Anodic bondings

Industry

CPC
B81C2203/031

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/031Anodic bondings

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for bonding wafers, and a wafer
- Patent number 12,202,725
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Konsta Hannula
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic device
- Patent number 11,944,965
- Issue date Apr 2, 2024
- Imec VZW
- Giuseppe Fiorentino
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure with bonded cover
- Patent number 11,685,650
- Issue date Jun 27, 2023
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method for a micromechanical component, a correspondi...
- Patent number 11,667,520
- Issue date Jun 6, 2023
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for increasing aspect ratios in comb structures
- Patent number 11,220,424
- Issue date Jan 11, 2022
- Honeywell International Inc.
- Mu hong Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for making alkali metal vapor cells
- Patent number 11,180,844
- Issue date Nov 23, 2021
- GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY O...
- John Kitching
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Physical quantity sensor, physical quantity sensor device, portable...
- Patent number 11,035,875
- Issue date Jun 15, 2021
- Seiko Epson Corporation
- Satoru Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a system including a first microelectromechani...
- Patent number 11,014,807
- Issue date May 25, 2021
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a microelectromechanical component and wafer s...
- Patent number 10,994,989
- Issue date May 4, 2021
- Robert Bosch GmbH
- Vijaye Rajaraman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic device
- Patent number 10,910,667
- Issue date Feb 2, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Sami Oukassi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High temperature capacitive MEMS pressure sensor
- Patent number 10,823,631
- Issue date Nov 3, 2020
- Rosemount Aerospace Inc.
- Jun Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,766,768
- Issue date Sep 8, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inorganic wafer having through-holes attached to semiconductor wafer
- Patent number 10,756,003
- Issue date Aug 25, 2020
- Corning Incorporated
- Daniel Wayne Levesque
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing optical components using functional elements
- Patent number 10,752,500
- Issue date Aug 25, 2020
- FRAUNHOFER-GESELLSCAFT ZUR FÖRDERUNG ANGEWANDTEN FORSCHUNG E.V.
- Hans Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectro-mechanical system device and method for electrostatic...
- Patent number 10,717,644
- Issue date Jul 21, 2020
- United Microeletronics Corp
- Linlin Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reversible anodic bonding
- Patent number 10,676,350
- Issue date Jun 9, 2020
- ColdQuanta, Inc.
- Steven Michael Hughes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor apparatus having flexible connecting members and meth...
- Patent number 10,654,710
- Issue date May 19, 2020
- Mitsubishi Electric Corporation
- Yoshiaki Hirata
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,450,190
- Issue date Oct 22, 2019
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vapor cell comprising electro-optic function for chip-scale atomic...
- Patent number 10,447,286
- Issue date Oct 15, 2019
- Korea Advanced Institute of Science and Technology
- Jong Cheol Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Anodically bonded vacuum-sealed capacitive micromachined ultrasonic...
- Patent number 10,427,188
- Issue date Oct 1, 2019
- North Carolina State University
- Omer Oralkan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing gas detector by MEMS process
- Patent number 10,294,100
- Issue date May 21, 2019
- Taiwan Carbon Nano Technology Corporation
- Yu-Hsuan Liao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Environment-resistant module, micropackage and methods of manufactu...
- Patent number 10,266,392
- Issue date Apr 23, 2019
- E-PACK, INC.
- Khalil Najafi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded structures for high glass strength and robust packaging
- Patent number 10,189,707
- Issue date Jan 29, 2019
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ceramic substrate, bonded body, module, and method for manufacturin...
- Patent number 10,160,636
- Issue date Dec 25, 2018
- Mitsubishi Electric Corporation
- Nobuaki Konno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a sensor
- Patent number 10,144,636
- Issue date Dec 4, 2018
- MEAS Switzerland S.a.r.l.
- Jean-Francois le Neal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inorganic wafer having through-holes attached to semiconductor wafer
- Patent number 10,134,657
- Issue date Nov 20, 2018
- Corning Incorporated
- Daniel Wayne Levesque
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor, manufacturing method of physical quantity...
- Patent number 10,035,697
- Issue date Jul 31, 2018
- Seiko Epson Corporation
- Satoru Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor, electronic device, and mobile body
- Patent number 9,857,390
- Issue date Jan 2, 2018
- Seiko Epson Corporation
- Teruo Takizawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of micro-electro-mechanical system sensor capa...
- Patent number 9,828,241
- Issue date Nov 28, 2017
- Hyundai Motor Company
