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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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Patents Grants
last 30 patents
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Patent Grant
Method of forming a sensor device having moisture sensitive dielect...
Patent number
12,159,848
Issue date
Dec 3, 2024
GLOBALFOUNDRIES Singapore Ptd. Ltd.
Ee Jan Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
Patent number
12,154,877
Issue date
Nov 26, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip packaging method and package structure
Patent number
12,080,565
Issue date
Sep 3, 2024
Pep Innovation PTE Ltd.
Jimmy Chew
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module and method of manufacturing semiconductor module
Patent number
12,062,630
Issue date
Aug 13, 2024
Fuji Electric Co., Ltd.
Yasuaki Hozumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with metal film on surface between passivation...
Patent number
12,057,416
Issue date
Aug 6, 2024
Sumitomo Electric Industries, Ltd.
Mitsuhiko Sakai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method of forming a chip package
Patent number
12,040,288
Issue date
Jul 16, 2024
Infineon Technologies AG
Harry Walter Sax
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package, method of forming a chip package and method of formin...
Patent number
12,033,972
Issue date
Jul 9, 2024
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder ball application for singular die
Patent number
11,978,711
Issue date
May 7, 2024
Global Circuit Innovations Incorporated
Erick Merle Spory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip package structure and manufacturing method thereof
Patent number
11,955,443
Issue date
Apr 9, 2024
Amazing Cool Technology Corp
Shiann-Tsong Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for processing a substrate
Patent number
11,913,107
Issue date
Feb 27, 2024
Applied Materials, Inc.
Yueh Sheng Ow
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Driving substrate and manufacturing method thereof, and micro LED b...
Patent number
11,894,353
Issue date
Feb 6, 2024
BOE Technology Group Co., Ltd.
Zhiwei Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit chip including a passivation nitride layer in co...
Patent number
11,887,948
Issue date
Jan 30, 2024
STMicroelectronics S.r.l.
Simone Dario Mariani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding process with inhibited oxide formation
Patent number
11,869,870
Issue date
Jan 9, 2024
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-level package including under bump metal layer
Patent number
11,862,589
Issue date
Jan 2, 2024
Samsung Electronics Co., Ltd.
Hyung Sun Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive buffer layers for semiconductor die assemblies and assoc...
Patent number
11,862,591
Issue date
Jan 2, 2024
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a sensor device
Patent number
11,855,019
Issue date
Dec 26, 2023
GLOBALFOUNDRIES Singapore Pte. Ltd.
Ee Jan Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,848,346
Issue date
Dec 19, 2023
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Satoru Wakiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive barrier direct hybrid bonding
Patent number
11,830,838
Issue date
Nov 28, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor module and method of manufacturing semiconductor module
Patent number
11,824,024
Issue date
Nov 21, 2023
Fuji Electric Co., Ltd.
Yasuaki Hozumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-emitting panel, method manufacturing the same, and display de...
Patent number
11,817,461
Issue date
Nov 14, 2023
TCL China Star Optoelectronics Technology Co., Ltd.
Maoxia Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure including buffer layer
Patent number
11,810,879
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Wafer-level package including under bump metal layer
Patent number
11,810,878
Issue date
Nov 7, 2023
Samsung Electronics Co., Ltd.
Hyung Sun Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method of forming a chip package
Patent number
11,735,534
Issue date
Aug 22, 2023
Infineon Technologies AG
Harry Walter Sax
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
Patent number
11,664,335
Issue date
May 30, 2023
Semikron Elektronik GmbH & Co., KG
Wolfgang-Michael Schulz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,581,279
Issue date
Feb 14, 2023
Samsung Electronics Co., Ltd.
Ju-il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device bonding area including fused solder film and m...
Patent number
11,545,452
Issue date
Jan 3, 2023
Lapis Semiconductor Co., Ltd.
Masanori Shindo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder ball application for singular die
Patent number
11,508,680
Issue date
Nov 22, 2022
Global Circuit Innovations Inc.
