Additive methods

Industry

CPC
H01L2224/02311

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02311Additive methods

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for wafer scale chip package
- Patent number 12,125,811
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Indumini W. Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of cracks in passivation layer
- Patent number 12,087,714
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 12,087,668
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip structure with conductive structure
- Patent number 12,057,419
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a dual material redistribution line
- Patent number 12,027,447
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,009,296
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with through-via in molding compound and dielectr...
- Patent number 12,009,322
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layers and methods of fabricating the same in semico...
- Patent number 11,967,573
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure and manufacturing method thereof
- Patent number 11,948,899
- Issue date Apr 2, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thermal release layer and method for fabr...
- Patent number 11,948,857
- Issue date Apr 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Jar-Ming Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor between two passivation layers with different etching rates
- Patent number 11,935,826
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with graphene layers
- Patent number 11,908,816
- Issue date Feb 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,887,840
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Min Sung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,862,588
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 11,848,319
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming same
- Patent number 11,823,912
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,817,405
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Sumin Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of forming microvias with reduced diameter
- Patent number 11,798,903
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Chintan Buch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a sidewall connection
- Patent number 11,749,627
- Issue date Sep 5, 2023
- STMicroelectronics Ltd.
- Endruw Jahja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,728,295
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-bump connection to interconnect structure and manufacturing m...
- Patent number 11,705,420
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages formed using RDL-last process
- Patent number 11,670,617
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having an interconn...
- Patent number 11,658,069
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-resist island forming via method and apparatus
- Patent number 11,640,947
- Issue date May 2, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
PASSIVATION LAYERS WITH ROUNDED CORNERS
- Publication number 20240387244
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Mingni CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN PASSIVATION LAYER
- Publication number 20240379593
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240379439
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A REDISTRIBUTION LAYER STRUCTURE, AND CHIP PACKA...
- Publication number 20240371803
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Wen SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240363496
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE LAYER
- Publication number 20240347488
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312910
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kai Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240290734
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240290737
- Publication date Aug 29, 2024
- MEDIATEK INC.
- Hung-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS AND METHODS OF FABRICATING THE SAME IN SEMICO...
- Publication number 20240274558
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING PROTECTIVE LAYER ON SIDEWALL OF COND...
- Publication number 20240194622
- Publication date Jun 13, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING PROTECTIVE LAYER ON SIDEWALL OF COND...
- Publication number 20240194621
- Publication date Jun 13, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SEMICONDUCTOR DEVICE, AND REDISTRIBUTION LAYER STRUCTURE...
- Publication number 20240105648
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240096827
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR BONDING PAD REDISTRIBUTION LAYERS IN INTE...
- Publication number 20240096826
- Publication date Mar 21, 2024
- SANDISK TECHNOLOGIES LLC
- Guangyuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adaptive Interconnect Structure for Semiconductor Package
- Publication number 20240071965
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Dummy vias in WLP
- Publication number 20240055374
- Publication date Feb 15, 2024
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240021548
- Publication date Jan 18, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Wei-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION
- Publication number 20230395486
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...
- Publication number 20230395441
- Publication date Dec 7, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kai TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
- Publication number 20230386864
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR BETWEEN TWO PASSIVATION LAYERS WITH DIFFERENT ETCHING RATES
- Publication number 20230378052
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER HAVING A SIDEVIEW ZIG-ZAG PROFILE
- Publication number 20230378107
- Publication date Nov 23, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER METALLIC STRUCTURE AND METHOD
- Publication number 20230377968
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230352395
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Pin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230335517
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Bump Connection to Interconnect Structure and Manufacturing M...
- Publication number 20230317661
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Layers with Rounded Corners
- Publication number 20230290673
- Publication date Sep 14, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages Formed Using RDL-Last Process
- Publication number 20230268317
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Additive methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method having a through substrate via and...

Semiconductor structure and method for wafer scale chip package

Method for fabricating semiconductor device with redistribution plugs

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Reduction of cracks in passivation layer

Semiconductor package and method for manufacturing the same

Method for forming chip structure with conductive structure

Semiconductor device having a dual material redistribution line

Semiconductor device and manufacturing method thereof

Package structure with through-via in molding compound and dielectr...

Redistribution layers and methods of fabricating the same in semico...

Semiconductor substrate structure and manufacturing method thereof

Semiconductor device with thermal release layer and method for fabr...

Capacitor between two passivation layers with different etching rates

LTHC as charging barrier in info package formation

Method for fabricating a chip package

Method for fabricating semiconductor device with graphene layers

Semiconductor device and method for manufacturing the same

Semiconductor device and method

Multi-chip semiconductor package

Stacked semiconductor devices and methods of forming same

Semiconductor device and method of fabricating the same

Semiconductor structure including buffer layer

Methods of forming microvias with reduced diameter

Semiconductor package having a sidewall connection

Semiconductor device and method of manufacturing thereof

Multi-bump connection to interconnect structure and manufacturing m...

Packages formed using RDL-last process

Method for manufacturing a semiconductor device having an interconn...

Pre-resist island forming via method and apparatus

Patents Applicationslast 30 patents

PASSIVATION LAYERS WITH ROUNDED CORNERS

REDUCTION OF CRACKS IN PASSIVATION LAYER

SEMICONDUCTOR DEVICE AND METHOD

METHOD FOR FORMING A REDISTRIBUTION LAYER STRUCTURE, AND CHIP PACKA...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CHIP STRUCTURE WITH CONDUCTIVE LAYER

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

BUMP STRUCTURE AND FABRICATION METHOD THEREOF

REDISTRIBUTION LAYERS AND METHODS OF FABRICATING THE SAME IN SEMICO...

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

SEMICONDUCTOR STRUCTURE HAVING PROTECTIVE LAYER ON SIDEWALL OF COND...

SEMICONDUCTOR STRUCTURE HAVING PROTECTIVE LAYER ON SIDEWALL OF COND...

APPARATUS, SEMICONDUCTOR DEVICE, AND REDISTRIBUTION LAYER STRUCTURE...

SEMICONDUCTOR DEVICE AND METHOD

APPARATUS AND METHODS FOR BONDING PAD REDISTRIBUTION LAYERS IN INTE...

Adaptive Interconnect Structure for Semiconductor Package

Semiconductor Device and Method of Forming Dummy vias in WLP

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

BILAYER RDL STRUCTURE FOR BUMP COUNT REDUCTION

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...

STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME

CAPACITOR BETWEEN TWO PASSIVATION LAYERS WITH DIFFERENT ETCHING RATES

REDISTRIBUTION LAYER HAVING A SIDEVIEW ZIG-ZAG PROFILE

REDISTRIBUTION LAYER METALLIC STRUCTURE AND METHOD

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Multi-Bump Connection to Interconnect Structure and Manufacturing M...

Passivation Layers with Rounded Corners

Packages Formed Using RDL-Last Process