- Ilseon Yoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of electronic device, electronic device, elect...
- Patent number 9,796,579
- Issue date Oct 24, 2017
- Seiko Epson Corporation
- Shigekazu Takagi
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...
- Publication number 20240409398
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT
- Publication number 20230406698
- Publication date Dec 21, 2023
- Murata Manufacturing Co., Ltd.
- Altti TORKKELI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR
- Publication number 20230384164
- Publication date Nov 30, 2023
- MSG Lithoglas GmbH
- David Bunel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIGHT SCANNER PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230127991
- Publication date Apr 27, 2023
- WEMEMS CO.,LTD.
- Jonghyun LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION OF MEMS STRUCTURES FROM FUSED SILICA FOR INERTIAL SENSORS
- Publication number 20230067030
- Publication date Mar 2, 2023
- Atlantic Inertial Systems Limited
- Christopher Paul Fell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING WAFERS, AND A WAFER
- Publication number 20220289567
- Publication date Sep 15, 2022
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD FOR A MICROMECHANICAL COMPONENT, A CORRESPONDI...
- Publication number 20220041432
- Publication date Feb 10, 2022
- ROBERT BOSCH GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20210221678
- Publication date Jul 22, 2021
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICALLY TRANSPARENT MICROMACHINED ULTRASONIC TRANSDUCER (CMUT)
- Publication number 20200282424
- Publication date Sep 10, 2020
- North Carolina State University
- Omer ORALKAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REVERSIBLE ANODIC BONDING
- Publication number 20200095121
- Publication date Mar 26, 2020
- ColdQuanta, Inc.
- Steven Michael HUGHES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20200079646
- Publication date Mar 12, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT AND WAFER S...
- Publication number 20200055727
- Publication date Feb 20, 2020
- ROBERT BOSCH GmbH
- Vijaye RAJARAMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD OF INCREASED ASPECT RATIOS IN COMB STRUCTURES
- Publication number 20200048077
- Publication date Feb 13, 2020
- HONEYWELL INTERNATIONAL INC.
- Mu hong Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for producing a system including a first microelectromechani...
- Publication number 20190382263
- Publication date Dec 19, 2019
- ROBERT BOSCH GmbH
- Johannes CLASSEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COATED OPTICAL ELEMENT COMPONENT WITH A COATED OPTICAL ELEMENT AND...
- Publication number 20190330054
- Publication date Oct 31, 2019
- SCHOTT AG
- Marcelo David Ackermann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH TEMPERATURE CAPACITIVE MEMS PRESSURE SENSOR
- Publication number 20190323912
- Publication date Oct 24, 2019
- Rosemount Aerospace Inc.
- Jun Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING OPTICAL COMPONENTS USING FUNCTIONAL ELEMENTS
- Publication number 20190135619
- Publication date May 9, 2019
- FRAUNHOFFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
- Hans, Joachim QUENZER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190127215
- Publication date May 2, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Yoshiaki HIRATA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INORGANIC WAFER HAVING THROUGH-HOLES ATTACHED TO SEMICONDUCTOR WAFER
- Publication number 20190074240
- Publication date Mar 7, 2019
- Corning Incorporated
- Daniel Wayne Levesque
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC DEVICE
- Publication number 20190074540
- Publication date Mar 7, 2019
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Sami OUKASSI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20190055121
- Publication date Feb 21, 2019
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING GAS DETECTOR BY MEMS PROCESS
- Publication number 20190010048
- Publication date Jan 10, 2019
- TAIWAN CARBON NANO TECHNOLOGY CORPORATION
- Yu-Hsuan LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A SENSOR
- Publication number 20180086626
- Publication date Mar 29, 2018
- MEAS Switzerland S.a.r.l.
- Jean-Francois LE NEAL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INORGANIC WAFER HAVING THROUGH-HOLES ATTACHED TO SEMICONDUCTOR WAFER
- Publication number 20180005922
- Publication date Jan 4, 2018
- Corning Incorporated
- Daniel Wayne Levesque
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CERAMIC SUBSTRATE, BONDED BODY, MODULE, AND METHOD FOR MANUFACTURIN...
- Publication number 20170362079
- Publication date Dec 21, 2017
- MITSUBISHI ELECTRIC CORPORATION
- Nobuaki KONNO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING
- Publication number 20170225950
- Publication date Aug 10, 2017
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD OF MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR
- Publication number 20170166443
- Publication date Jun 15, 2017
- Hyundai Motor Company
- Ilseon YOO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHYSICAL QUANTITY SENSOR, MANUFACTURING METHOD OF PHYSICAL QUANTITY...
- Publication number 20170088413
- Publication date Mar 30, 2017
- SEIKO EPSON CORPORATION
- Satoru TANAKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECT...
- Publication number 20170073219
- Publication date Mar 16, 2017
- SEIKO EPSON CORPORATION
- Shigekazu TAKAGI
- B60 - VEHICLES IN GENERAL

Anodic bondings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for bonding wafers, and a wafer

Microfluidic device

Microelectromechanical structure with bonded cover

Manufacturing method for a micromechanical component, a correspondi...

Methods for increasing aspect ratios in comb structures

Process for making alkali metal vapor cells

Physical quantity sensor, physical quantity sensor device, portable...

Method for producing a system including a first microelectromechani...

Method for producing a microelectromechanical component and wafer s...

Microelectronic device

High temperature capacitive MEMS pressure sensor

Encapsulated microelectromechanical structure

Inorganic wafer having through-holes attached to semiconductor wafer

Method for producing optical components using functional elements

Microelectro-mechanical system device and method for electrostatic...

Reversible anodic bonding

Semiconductor apparatus having flexible connecting members and meth...

Encapsulated microelectromechanical structure

Vapor cell comprising electro-optic function for chip-scale atomic...

Anodically bonded vacuum-sealed capacitive micromachined ultrasonic...

Method for manufacturing gas detector by MEMS process

Environment-resistant module, micropackage and methods of manufactu...

Embedded structures for high glass strength and robust packaging

Ceramic substrate, bonded body, module, and method for manufacturin...

Method of manufacturing a sensor

Inorganic wafer having through-holes attached to semiconductor wafer

Physical quantity sensor, manufacturing method of physical quantity...

Physical quantity sensor, electronic device, and mobile body

Manufacturing method of micro-electro-mechanical system sensor capa...

Manufacturing method of electronic device, electronic device, elect...

Patents Applicationslast 30 patents

MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...

MICROMECHANICAL STRUCTURE WITH BONDED COVER

MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT

INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR

LIGHT SCANNER PACKAGE AND METHOD FOR MANUFACTURING SAME

FABRICATION OF MEMS STRUCTURES FROM FUSED SILICA FOR INERTIAL SENSORS

METHOD FOR BONDING WAFERS, AND A WAFER

MANUFACTURING METHOD FOR A MICROMECHANICAL COMPONENT, A CORRESPONDI...

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

OPTICALLY TRANSPARENT MICROMACHINED ULTRASONIC TRANSDUCER (CMUT)

REVERSIBLE ANODIC BONDING

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

METHOD FOR PRODUCING A MICROELECTROMECHANICAL COMPONENT AND WAFER S...

APPARATUS AND METHOD OF INCREASED ASPECT RATIOS IN COMB STRUCTURES

Method for producing a system including a first microelectromechani...

COATED OPTICAL ELEMENT COMPONENT WITH A COATED OPTICAL ELEMENT AND...

HIGH TEMPERATURE CAPACITIVE MEMS PRESSURE SENSOR

METHOD FOR PRODUCING OPTICAL COMPONENTS USING FUNCTIONAL ELEMENTS

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

INORGANIC WAFER HAVING THROUGH-HOLES ATTACHED TO SEMICONDUCTOR WAFER

MICROELECTRONIC DEVICE

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

METHOD FOR MANUFACTURING GAS DETECTOR BY MEMS PROCESS

METHOD OF MANUFACTURING A SENSOR

INORGANIC WAFER HAVING THROUGH-HOLES ATTACHED TO SEMICONDUCTOR WAFER

CERAMIC SUBSTRATE, BONDED BODY, MODULE, AND METHOD FOR MANUFACTURIN...

EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING

MANUFACTURING METHOD OF MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR

PHYSICAL QUANTITY SENSOR, MANUFACTURING METHOD OF PHYSICAL QUANTITY...

MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECT...