP components with dual RDLs for s...
- Patent number 9,972,609
- Issue date May 15, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 9,947,618
- Issue date Apr 17, 2018
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TFD I/O partition for high-speed, high-density applications
- Patent number 9,928,883
- Issue date Mar 27, 2018
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit assemblies with multiple interposer substrates, and methods...
- Patent number 9,905,507
- Issue date Feb 27, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 9,812,402
- Issue date Nov 7, 2017
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced density assembly having microelectronic packages mounted a...
- Patent number 9,728,524
- Issue date Aug 8, 2017
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact microelectronic assembly having reduced spacing between con...
- Patent number 9,691,437
- Issue date Jun 27, 2017
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 9,691,702
- Issue date Jun 27, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TFD I/O partition for high-speed, high-density applications
- Patent number 9,679,613
- Issue date Jun 13, 2017
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Grant
Ultra high performance interposer
- Patent number 9,666,521
- Issue date May 30, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced load memory module using wire bonds and a plurality of rank...
- Patent number 9,640,236
- Issue date May 2, 2017
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Grant
Flexible I/O partition of multi-die memory solution
- Patent number 9,640,282
- Issue date May 2, 2017
- Invensas Corporation
- Yong Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic packages and assemblies with improved flyby signali...
- Patent number 9,595,511
- Issue date Mar 14, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20200118939
- Publication date Apr 16, 2020
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra High Performance Interposer
- Publication number 20190304904
- Publication date Oct 3, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20190157199
- Publication date May 23, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20190027444
- Publication date Jan 24, 2019
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra High Performance Interposer
- Publication number 20180331030
- Publication date Nov 15, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Wire Bond Wires for Vertical Integration With Separate Sur...
- Publication number 20180240773
- Publication date Aug 23, 2018
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20180233447
- Publication date Aug 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bond Wires for Interference Shielding
- Publication number 20180061774
- Publication date Mar 1, 2018
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Memory Module Enabled by Fan-Out Redistribution Layer
- Publication number 20180040587
- Publication date Feb 8, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND ASSEMBLIES WITH REPEATERS
- Publication number 20180040589
- Publication date Feb 8, 2018
- Invensas Corporation
- Shaowu Huang
- G11 - INFORMATION STORAGE
Information Patent Application
Package-on-Package Devices with Multiple Levels and Methods Therefor
- Publication number 20180026018
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Packaged Components and Methods Therefor
- Publication number 20180025987
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Same Level WLP Components and Metho...
- Publication number 20180026011
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor
- Publication number 20180026016
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dies-on-Package Devices and Methods Therefor
- Publication number 20180026017
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with WLP Components with Dual RDLS for S...
- Publication number 20180026019
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TFD I/O Partition for High-Speed, High-Density Applications
- Publication number 20170323667
- Publication date Nov 9, 2017
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20170278787
- Publication date Sep 28, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA HIGH PERFORMANCE INTERPOSER
- Publication number 20170256492
- Publication date Sep 7, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Reduced Load Memory Module
- Publication number 20170212848
- Publication date Jul 27, 2017
- Invensas Corporation
- Zhuowen Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Embedded wire bond wires for vertical integration with separate sur...
- Publication number 20170194281
- Publication date Jul 6, 2017
- Invensas Corporatoin
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-CHANNEL DIMM
- Publication number 20170186474
- Publication date Jun 29, 2017
- Invensas Corporation
- Belgacem Haba
- G11 - INFORMATION STORAGE
Information Patent Application
VIA STRUCTURE FOR SIGNAL EQUALIZATION
- Publication number 20170171003
- Publication date Jun 15, 2017
- Invensas Corporation
- Zhuowen SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-BANDWIDTH MEMORY APPLICATION WITH CONTROLLED IMPEDANCE LOADING
- Publication number 20170133081
- Publication date May 11, 2017
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20170117231
- Publication date Apr 27, 2017
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20160315047
- Publication date Oct 27, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ASSEMBLIES WITH MULTIPLE INTERPOSER SUBSTRATES, AND METHODS...
- Publication number 20160293534
- Publication date Oct 6, 2016
- Invensas Corporation
- Hong SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED LOAD MEMORY MODULE
- Publication number 20160267954
- Publication date Sep 15, 2016
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE FOR EVENT ALERT AND NOTIFICATION
- Publication number 20160154542
- Publication date Jun 2, 2016
- Hong Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPACT MICROELECTRONIC ASSEMBLY HAVING REDUCED SPACING BETWEEN CON...
- Publication number 20160093340
- Publication date Mar 31, 2016
- Invensas Corporation
- Zhuowen Sun
- G11 - INFORMATION STORAGE

Zhuowen Sun

Person

Patents Grantslast 30 patents

Ultra high performance interposer

Wire bond wires for interference shielding

Microelectronic components with features wrapping around protrusion...

Dies-on-package devices and methods therefor

Ultra high performance interposer

Embedded wire bond wires for vertical integration with separate sur...

Microelectronic components with features wrapping around protrusion...

Wire bond wires for interference shielding

Via structure for signal equalization

Ultra high performance interposer

High-bandwidth memory application with controlled impedance loading

Method for reduced load memory module

Package-on-package devices with same level WLP components and metho...

Package on-package devices with upper RDL of WLPS and methods therefor

Package on-package devices with multiple levels and methods therefor

Embedded wire bond wires for vertical integration with separate sur...

Wafer-level packaged components and methods therefor

Package-on-package devices with WLP components with dual RDLs for s...

Microelectronic components with features wrapping around protrusion...

TFD I/O partition for high-speed, high-density applications

Circuit assemblies with multiple interposer substrates, and methods...

Wire bond wires for interference shielding

Enhanced density assembly having microelectronic packages mounted a...

Compact microelectronic assembly having reduced spacing between con...

Microelectronic components with features wrapping around protrusion...

TFD I/O partition for high-speed, high-density applications

Ultra high performance interposer

Reduced load memory module using wire bonds and a plurality of rank...

Flexible I/O partition of multi-die memory solution

Microelectronic packages and assemblies with improved flyby signali...

Patents Applicationslast 30 patents

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Ultra High Performance Interposer

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Ultra High Performance Interposer

Embedded Wire Bond Wires for Vertical Integration With Separate Sur...

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

Wire Bond Wires for Interference Shielding

Vertical Memory Module Enabled by Fan-Out Redistribution Layer

MICROELECTRONIC PACKAGES AND ASSEMBLIES WITH REPEATERS

Package-on-Package Devices with Multiple Levels and Methods Therefor

Wafer-Level Packaged Components and Methods Therefor

Package-on-Package Devices with Same Level WLP Components and Metho...

Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor

Dies-on-Package Devices and Methods Therefor

Package-on-Package Devices with WLP Components with Dual RDLS for S...

TFD I/O Partition for High-Speed, High-Density Applications

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

ULTRA HIGH PERFORMANCE INTERPOSER

Method for Reduced Load Memory Module

Embedded wire bond wires for vertical integration with separate sur...

DUAL-CHANNEL DIMM

VIA STRUCTURE FOR SIGNAL EQUALIZATION

HIGH-BANDWIDTH MEMORY APPLICATION WITH CONTROLLED IMPEDANCE LOADING

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

CIRCUIT ASSEMBLIES WITH MULTIPLE INTERPOSER SUBSTRATES, AND METHODS...

REDUCED LOAD MEMORY MODULE

ELECTRONIC DEVICE FOR EVENT ALERT AND NOTIFICATION

COMPACT MICROELECTRONIC ASSEMBLY HAVING REDUCED SPACING BETWEEN CON...