Aluminium [Al] as principal constituent

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H01L2224/29124

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29124Aluminium [Al] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder thermal interface material (STIM) with dopant
- Patent number 12,166,004
- Issue date Dec 10, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member for semiconductor device
- Patent number 12,119,322
- Issue date Oct 15, 2024
- SUPERUFO291 TEC
- Akira Fukui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonded structure
- Patent number 12,070,801
- Issue date Aug 27, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for wafer bonding and compound semiconductor wafer
- Patent number 12,068,296
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Stefan Hampl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,862,598
- Issue date Jan 2, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display module and method of manufacturing the same
- Patent number 11,715,729
- Issue date Aug 1, 2023
- Samsung Electronics Co., Ltd.
- Yoonsuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside mechanical die grounding techniques
- Patent number 11,574,887
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 11,488,922
- Issue date Nov 1, 2022
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silver nano-twinned thin film structure and method for forming the...
- Patent number 11,488,920
- Issue date Nov 1, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Hsing-Hua Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Methods for bonding substrates
- Patent number 11,309,278
- Issue date Apr 19, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 11,282,801
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling system low form factor interface thermal manag...
- Patent number 10,985,086
- Issue date Apr 20, 2021
- Dell Products L.P.
- Travis C. North
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film (ACF) with controllable distribution st...
- Patent number 10,957,668
- Issue date Mar 23, 2021
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Hui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 10,957,669
- Issue date Mar 23, 2021
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, and semiconductor device
- Patent number 10,818,610
- Issue date Oct 27, 2020
- LG Chem, Ltd.
- Hee Jung Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Seal ring bonding structures
- Patent number 10,811,361
- Issue date Oct 20, 2020
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- Lieneng Low
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power electronic assemblies with high purity aluminum plated substr...
- Patent number 10,804,236
- Issue date Oct 13, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
- Publication number 20240363473
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240282685
- Publication date Aug 22, 2024
- LG Innotek Co., Ltd.
- Jae Hun JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...
- Publication number 20240266320
- Publication date Aug 8, 2024
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240234348
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE
- Publication number 20240213382
- Publication date Jun 27, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Patrick LE MAITRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...
- Publication number 20240170434
- Publication date May 23, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Chien-Hsun CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240162109
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUT...
- Publication number 20240145421
- Publication date May 2, 2024
- SOLAR APPLIED MATERIALS TECHNOLOGY CORP.
- Kuan-Neng CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240136309
- Publication date Apr 25, 2024
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
- Publication number 20240105545
- Publication date Mar 28, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071847
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240063250
- Publication date Feb 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Sang Jo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE...
- Publication number 20240063076
- Publication date Feb 22, 2024
- Intel Corporation
- Mohammad Enamul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240063074
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240055332
- Publication date Feb 15, 2024
- ROHM CO., LTD.
- Xiaopeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY PANEL, DISPLAY SCREEN, AND MANUFACTURING METHOD OF DISPLAY...
- Publication number 20230402440
- Publication date Dec 14, 2023
- Chuzhou HKC Optoelectronics Technology Co., Ltd.
- Guangjia WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MEMBER FOR SEMICONDUCTOR DEVICE
- Publication number 20230395550
- Publication date Dec 7, 2023
- SUPERUFO291 TEC
- Akira FUKUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230343755
- Publication date Oct 26, 2023
- Rohm Co., Ltd.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUSBAR WITH DIELECTRIC COATING
- Publication number 20230326834
- Publication date Oct 12, 2023
- Microchip Technology Caldicot Limited
- Piers Tremlett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAG...
- Publication number 20230326948
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Wenjun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230223378
- Publication date Jul 13, 2023
- NEXPERIA B.V.
- Qingyuan Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEIGHT ADAPTABLE MULTILAYER SPACER
- Publication number 20230197665
- Publication date Jun 22, 2023
- Heraeus Deutschland GmbH & Co. KG
- Andreas HINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...
- Publication number 20230090030
- Publication date Mar 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...
- Publication number 20230054798
- Publication date Feb 23, 2023
- Mitsubishi Electric Corporation
- Takashi IJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
- Publication number 20230053037
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20230025412
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Pin CHIU
- H01 - BASIC ELECTRIC ELEMENTS

Aluminium [Al] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder thermal interface material (STIM) with dopant

Bonding member for semiconductor device

Method for permanent connection of two metal surfaces

Bonding material and bonded structure

Method for wafer bonding and compound semiconductor wafer

Semiconductor device

Electronic device with multi-layer contact and system

Light emitting diode display with redundancy scheme

Display module and method of manufacturing the same

Flip chip backside mechanical die grounding techniques

Power module comprising two substrates and method of manufacturing...

Chip assembly

Back side metallization

Silver nano-twinned thin film structure and method for forming the...

Light emitting diode display with redundancy scheme

Methods for bonding substrates

Method for permanent connection of two metal surfaces

Bonded structure and method of manufacturing the same

Information handling system low form factor interface thermal manag...

Light emitting diode display with redundancy scheme

Anisotropic conductive film (ACF) with controllable distribution st...

Back side metallization

Method and apparatus for creating a bond between objects based on f...

Multi-layered composite bonding materials and power electronics ass...

Dam for three-dimensional integrated circuit

Semiconductor packaging structure and process

Adhesive film for semiconductor, and semiconductor device

Seal ring bonding structures

Power electronic assemblies with high purity aluminum plated substr...

Wafer level flat no-lead semiconductor packages and methods of manu...

Patents Applicationslast 30 patents

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES

CIRCUIT BOARD

SEMICONDUCTOR DEVICE

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE

BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...

Package with Improved Heat Dissipation Efficiency and Method for Fo...

PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUT...

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR PACKAGE AND METHOD

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

DISPLAY PANEL, DISPLAY SCREEN, AND MANUFACTURING METHOD OF DISPLAY...

BONDING MEMBER FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

BUSBAR WITH DIELECTRIC COATING

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAG...

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

HEIGHT ADAPTABLE MULTILAYER SPACER

NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...

METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME