Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325

Industry

CPC
B81C1/00333

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00333Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sound producing package structure including sound producing membran...
- Patent number 12,172,887
- Issue date Dec 24, 2024
- xMEMS Labs, Inc.
- Chiung C. Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond wave optimization method and device
- Patent number 12,162,749
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 12,133,049
- Issue date Oct 29, 2024
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level packaging of MEMS
- Patent number 12,091,311
- Issue date Sep 17, 2024
- Texas Instruments Incorporated
- Stuart M. Jacobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-height optoelectronic modules and packages
- Patent number 12,037,238
- Issue date Jul 16, 2024
- ams Sensors Singapore Pte. Ltd.
- Javier Miguel Sànchez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,017,910
- Issue date Jun 25, 2024
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed, toughened glass package and method for produci...
- Patent number 11,993,511
- Issue date May 28, 2024
- Schott AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS resonator system
- Patent number 11,987,495
- Issue date May 21, 2024
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wire-bond damper for shock absorption
- Patent number 11,987,494
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed transparent cavity and package for same
- Patent number 11,975,962
- Issue date May 7, 2024
- Schott AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hollow package and method for manufacturing same
- Patent number 11,955,394
- Issue date Apr 9, 2024
- Nippon Kayaku Kabushiki Kaisha
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS encapsulation employing lower pressure and higher pressure dep...
- Patent number 11,834,331
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond wave optimization method and device
- Patent number 11,834,332
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 11,800,297
- Issue date Oct 24, 2023
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package and forming method thereof
- Patent number 11,772,962
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Nang Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,708,264
- Issue date Jul 25, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package comprising multi-depth trenches
- Patent number 11,667,522
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 11,524,892
- Issue date Dec 13, 2022
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,505,452
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,417,576
- Issue date Aug 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and a manufacturing method thereof
- Patent number 11,388,525
- Issue date Jul 12, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,370,656
- Issue date Jun 28, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked structure and method for manufacturing the same
- Patent number 11,332,363
- Issue date May 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Chieh-An Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and methods and apparatus to produce such sem...
- Patent number 11,296,016
- Issue date Apr 5, 2022
- Texas Instruments Incorporated
- Robert Allan Neidorff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for packaging a microelectromechanical systems device
- Patent number 11,286,157
- Issue date Mar 29, 2022
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a MEMS device by first hybrid bonding a CM...
- Patent number 11,279,615
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,257,727
- Issue date Feb 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and processes
- Patent number 11,197,103
- Issue date Dec 7, 2021
- Cirrus Logic, Inc.
- Marek Sebastian Piechocinski
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Covering for a component and method for producing a covering for a...
- Patent number 11,180,364
- Issue date Nov 23, 2021
- Snaptrack, Inc.
- Ansgar Schäufele
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20240391761
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROCHEMICAL REDUCTION OF CARBON DIOXIDE
- Publication number 20240351861
- Publication date Oct 24, 2024
- Japan Science and Technology Agency
- Osamu ISHITANI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD
- Publication number 20240076181
- Publication date Mar 7, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20240015447
- Publication date Jan 11, 2024
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20230391611
- Publication date Dec 7, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRE-BOND DAMPER FOR SHOCK ABSORPTION
- Publication number 20230382720
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bond Wave Optimization Method and Device
- Publication number 20230382723
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MA...
- Publication number 20230146158
- Publication date May 11, 2023
- Murata Manufacturing Co., Ltd.
- Kaoru KISHIGUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fabrication Method of MEMS Transducer Element
- Publication number 20230146234
- Publication date May 11, 2023
- TE Connectivity Solutions GMBH
- Jean-Francois Le Neal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...
- Publication number 20230110259
- Publication date Apr 13, 2023
- STMicroelectronics (Malta) Ltd.
- Kevin FORMOSA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COVER FOR AN INFRARED DETECTOR AND A METHOD OF FABRICATING A COVER...
- Publication number 20230084280
- Publication date Mar 16, 2023
- Meridian Innovation Pte Ltd
- Xintong ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20230067539
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOND WAVE OPTIMIZATION METHOD AND DEVICE
- Publication number 20230043571
- Publication date Feb 9, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20220415734
- Publication date Dec 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20220356059
- Publication date Nov 10, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED TRANSPARENT CAVITY AND PACKAGE FOR SAME
- Publication number 20220348457
- Publication date Nov 3, 2022
- SCHOTT AG
- Thomas Zetterer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ENCAPSULATION EMPLOYING LOWER PRESSURE AND HIGHER PRESSURE DEP...
- Publication number 20220324702
- Publication date Oct 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert SUMMERFELT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...
- Publication number 20220204340
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20220191624
- Publication date Jun 16, 2022
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRE-BOND DAMPER FOR SHOCK ABSORPTION
- Publication number 20220162058
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED TRANSPARENT CAVITY AND PACKAGE FOR SAME
- Publication number 20220144627
- Publication date May 12, 2022
- SCHOTT AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED, TOUGHENED GLASS PACKAGE AND METHOD FOR PRODUCI...
- Publication number 20220135398
- Publication date May 5, 2022
- SCHOTT AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Hollow Package And Method For Manufacturing Same
- Publication number 20220068737
- Publication date Mar 3, 2022
- SUMITOMO BAKELITE CO., LTD.
- Tadashi Naito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220009768
- Publication date Jan 13, 2022
- xMEMS Labs, Inc.
- Chiung C. Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Manufacturing Three-Dimensionally Structured Member, Met...
- Publication number 20210278433
- Publication date Sep 9, 2021
- TOKYO KEIKI INC.
- Kazuaki TANI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20210179421
- Publication date Jun 17, 2021
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF RAPID ENCAPSULATION OF MICROELECTRONIC DEVICES
- Publication number 20210166954
- Publication date Jun 3, 2021
- Carbon, Inc.
- James Patrick Troise
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210130166
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE
- Publication number 20210078858
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sound producing package structure including sound producing membran...

Bond wave optimization method and device

Reduced light reflection package

Wafer level packaging of MEMS

Low-height optoelectronic modules and packages

Method of manufacturing electronic devices and corresponding electr...

Hermetically sealed, toughened glass package and method for produci...

MEMS resonator system

Wire-bond damper for shock absorption

Hermetically sealed transparent cavity and package for same

Hollow package and method for manufacturing same

MEMS device having a metallization structure embedded in a dielectr...

MEMS encapsulation employing lower pressure and higher pressure dep...

Bond wave optimization method and device

Reduced light reflection package

MEMS package and forming method thereof

Stacked-die MEMS resonator

MEMS package comprising multi-depth trenches

Method of manufacturing electronic devices and corresponding electr...

Semiconductor device

Seal for microelectronic assembly

MEMS microphone and a manufacturing method thereof

Stacked-die MEMS resonator

Stacked structure and method for manufacturing the same

Semiconductor devices and methods and apparatus to produce such sem...

Methods for packaging a microelectromechanical systems device

Method for manufacturing a MEMS device by first hybrid bonding a CM...

Seal for microelectronic assembly

MEMS devices and processes

Covering for a component and method for producing a covering for a...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

ELECTROCHEMICAL REDUCTION OF CARBON DIOXIDE

MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD

REDUCED LIGHT REFLECTION PACKAGE

SEAL FOR MICROELECTRONIC ASSEMBLY

STACKED-DIE MEMS RESONATOR

WIRE-BOND DAMPER FOR SHOCK ABSORPTION

Bond Wave Optimization Method and Device

PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MA...

Fabrication Method of MEMS Transducer Element

METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...

COVER FOR AN INFRARED DETECTOR AND A METHOD OF FABRICATING A COVER...

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

BOND WAVE OPTIMIZATION METHOD AND DEVICE

SEAL FOR MICROELECTRONIC ASSEMBLY

STACKED-DIE MEMS RESONATOR

HERMETICALLY SEALED TRANSPARENT CAVITY AND PACKAGE FOR SAME

MEMS ENCAPSULATION EMPLOYING LOWER PRESSURE AND HIGHER PRESSURE DEP...

METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...

REDUCED LIGHT REFLECTION PACKAGE

WIRE-BOND DAMPER FOR SHOCK ABSORPTION

HERMETICALLY SEALED TRANSPARENT CAVITY AND PACKAGE FOR SAME

HERMETICALLY SEALED, TOUGHENED GLASS PACKAGE AND METHOD FOR PRODUCI...

Hollow Package And Method For Manufacturing Same

SOUND PRODUCING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Method for Manufacturing Three-Dimensionally Structured Member, Met...

STACKED-DIE MEMS RESONATOR

METHOD OF RAPID ENCAPSULATION OF MICROELECTRONIC DEVICES

STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE