13th Group

Industry

CPC
H01L2924/0503

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/050313th Group

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,148,716
- Issue date Nov 19, 2024
- Kioxia Corporation
- Takuya Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,830,856
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate and electronic device
- Patent number 11,798,863
- Issue date Oct 24, 2023
- Sekisui Chemical Co., Ltd.
- Kouji Ashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing same
- Patent number 11,749,581
- Issue date Sep 5, 2023
- Fuji Electric Co., Ltd.
- Yuhei Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power converter
- Patent number 10,727,150
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Haruhiko Murakami
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multiple-chip package with multiple thermal interface materials
- Patent number 10,580,717
- Issue date Mar 3, 2020
- Intel Corporation
- Boxi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermal interface material with ion scavenger
- Patent number 10,428,257
- Issue date Oct 1, 2019
- Honeywell International Inc.
- Ya Qun Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor devices including conductive pillars
- Patent number 10,276,529
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for anisotropic conductive film, anisotropic conductive...
- Patent number 10,224,303
- Issue date Mar 5, 2019
- Samsung SDI Co., Ltd.
- Youn Jo Ko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Optoelectronic semiconductor component
- Patent number 10,217,915
- Issue date Feb 26, 2019
- Osram Opto Semiconductors GmbH
- Johann Ramchen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material with ion scavenger
- Patent number 10,155,894
- Issue date Dec 18, 2018
- Honeywell International Inc.
- Ya Qun Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,157,772
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic device fabrication method, and electr...
- Patent number 10,115,694
- Issue date Oct 30, 2018
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding mechanisms for semiconductor wafers
- Patent number 9,960,129
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with the integration of control circuit
- Patent number 9,887,183
- Issue date Feb 6, 2018
- Delta Electronics, Inc.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with improved conductive properties and asso...
- Patent number 9,837,383
- Issue date Dec 5, 2017
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic semiconductor component
- Patent number 9,818,921
- Issue date Nov 14, 2017
- Osram Opto Semiconductors GmbH
- Johann Ramchen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus with pocket of low permittivity material to re...
- Patent number 9,812,446
- Issue date Nov 7, 2017
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Jongwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and fabrication method for the same
- Patent number 9,773,720
- Issue date Sep 26, 2017
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 9,728,490
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method for manufacturing the same
- Patent number 9,728,484
- Issue date Aug 8, 2017
- Hyundai Mobis Co., Ltd.
- Jae Hyun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,691,692
- Issue date Jun 27, 2017
- Fuji Electric Co., Ltd.
- Masaoki Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding using boron and nitrogen based bonding stack
- Patent number 9,640,514
- Issue date May 2, 2017
- GLOBALFOUNDRIES Inc.
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphite-containing substrates for LED packages
- Patent number 9,634,214
- Issue date Apr 25, 2017
- LedEngin, Inc.
- Xiantao Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package
- Patent number 9,611,143
- Issue date Apr 4, 2017
- Xintec Inc.
- Yen-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20240263004
- Publication date Aug 8, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIU...
- Publication number 20240222228
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Forming the Same
- Publication number 20240186275
- Publication date Jun 6, 2024
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20240120254
- Publication date Apr 11, 2024
- DEXERIALS CORPORATION
- Keisuke ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240072009
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
- Publication number 20240067855
- Publication date Feb 29, 2024
- COOLER MATERIALS TECHNOLOGY INC.
- Po-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240021488
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sey-Ping Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALN-BASED HYBRID BONDING
- Publication number 20230335518
- Publication date Oct 19, 2023
- Meta Platforms Technologies, LLC
- Shenghui LEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...
- Publication number 20230307407
- Publication date Sep 28, 2023
- Tohru YASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20230307375
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
- Publication number 20230197565
- Publication date Jun 22, 2023
- Jerrod P. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230062835
- Publication date Mar 2, 2023
- KIOXIA Corporation
- Takuya KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20220384371
- Publication date Dec 1, 2022
- STMicroelectronics S.r.l
- Samuele SCIARRILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20220372274
- Publication date Nov 24, 2022
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...
- Publication number 20220098462
- Publication date Mar 31, 2022
- DEXERIALS CORPORATION
- Marina TOBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200388553
- Publication date Dec 10, 2020
- FUJI ELECTRIC CO., LTD.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE AND ELECTRONIC DEVICE
- Publication number 20200388551
- Publication date Dec 10, 2020
- Sekisui Chemical Co., Ltd
- Kouji ASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Related Methods
- Publication number 20200286865
- Publication date Sep 10, 2020
- Semiconductor Components Industries, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...
- Publication number 20190252338
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL WITH ION SCAVENGER
- Publication number 20190048245
- Publication date Feb 14, 2019
- HONEYWELL INTERNATIONAL INC.
- Ya Qun Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS
- Publication number 20180374776
- Publication date Dec 27, 2018
- Intel Corporation
- Boxi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...
- Publication number 20180040592
- Publication date Feb 8, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SEMICONDUCTOR COMPONENT
- Publication number 20180033931
- Publication date Feb 1, 2018
- Osram Opto Semiconductors GmbH
- Johann Ramchen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND POWER CONVERTER
- Publication number 20180019180
- Publication date Jan 18, 2018
- Mitsubishi Electric Corporation
- Haruhiko MURAKAMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor package and related methods

Laminate and electronic device

Semiconductor module and method for manufacturing same

Sintering materials and attachment methods using same

Semiconductor packaging structure and process

Semiconductor devices and semiconductor devices including a redistr...

Semiconductor module and power converter

Multiple-chip package with multiple thermal interface materials

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Thermal interface material with ion scavenger

Semiconductor devices including conductive pillars

Composition for anisotropic conductive film, anisotropic conductive...

Optoelectronic semiconductor component

Thermal interface material with ion scavenger

Semiconductor packaging structure and process

Electronic device, electronic device fabrication method, and electr...

Hybrid bonding mechanisms for semiconductor wafers

Power module with the integration of control circuit

Interconnect structure with improved conductive properties and asso...

Optoelectronic semiconductor component

Electronic apparatus with pocket of low permittivity material to re...

Power module and fabrication method for the same

Semiconductor devices and methods of manufacturing the same

Power module package and method for manufacturing the same

Semiconductor device

Wafer bonding using boron and nitrogen based bonding stack

Graphite-containing substrates for LED packages

Method for forming chip package

Patents Applicationslast 30 patents

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIU...

Semiconductor Devices and Methods of Forming the Same

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

SEMICONDUCTOR PACKAGE AND RELATED METHODS

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

Integrated Circuit Package and Method

ALN-BASED HYBRID BONDING

MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...

Semiconductor Package and Method of Forming the Same

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

SEMICONDUCTOR DEVICE

DISPLAY DEVICE

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE

THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

LAMINATE AND ELECTRONIC DEVICE

Semiconductor Package and Related Methods

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTR...

THERMAL INTERFACE MATERIAL WITH ION SCAVENGER

MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSO...

OPTOELECTRONIC SEMICONDUCTOR COMPONENT

SEMICONDUCTOR MODULE AND POWER CONVERTER