Applying permanent coating

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H01L2224/0382

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0382Applying permanent coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a sensor device having moisture sensitive dielect...
- Patent number 12,159,848
- Issue date Dec 3, 2024
- GLOBALFOUNDRIES Singapore Ptd. Ltd.
- Ee Jan Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip packaging method and package structure
- Patent number 12,080,565
- Issue date Sep 3, 2024
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method of manufacturing semiconductor module
- Patent number 12,062,630
- Issue date Aug 13, 2024
- Fuji Electric Co., Ltd.
- Yasuaki Hozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film on surface between passivation...
- Patent number 12,057,416
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,040,288
- Issue date Jul 16, 2024
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball application for singular die
- Patent number 11,978,711
- Issue date May 7, 2024
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure and manufacturing method thereof
- Patent number 11,955,443
- Issue date Apr 9, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 11,913,107
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Yueh Sheng Ow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Driving substrate and manufacturing method thereof, and micro LED b...
- Patent number 11,894,353
- Issue date Feb 6, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip including a passivation nitride layer in co...
- Patent number 11,887,948
- Issue date Jan 30, 2024
- STMicroelectronics S.r.l.
- Simone Dario Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,862,589
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive buffer layers for semiconductor die assemblies and assoc...
- Patent number 11,862,591
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a sensor device
- Patent number 11,855,019
- Issue date Dec 26, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ee Jan Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method of manufacturing semiconductor module
- Patent number 11,824,024
- Issue date Nov 21, 2023
- Fuji Electric Co., Ltd.
- Yasuaki Hozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting panel, method manufacturing the same, and display de...
- Patent number 11,817,461
- Issue date Nov 14, 2023
- TCL China Star Optoelectronics Technology Co., Ltd.
- Maoxia Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including buffer layer
- Patent number 11,810,879
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,810,878
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 11,735,534
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,581,279
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 11,545,452
- Issue date Jan 3, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball application for singular die
- Patent number 11,508,680
- Issue date Nov 22, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having counductive bump with tapered portio...
- Patent number 11,495,556
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,476,211
- Issue date Oct 18, 2022
- Nepes Co., Ltd.
- Jun Kyu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
- Publication number 20240395742
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Feng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20240371796
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
- Publication number 20240332227
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE
- Publication number 20240203914
- Publication date Jun 20, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOC...
- Publication number 20240178170
- Publication date May 30, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
- Publication number 20240120301
- Publication date Apr 11, 2024
- STMicroelectronics S.r.l
- Simone Dario MARIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK REDISTRIBUTION LAYER FEATURES
- Publication number 20240088074
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SENSOR DEVICE
- Publication number 20240063154
- Publication date Feb 22, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- EE JAN KHOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240014156
- Publication date Jan 11, 2024
- Fuji Electric Co., Ltd.
- Yasuaki HOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20230395532
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260936
- Publication date Aug 17, 2023
- Amazing Cool Technology Corp
- Shiann-Tsong TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187393
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOC...
- Publication number 20230063954
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20230055518
- Publication date Feb 23, 2023
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Structure for Metal Pattern
- Publication number 20230052604
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...
- Publication number 20230032635
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Simone Dario MARIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVED WAFER COATING
- Publication number 20220367390
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Feng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING PANEL, METHOD MANUFACTURING THE SAME, AND DISPLAY DE...
- Publication number 20220320143
- Publication date Oct 6, 2022
- TCL China Star Optoelectronics Technology Co., Ltd.
- Maoxia Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20220285301
- Publication date Sep 8, 2022
- Fuji Electric Co., Ltd.
- Yasuaki HOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SENSOR DEVICE
- Publication number 20220252534
- Publication date Aug 11, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- EE JAN KHOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONT...
- Publication number 20220216244
- Publication date Jul 7, 2022
- ams AG
- Gerhard EILMSTEINER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220181279
- Publication date Jun 9, 2022
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20220157749
- Publication date May 19, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20220028812
- Publication date Jan 27, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20210398822
- Publication date Dec 23, 2021
- PEP INNOVATION PTE LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20210375792
- Publication date Dec 2, 2021
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER
- Publication number 20210358874
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Hyung Sun JANG
- H01 - BASIC ELECTRIC ELEMENTS

Applying permanent coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a sensor device having moisture sensitive dielect...

Semiconductor wafer and method of ball drop on thin wafer with edge...

Chip packaging method and package structure

Semiconductor module and method of manufacturing semiconductor module

Semiconductor device with metal film on surface between passivation...

Chip package and method of forming a chip package

Chip package, method of forming a chip package and method of formin...

Solder ball application for singular die

Flip chip package structure and manufacturing method thereof

Methods and apparatus for processing a substrate

Driving substrate and manufacturing method thereof, and micro LED b...

Integrated circuit chip including a passivation nitride layer in co...

Bonding process with inhibited oxide formation

Wafer-level package including under bump metal layer

Conductive buffer layers for semiconductor die assemblies and assoc...

Method of forming a sensor device

Semiconductor device and method of manufacturing the same

Conductive barrier direct hybrid bonding

Semiconductor module and method of manufacturing semiconductor module

Light-emitting panel, method manufacturing the same, and display de...

Semiconductor structure including buffer layer

Wafer-level package including under bump metal layer

Chip package and method of forming a chip package

Power semiconductor chip, method for producing a power semiconducto...

Semiconductor device

Semiconductor device bonding area including fused solder film and m...

Solder ball application for singular die

Semiconductor structure having counductive bump with tapered portio...

Bonding process with inhibited oxide formation

Semiconductor package and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR IMPROVED WAFER COATING

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE

CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOC...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...

THICK REDISTRIBUTION LAYER FEATURES

METHOD OF FORMING A SENSOR DEVICE

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

FLIP CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

CONDUCTIVE BUFFER LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOC...

Solder Ball Application for Singular Die

Passivation Structure for Metal Pattern

INTEGRATED CIRCUIT CHIP INCLUDING A PASSIVATION NITRIDE LAYER IN CO...

METHOD AND APPARATUS FOR IMPROVED WAFER COATING

LIGHT-EMITTING PANEL, METHOD MANUFACTURING THE SAME, AND DISPLAY DE...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

METHOD OF FORMING A SENSOR DEVICE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONT...

SEMICONDUCTOR DEVICE

Solder Ball Application for Singular Die

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

CHIP PACKAGING METHOD AND PACKAGE STRUCTURE

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER