Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto

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CPC
H01L2224/74

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Injection molded solder head with improved sealing performance
- Patent number 12,166,008
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-type solder ball placement system
- Patent number 12,151,315
- Issue date Nov 26, 2024
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonding wire and manufacturing apparatus t...
- Patent number 11,276,664
- Issue date Mar 15, 2022
- Mun-Sub Song
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor fabrication apparatus and semiconductor fabrication m...
- Patent number 10,892,240
- Issue date Jan 12, 2021
- TOSHIBA MEMORY CORPORATION
- Keiichi Niwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 10,600,652
- Issue date Mar 24, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 10,217,807
- Issue date Feb 26, 2019
- Samsung Display Co., Ltd.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming ball in bonding wire
- Patent number 10,121,764
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Noritoshi Araki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal post bonding using pre-fabricated metal posts
- Patent number 10,034,390
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic element with bond elements to encapsulation surface
- Patent number 10,008,477
- Issue date Jun 26, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for eutectic bonding
- Patent number 9,935,077
- Issue date Apr 3, 2018
- Robert Bosch GmbH
- Ralf Hausner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding system and cleaning method thereof
- Patent number 9,917,069
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for assembling a component with a flexible foi...
- Patent number 9,918,392
- Issue date Mar 13, 2018
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding bare chip dies
- Patent number 9,859,247
- Issue date Jan 2, 2018
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Edsger Constant Pieter Smits
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias and thermocompression bonding using inkjet-pri...
- Patent number 9,717,145
- Issue date Jul 25, 2017
- The Regents of the University of California
- Vivek Subramanian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Environmental hardened packaged integrated circuit
- Patent number 9,711,480
- Issue date Jul 18, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting apparatus
- Patent number 9,673,165
- Issue date Jun 6, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuhiro Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment systems and wafer bonding systems and methods
- Patent number 9,646,860
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 9,640,495
- Issue date May 2, 2017
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
- Publication number 20240421117
- Publication date Dec 19, 2024
- Canon Kabushiki Kaisha
- KIYOTAKA NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF BONDING SE...
- Publication number 20240395764
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Gyeongjae JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...
- Publication number 20240363581
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Daewoong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING
- Publication number 20240347501
- Publication date Oct 17, 2024
- Haris Khan Niazi
- G05 - CONTROLLING REGULATING
Information Patent Application
BONDING METHOD AND BONDING SYSTEM
- Publication number 20240339431
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Kazutaka Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM
- Publication number 20240304594
- Publication date Sep 12, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD
- Publication number 20240282611
- Publication date Aug 22, 2024
- NEXPERIA B.V.
- Johannes Hubertus Antonius van de Rijdt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT CHUCK EDGE RING
- Publication number 20240250059
- Publication date Jul 25, 2024
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240234215
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIR OF SOLDER BUMPS
- Publication number 20240222302
- Publication date Jul 4, 2024
- ORBOTECH LTD.
- Zvi KOTLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE COATING APPARATUS
- Publication number 20240194632
- Publication date Jun 13, 2024
- Woong Chul SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...
- Publication number 20240194531
- Publication date Jun 13, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Anna ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20240186278
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Masato KAJINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL APPLICATION APPARATUS AND BONDING MATERIAL APPLICA...
- Publication number 20240153907
- Publication date May 9, 2024
- Fuji Electric Co., Ltd.
- Narumi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20240153906
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Byeongtak PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROMAGNETIC CONTROL OF WAFER BONDING
- Publication number 20240153910
- Publication date May 9, 2024
- MICRON TECHNOLGY, INC.
- Andrew M. BAYLESS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240136231
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING M...
- Publication number 20240127423
- Publication date Apr 18, 2024
- SHINKAWA LTD.
- Yoshiyuki OGATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE
- Publication number 20240105497
- Publication date Mar 28, 2024
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Bonding Apparatus and Method of Manufacturing a Package Usin...
- Publication number 20240071982
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...
- Publication number 20230340686
- Publication date Oct 26, 2023
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230307412
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20230275062
- Publication date Aug 31, 2023
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...
- Publication number 20230230847
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES
- Publication number 20230207513
- Publication date Jun 29, 2023
- EV GROUP E. THALLNER GMBH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR DIE BOND CONTROL
- Publication number 20230207514
- Publication date Jun 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230197672
- Publication date Jun 22, 2023
- KIOXIA Corporation
- Ai MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20230154887
- Publication date May 18, 2023
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Injection molded solder head with improved sealing performance

Dual-type solder ball placement system

Chip bonding apparatus and securing assembly therefor

Anisotropic conductive film and display device using the same

Electroconductive film, roll, connected structure, and process for...

Method for manufacturing bonding wire and manufacturing apparatus t...

Semiconductor fabrication apparatus and semiconductor fabrication m...

Bonding system

Method for producing a connecting medium on an assembly partner, me...

Semiconductor device processing method for material removal

Hybrid bonding systems and methods for semiconductor wafers

Anisotropic conductive film and display device using the same

Method for forming ball in bonding wire

Hybrid bonding systems and methods for semiconductor wafers

Method for coating conductive substrate with adhesive

Metal post bonding using pre-fabricated metal posts

Microelectronic element with bond elements to encapsulation surface

Apparatus for eutectic bonding

Hybrid bonding system and cleaning method thereof

Method and apparatus for assembling a component with a flexible foi...

Electronic devices with semiconductor die attached with sintered me...

Method for bonding substrates

Method for bonding bare chip dies

Hybrid bonding systems and methods for semiconductor wafers

Through silicon vias and thermocompression bonding using inkjet-pri...

Environmental hardened packaged integrated circuit

Component mounting apparatus

Alignment systems and wafer bonding systems and methods

Semiconductor device processing method for material removal

Electronic devices with semiconductor die coupled to a thermally co...

Patents Applicationslast 30 patents

BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD

BONDING APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF BONDING SE...

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...

METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING

BONDING METHOD AND BONDING SYSTEM

BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD

COMPLIANT CHUCK EDGE RING

APPARATUS FOR MEASURING AN ADHESION FORCE

REPAIR OF SOLDER BUMPS

WIRE COATING APPARATUS

THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...

MOUNTING DEVICE AND MOUNTING METHOD

BONDING MATERIAL APPLICATION APPARATUS AND BONDING MATERIAL APPLICA...

SUBSTRATE BONDING APPARATUS

FERROMAGNETIC CONTROL OF WAFER BONDING

APPARATUS FOR MEASURING AN ADHESION FORCE

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING M...

SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE

Device Bonding Apparatus and Method of Manufacturing a Package Usin...

ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...

DEVICE AND METHOD FOR THE ALIGNMENT OF SUBSTRATES

APPARATUSES AND METHODS FOR DIE BOND CONTROL

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE