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Arrangements for reducing stress or warp in rigid printed circuit boards

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  • H05K1/0271
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC DEVICE AND PACKAGE STRUCTURE
    • Publication number 20240155758
    • Publication date May 9, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chien Lin CHANG CHIEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...
    • Publication number 20240155759
    • Publication date May 9, 2024
    • International Business Machines Corporation
    • Shawn Anthony Hall
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
    • Publication number 20240155760
    • Publication date May 9, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuji YUKIIRI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240121889
    • Publication date Apr 11, 2024
    • Innolux Corporation
    • Chi-Liang Chang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD ASSEMBLY WITH REDUCED HEIGHT AND REDUCED WIDTH, CAMER...
    • Publication number 20240098888
    • Publication date Mar 21, 2024
    • Rayprus Technology (Foshan) Co., Ltd.
    • HAN-RU ZHANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20240098894
    • Publication date Mar 21, 2024
    • SAMSUNG DISPLAY CO., LTD.
    • Hyung Jin KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAMERA MODULE
    • Publication number 20240089570
    • Publication date Mar 14, 2024
    • LG Innotek Co., Ltd.
    • Won Seob SHIN
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    CIRCUIT MOUNTING ASSEMBLIES
    • Publication number 20240090115
    • Publication date Mar 14, 2024
    • HAMILTON SUNDSTRAND CORPORATION
    • Francis C. Belisle
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
    • Publication number 20240074042
    • Publication date Feb 29, 2024
    • Huawei Technologies Co., Ltd
    • Yulong Wu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE AND METHOD FOR MAKING THE SAME
    • Publication number 20240057249
    • Publication date Feb 15, 2024
    • JCET STATS ChipPAC Korea Limited
    • SeungHyun LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240057253
    • Publication date Feb 15, 2024
    • LG Innotek Co., Ltd.
    • Sang Myung LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND...
    • Publication number 20240057265
    • Publication date Feb 15, 2024
    • Micron Technology, Inc.
    • Kelvin Tan Aik Boo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING...
    • Publication number 20240018295
    • Publication date Jan 18, 2024
    • TAIYO INK MFG. CO., LTD.
    • Meiten KOH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS
    • Publication number 20230422389
    • Publication date Dec 28, 2023
    • Intel Corporation
    • Prabhakar Subrahmanyam
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230413425
    • Publication date Dec 21, 2023
    • LG Innotek Co., Ltd.
    • Myung Jae KWON
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230403787
    • Publication date Dec 14, 2023
    • LG Innotek Co., Ltd.
    • Seong Hwan IM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ILLUMINATED KEYBOARD AND BACKLIGHT MODULE THEREOF
    • Publication number 20230380054
    • Publication date Nov 23, 2023
    • CHICONY ELECTRONICS CO., LTD.
    • CHIA-HSIN CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230380055
    • Publication date Nov 23, 2023
    • IBIDEN CO., LTD.
    • Masataka KATO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Ceramic Circuit Board And Semiconductor Device Using Same
    • Publication number 20230380060
    • Publication date Nov 23, 2023
    • Kabushiki Kaisha Toshiba
    • Takayuki NABA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITE LAYER CIRCUIT ELEMENT
    • Publication number 20230377904
    • Publication date Nov 23, 2023
    • InnoLux Corporation
    • Chuan-Ming Yeh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAMERA MODULE
    • Publication number 20230371170
    • Publication date Nov 16, 2023
    • LG Innotek Co., Ltd.
    • Won Seob SHIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PCB STIFFENING STRUCTURE TO PREVENT WARPING
    • Publication number 20230345629
    • Publication date Oct 26, 2023
    • Dell Products L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHIP PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME
    • Publication number 20230335507
    • Publication date Oct 19, 2023
    • SJ Semiconductor (Jiangyin ) Corporation
    • Chengchung Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EMC FILTER FOR A CONTROL DEVICE
    • Publication number 20230328874
    • Publication date Oct 12, 2023
    • ROBERT BOSCH GmbH
    • Rupert Fackler
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
    • Publication number 20230328877
    • Publication date Oct 12, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Yukiya YAMAGUCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LAMINATED STRUCTURE WITH PADS AND MANUFACTURING METHOD THEREOF
    • Publication number 20230319991
    • Publication date Oct 5, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Cheng Hou
    • G01 - MEASURING TESTING
  • Information Patent Application

    SEMICONDUCTOR MEMORY SYSTEM
    • Publication number 20230307433
    • Publication date Sep 28, 2023
    • Kioxia Corporation
    • Hayato MASUBUCHI
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    ELECTRONIC APPARATUS
    • Publication number 20230307315
    • Publication date Sep 28, 2023
    • KIOXIA Corporation
    • Kazuyuki MATSUZAKI
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Reinforcement Structure and Electronic Device
    • Publication number 20230290743
    • Publication date Sep 14, 2023
    • Huawei Technologies Co., Ltd
    • Zhenxing Xiong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAMINATE FOR CIRCUIT BOARD
    • Publication number 20230292433
    • Publication date Sep 14, 2023
    • Tokuyama Corporation
    • Eiki TSUSHIMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR