Assemblies of semiconductor devices on lead frames

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H01L23/49575

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49575Assemblies of semiconductor devices on lead frames

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High power module package structures
- Patent number 12,230,601
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stackable electronic power device for surface mounting and...
- Patent number 12,230,555
- Issue date Feb 18, 2025
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,224,231
- Issue date Feb 11, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD protection device
- Patent number 12,224,579
- Issue date Feb 11, 2025
- Nexperia B.V.
- Hans-Martin Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency package implementing a window frame with edge plati...
- Patent number 12,224,217
- Issue date Feb 11, 2025
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having integrated passive device(s) between leads
- Patent number 12,218,036
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, semiconductor package and method
- Patent number 12,218,038
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,211,704
- Issue date Jan 28, 2025
- Siliconix incorporated
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and lead frame with enhanced device isolation
- Patent number 12,211,770
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having first and second lead frames
- Patent number 12,211,824
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and related methods
- Patent number 12,211,771
- Issue date Jan 28, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor package
- Patent number 12,205,869
- Issue date Jan 21, 2025
- Mediatek Inc.
- You-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package
- Patent number 12,205,873
- Issue date Jan 21, 2025
- TDK Corporation
- Yosuke Komasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wire bond joints
- Patent number 12,205,874
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Mohd Kahar Bajuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,191,237
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-channel gate driver package with grounded shield metal
- Patent number 12,191,259
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,191,289
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal isolator having enhanced creepage characteristics
- Patent number 12,183,662
- Issue date Dec 31, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 12,183,693
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating substrate and power module using the same
- Patent number 12,183,654
- Issue date Dec 31, 2024
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,271
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with multiple heat channels
- Patent number 12,176,274
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank
- Patent number 12,176,272
- Issue date Dec 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,176,275
- Issue date Dec 24, 2024
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage electronic device with high relative permit...
- Patent number 12,170,164
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR PACKAGE
- Publication number 20250062290
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20250063876
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Masahiko KOBAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SEMICONDUCTOR DIE CURRENT SENSOR INTEGRATED CIRCUIT
- Publication number 20250062198
- Publication date Feb 20, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Matthew Hein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...
- Publication number 20250054844
- Publication date Feb 13, 2025
- Realtek Semiconductor Corp.
- Yu-Hsin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-CHIP STRUCTURE WITH ENHANCED PROTECTION
- Publication number 20250054827
- Publication date Feb 13, 2025
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Wan-Lan CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250054829
- Publication date Feb 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Po-Chih PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054927
- Publication date Feb 13, 2025
- Rohm Co., Ltd.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CONCAVE WETTABILITY AND/OR METALLIZATION LAYER
- Publication number 20250054842
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Rowel TABAJONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING A LEAD FRAME THAT PROVIDES SUBSTRATE SUPPORT AN...
- Publication number 20250054840
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
- Publication number 20250054843
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20250046686
- Publication date Feb 6, 2025
- LITE-ON SINGAPORE PTE. LTD.
- YOU-FA WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046687
- Publication date Feb 6, 2025
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20250046773
- Publication date Feb 6, 2025
- ROHM CO., LTD.
- Masanobu TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20250046671
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH LEAD LOCK
- Publication number 20250038077
- Publication date Jan 30, 2025
- TEXAS INSTRUMENTS INCORPORATED
- CHU-YUN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038737
- Publication date Jan 30, 2025
- Mitsubishi Electric Corporation
- Teruaki NAGAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022779
- Publication date Jan 16, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sijoong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE DEVICE
- Publication number 20250022846
- Publication date Jan 16, 2025
- FORCE MOS TECHNOLOGY CO., LTD.
- YUAN-SHUN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS
- Publication number 20250022831
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Nam Khong THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE
- Publication number 20250022782
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Package With Galvanic Isolation
- Publication number 20250014971
- Publication date Jan 9, 2025
- Infineon Technologies Austria AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...
- Publication number 20250014972
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Tomasz NAEVE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF PRODUCING A POWER SEMICOND...
- Publication number 20250006601
- Publication date Jan 2, 2025
- INFINEON TECHNOLOGIES AG
- Achim Althaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006604
- Publication date Jan 2, 2025
- DENSO CORPORATION
- Kazuki YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF
- Publication number 20250006596
- Publication date Jan 2, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250006775
- Publication date Jan 2, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES
- Publication number 20250006603
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL LEADFRAME SEMICONDUCTOR DEVICE AND METHOD THEREFOR
- Publication number 20240429137
- Publication date Dec 26, 2024
- NXP B.V.
- Hsin-En Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429139
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS

Assemblies of semiconductor devices on lead frames

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High power module package structures

Semiconductor device and method of forming micro interconnect struc...

Packaged stackable electronic power device for surface mounting and...

Semiconductor module

ESD protection device

Radio frequency package implementing a window frame with edge plati...

Package substrate having integrated passive device(s) between leads

Leadframe, semiconductor package and method

Semiconductor device and method of manufacturing the same

Semiconductor package having side wall plating

Semiconductor package and lead frame with enhanced device isolation

Power semiconductor package having first and second lead frames

Power module and related methods

Method for forming a semiconductor package

Electronic component package

Submodule semiconductor package

Semiconductor package with wire bond joints

Semiconductor module

Multi-channel gate driver package with grounded shield metal

Semiconductor device

Signal isolator having enhanced creepage characteristics

Integrated magnetic assembly with conductive field plates

Insulating substrate and power module using the same

Floating die package

Semiconductor device

Multi-die package with multiple heat channels

Semiconductor package with wettable flank

Semiconductor device and a method of manufacturing a semiconductor...

Integrated high voltage electronic device with high relative permit...

Semiconductor device

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR PACKAGE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...

SEMICONDUCTOR DEVICE

DUAL SEMICONDUCTOR DIE CURRENT SENSOR INTEGRATED CIRCUIT

LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...

STACKED MULTI-CHIP STRUCTURE WITH ENHANCED PROTECTION

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

PACKAGE WITH CONCAVE WETTABILITY AND/OR METALLIZATION LAYER

POWER MODULE HAVING A LEAD FRAME THAT PROVIDES SUBSTRATE SUPPORT AN...

Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...

CAPACITIVE COUPLING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

INSULATION CHIP AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

ELECTRONIC DEVICE WITH LEAD LOCK

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

MULTI-CHIP PACKAGE DEVICE

SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS

HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE

Power Package With Galvanic Isolation

PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...

POWER SEMICONDUCTOR MODULE AND METHOD OF PRODUCING A POWER SEMICOND...

SEMICONDUCTOR DEVICE

QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES

DUAL LEADFRAME SEMICONDUCTOR DEVICE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE