Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto

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H01L2224/74

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Device bonding apparatus and method of manufacturing a package usin...
- Patent number 12,368,128
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,300,663
- Issue date May 13, 2025
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for the alignment of substrates
- Patent number 12,199,062
- Issue date Jan 14, 2025
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder head with improved sealing performance
- Patent number 12,166,008
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-type solder ball placement system
- Patent number 12,151,315
- Issue date Nov 26, 2024
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonding wire and manufacturing apparatus t...
- Patent number 11,276,664
- Issue date Mar 15, 2022
- Mun-Sub Song
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor fabrication apparatus and semiconductor fabrication m...
- Patent number 10,892,240
- Issue date Jan 12, 2021
- TOSHIBA MEMORY CORPORATION
- Keiichi Niwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 10,600,652
- Issue date Mar 24, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 10,217,807
- Issue date Feb 26, 2019
- Samsung Display Co., Ltd.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming ball in bonding wire
- Patent number 10,121,764
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Noritoshi Araki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal post bonding using pre-fabricated metal posts
- Patent number 10,034,390
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic element with bond elements to encapsulation surface
- Patent number 10,008,477
- Issue date Jun 26, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for eutectic bonding
- Patent number 9,935,077
- Issue date Apr 3, 2018
- Robert Bosch GmbH
- Ralf Hausner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding system and cleaning method thereof
- Patent number 9,917,069
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for assembling a component with a flexible foi...
- Patent number 9,918,392
- Issue date Mar 13, 2018
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding bare chip dies
- Patent number 9,859,247
- Issue date Jan 2, 2018
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Edsger Constant Pieter Smits
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias and thermocompression bonding using inkjet-pri...
- Patent number 9,717,145
- Issue date Jul 25, 2017
- The Regents of the University of California
- Vivek Subramanian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Environmental hardened packaged integrated circuit
- Patent number 9,711,480
- Issue date Jul 18, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting apparatus
- Patent number 9,673,165
- Issue date Jun 6, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuhiro Okada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20250239567
- Publication date Jul 24, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT REWORK METHOD AND DEVICE
- Publication number 20250233101
- Publication date Jul 17, 2025
- Innostar Service Inc.
- Chih-Meng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING CHIP
- Publication number 20250226354
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Ahra JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, CHUCK EXCHANGE APPARATUS, AND ARTICLE MANUFACTUR...
- Publication number 20250219013
- Publication date Jul 3, 2025
- Canon Kabushiki Kaisha
- KAI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK FOR WAFER BONDING DEVICE
- Publication number 20250219011
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Kyungmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250201759
- Publication date Jun 19, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE
- Publication number 20250201690
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY METHOD AND EQUIPMENT
- Publication number 20250192096
- Publication date Jun 12, 2025
- Intel Corporation
- Yi SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...
- Publication number 20250167015
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Donguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM INCLUDING A PLURALITY OF DIE HEADS WITH RELEASABLY COUPLED D...
- Publication number 20250167165
- Publication date May 22, 2025
- Canon Kabushiki Kaisha
- Byung-Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS
- Publication number 20250149497
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING EQUIPMENT, BONDING EQUIPMENT, POSITIONING METHOD AND BO...
- Publication number 20250140736
- Publication date May 1, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- RYO FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20250140739
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Kashyap Mohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Apparatus, Mounting Method, and Method for Manufacturin...
- Publication number 20250096188
- Publication date Mar 20, 2025
- Fasford Technology Co., Ltd.
- Keita YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANU...
- Publication number 20250087624
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compensating for registration error in vertical die stacking
- Publication number 20250079394
- Publication date Mar 6, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE SUPPLY MODULE AND WIRE BONDING MACHINE INCLUDING THE SAME
- Publication number 20250066154
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Doojin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250070080
- Publication date Feb 27, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT...
- Publication number 20250062274
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20250062275
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDING SYSTEM
- Publication number 20250029950
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Yuji MIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING CHUCK WITH DISCRETE ACTUATORS
- Publication number 20250029866
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Craig A. Hickman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE
- Publication number 20250022826
- Publication date Jan 16, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING
- Publication number 20250022839
- Publication date Jan 16, 2025
- IHP GmbH-Innovations for High Performance Microelectronics/Leibniz-Instit. fu...
- Sebastian SCHULZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
- Publication number 20240421117
- Publication date Dec 19, 2024
- Canon Kabushiki Kaisha
- KIYOTAKA NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF BONDING SE...
- Publication number 20240395764
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Gyeongjae JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...
- Publication number 20240363581
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Daewoong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING
- Publication number 20240347501
- Publication date Oct 17, 2024
- Haris Khan Niazi
- G05 - CONTROLLING REGULATING
Information Patent Application
BONDING METHOD AND BONDING SYSTEM
- Publication number 20240339431
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Kazutaka Noda
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device bonding apparatus and method of manufacturing a package usin...

Methods of forming wire interconnect structures and related wire bo...

Device and method for the alignment of substrates

Injection molded solder head with improved sealing performance

Dual-type solder ball placement system

Chip bonding apparatus and securing assembly therefor

Anisotropic conductive film and display device using the same

Electroconductive film, roll, connected structure, and process for...

Method for manufacturing bonding wire and manufacturing apparatus t...

Semiconductor fabrication apparatus and semiconductor fabrication m...

Bonding system

Method for producing a connecting medium on an assembly partner, me...

Semiconductor device processing method for material removal

Hybrid bonding systems and methods for semiconductor wafers

Anisotropic conductive film and display device using the same

Method for forming ball in bonding wire

Hybrid bonding systems and methods for semiconductor wafers

Method for coating conductive substrate with adhesive

Metal post bonding using pre-fabricated metal posts

Microelectronic element with bond elements to encapsulation surface

Apparatus for eutectic bonding

Hybrid bonding system and cleaning method thereof

Method and apparatus for assembling a component with a flexible foi...

Electronic devices with semiconductor die attached with sintered me...

Method for bonding substrates

Method for bonding bare chip dies

Hybrid bonding systems and methods for semiconductor wafers

Through silicon vias and thermocompression bonding using inkjet-pri...

Environmental hardened packaged integrated circuit

Component mounting apparatus

Patents Applicationslast 30 patents

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

ELECTRONIC COMPONENT REWORK METHOD AND DEVICE

APPARATUS FOR STACKING CHIP

BONDING APPARATUS, CHUCK EXCHANGE APPARATUS, AND ARTICLE MANUFACTUR...

CHUCK FOR WAFER BONDING DEVICE

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

SYSTEM AND METHODS FOR AN EMBEDDED BRIDGING PACKAGE ARCHITECTURE

SELF-ASSEMBLY METHOD AND EQUIPMENT

APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD OF MAN...

SYSTEM INCLUDING A PLURALITY OF DIE HEADS WITH RELEASABLY COUPLED D...

BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS

POSITIONING EQUIPMENT, BONDING EQUIPMENT, POSITIONING METHOD AND BO...

LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES

Die Bonding Apparatus, Mounting Method, and Method for Manufacturin...

SEMICONDUCTOR CHIP BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANU...

Compensating for registration error in vertical die stacking

WIRE SUPPLY MODULE AND WIRE BONDING MACHINE INCLUDING THE SAME

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT...

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

BONDING METHOD AND BONDING SYSTEM

WAFER BONDING CHUCK WITH DISCRETE ACTUATORS

SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE

METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING

BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD

BONDING APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF BONDING SE...

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...

METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING

BONDING METHOD AND BONDING SYSTEM