Erick Merle Spory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having counductive bump with tapered portio...
Patent number
11,495,556
Issue date
Nov 8, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding process with inhibited oxide formation
Patent number
11,488,930
Issue date
Nov 1, 2022
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,476,211
Issue date
Oct 18, 2022
Nepes Co., Ltd.
Jun Kyu Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
Publication number
20240395742
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Feng WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
Publication number
20240371796
Publication date
Nov 7, 2024
INFINEON TECHNOLOGIES AG
Harry Walter SAX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
Publication number
20240332227
Publication date
Oct 3, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
Publication number
20240243085
Publication date
Jul 18, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE
Publication number
20240203914
Publication date
Jun 20, 2024
Amazing Cool Technology Corp
Shiann-Tsong TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOC...
Publication number
20240178170
Publication date
May 30, 2024
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240145417
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Hyeongwoo JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
Publication number
20240120301
Publication date
Apr 11, 2024
STMicroelectronics S.r.l
Simone Dario MARIANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THICK REDISTRIBUTION LAYER FEATURES
Publication number
20240088074
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Feng Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A SENSOR DEVICE
Publication number
20240063154
Publication date
Feb 22, 2024
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
EE JAN KHOR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
Publication number
20240014156
Publication date
Jan 11, 2024
Fuji Electric Co., Ltd.
Yasuaki HOZUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
Publication number
20230395532
Publication date
Dec 7, 2023
INFINEON TECHNOLOGIES AG
Harry Walter SAX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230260936
Publication date
Aug 17, 2023
Amazing Cool Technology Corp
Shiann-Tsong TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230187393
Publication date
Jun 15, 2023
Samsung Electronics Co., Ltd.
Ju-il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOC...
Publication number
20230063954
Publication date
Mar 2, 2023
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder Ball Application for Singular Die
Publication number
20230055518
Publication date
Feb 23, 2023
Global Circuit Innovations Inc.
Erick Merle Spory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Passivation Structure for Metal Pattern
Publication number
20230052604
Publication date
Feb 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Hung Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
Publication number
20230032635
Publication date
Feb 2, 2023
STMicroelectronics S.r.l
Simone Dario MARIANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
Publication number
20220367390
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Feng WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-EMITTING PANEL, METHOD MANUFACTURING THE SAME, AND DISPLAY DE...
Publication number
20220320143
Publication date
Oct 6, 2022
TCL China Star Optoelectronics Technology Co., Ltd.
Maoxia Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
Publication number
20220285301
Publication date
Sep 8, 2022
Fuji Electric Co., Ltd.
Yasuaki HOZUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A SENSOR DEVICE
Publication number
20220252534
Publication date
Aug 11, 2022
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
EE JAN KHOR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
Publication number
20220254746
Publication date
Aug 11, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Paul M. ENQUIST
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONT...
Publication number
20220216244
Publication date
Jul 7, 2022
ams AG
Gerhard EILMSTEINER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20220181279
Publication date
Jun 9, 2022
Sumitomo Electric Industries, Ltd.
Mitsuhiko SAKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder Ball Application for Singular Die
Publication number
20220157749
Publication date
May 19, 2022
Global Circuit Innovations Inc.
Erick Merle Spory
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
Publication number
20220028812
Publication date
Jan 27, 2022
Semiconductor Components Industries, LLC
Michael J. SEDDON
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CHIP PACKAGING METHOD AND PACKAGE STRUCTURE
Publication number
20210398822
Publication date
Dec 23, 2021
PEP INNOVATION PTE LTD.
Jimmy CHEW
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
Publication number
20210375792
Publication date
Dec 2, 2021
INFINEON TECHNOLOGIES AG
Harry Walter SAX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER
Publication number
20210358874
Publication date
Nov 18, 2021
Samsung Electronics Co., Ltd.
Hyung Sun JANG
H01 - BASIC ELECTRIC ELEMENTS