Applying permanent coating

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CPC
H01L2224/8192

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8192Applying permanent coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device assembly with graded modulus underfill and ass...
- Patent number 11,682,563
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with graded modulus underfill and ass...
- Patent number 11,404,289
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for connecting components
- Patent number 11,355,472
- Issue date Jun 7, 2022
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with a thermally conductive underfill
- Patent number 10,867,958
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,847,485
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcement for electrical connectors
- Patent number 10,700,037
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, LED module and method
- Patent number 10,361,178
- Issue date Jul 23, 2019
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with a thermally conductive underfill and method...
- Patent number 10,269,757
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic apparatus, moving object, and method...
- Patent number 10,249,513
- Issue date Apr 2, 2019
- Seiko Epson Corporation
- Manabu Kondo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Capacitor formed on heavily doped substrate
- Patent number 10,217,810
- Issue date Feb 26, 2019
- Microchip Technology Incorporated
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light engine array
- Patent number 10,205,055
- Issue date Feb 12, 2019
- Hiphoton Co., Ltd.
- Chen-Fu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding process and structure
- Patent number 10,128,209
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,115,877
- Issue date Oct 30, 2018
- Nichia Corporation
- Masatsugu Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for connecting packages onto printed circuit b...
- Patent number 10,068,873
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures having a tapering curved profile and methods of making same
- Patent number 10,008,459
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of forming same
- Patent number 9,966,346
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contacts having varying widths and method of manufacturi...
- Patent number 9,953,939
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable device assembly
- Patent number 9,893,030
- Issue date Feb 13, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light engine array
- Patent number 9,831,387
- Issue date Nov 28, 2017
- Hiphoton Co., Ltd.
- Chen-Fu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic apparatus, moving object, and method...
- Patent number 9,754,803
- Issue date Sep 5, 2017
- Seiko Epson Corporation
- Manabu Kondo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method to provide die attach stress relief using gold stud bumps
- Patent number 9,754,914
- Issue date Sep 5, 2017
- Rosemount Aerospace Inc.
- Jim Golden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for connecting packages onto printed circuit b...
- Patent number 9,698,118
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING LIGHT-EMITTING UNIT AND LIGHT-EMITTING UNIT
- Publication number 20230207756
- Publication date Jun 29, 2023
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...
- Publication number 20230005878
- Publication date Jan 5, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...
- Publication number 20220328326
- Publication date Oct 13, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...
- Publication number 20220068666
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210066230
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200203300
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS
- Publication number 20190252345
- Publication date Aug 15, 2019
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit with a Thermally Conductive Underfill and Method...
- Publication number 20190252346
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED DIE SEMICONDUCTOR DEVICE
- Publication number 20180342483
- Publication date Nov 29, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT ENGINE ARRAY
- Publication number 20180047876
- Publication date Feb 15, 2018
- HIPHOTON CO., LTD.
- CHEN-FU CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD...
- Publication number 20170330766
- Publication date Nov 16, 2017
- SEIKO EPSON CORPORATION
- Manabu KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Connecting Packages onto Printed Circuit B...
- Publication number 20170301645
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor Formed On Heavily Doped Substrate
- Publication number 20170162648
- Publication date Jun 8, 2017
- MICROCHIP TECHNOLOGY INCORPORATED
- Greg Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE CONNECTION STRUCTURE AND ELECTRODE CONNECTION METHOD
- Publication number 20160225730
- Publication date Aug 4, 2016
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE BY USING FLIP-CHIP BONDING
- Publication number 20160204077
- Publication date Jul 14, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Hyun Mo Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure and Method of Forming Same
- Publication number 20150357301
- Publication date Dec 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVING THERMAL PERFORMANCE OF FLIP CHIP PACKAGES
- Publication number 20150243580
- Publication date Aug 27, 2015
- SKYWORKS SOLUTIONS, INC.
- Jaydutt Jagdish Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES
- Publication number 20150228615
- Publication date Aug 13, 2015
- Sanmina Corporation
- Paul Sweere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELIABLE DEVICE ASSEMBLY
- Publication number 20140376200
- Publication date Dec 25, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD...
- Publication number 20140293565
- Publication date Oct 2, 2014
- SEIKO EPSON CORPORATION
- Manabu KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES
- Publication number 20140263585
- Publication date Sep 18, 2014
- Sanmina Corporation
- Paul Sweere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Connecting Packages onto Printed Circuit B...
- Publication number 20140252593
- Publication date Sep 11, 2014
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE
- Publication number 20140197503
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Wombacher
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Applying permanent coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package structure

Solderless interconnection structure and method of forming same

Method of direct bonding semiconductor components

Semiconductor device assembly with graded modulus underfill and ass...

Chip package structure

Semiconductor device assembly with graded modulus underfill and ass...

Package structure and method for connecting components

Solderless interconnection structure and method of forming same

Integrated circuit with a thermally conductive underfill

Chip package structure and method for forming the same

Bonding package components through plating

Reinforcement for electrical connectors

Bonding package components through plating

Interconnection structure, LED module and method

Solderless interconnection structure and method of forming same

Integrated circuit with a thermally conductive underfill and method...

Electronic device, electronic apparatus, moving object, and method...

Capacitor formed on heavily doped substrate

Light engine array

Wafer bonding process and structure

Method for manufacturing semiconductor device

Method and apparatus for connecting packages onto printed circuit b...

Structures having a tapering curved profile and methods of making same

Bump structure and method of forming same

Conductive contacts having varying widths and method of manufacturi...

Reliable device assembly

Light engine array

Electronic device, electronic apparatus, moving object, and method...

Method to provide die attach stress relief using gold stud bumps

Method and apparatus for connecting packages onto printed circuit b...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

METHOD FOR PRODUCING LIGHT-EMITTING UNIT AND LIGHT-EMITTING UNIT

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...

SEMICONDUCTOR DEVICE ASSEMBLY WITH GRADED MODULUS UNDERFILL AND ASS...

Solderless Interconnection Structure and Method of Forming Same

METHOD FOR BONDING SEMICONDUCTOR COMPONENTS

CHIP PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Bonding Package Components Through Plating

Solderless Interconnection Structure and Method of Forming Same

PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS

Integrated Circuit with a Thermally Conductive Underfill and Method...

ANGLED DIE SEMICONDUCTOR DEVICE

LIGHT ENGINE ARRAY

ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD...

Method and Apparatus for Connecting Packages onto Printed Circuit B...

Capacitor Formed On Heavily Doped Substrate

ELECTRODE CONNECTION STRUCTURE AND ELECTRODE CONNECTION METHOD

METHOD FOR MANUFACTURING ELECTRONIC DEVICE BY USING FLIP-CHIP BONDING

Bump Structure and Method of Forming Same

METHODS FOR IMPROVING THERMAL PERFORMANCE OF FLIP CHIP PACKAGES

METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES

RELIABLE DEVICE ASSEMBLY

ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD...

METHOD FOR FORMING INTERPOSERS AND STACKED MEMORY DEVICES

Method and Apparatus for Connecting Packages onto Printed Circuit B...

SENSOR PACKAGE