Assemblies of semiconductor devices on lead frames

Industry

CPC
H01L23/49575

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49575Assemblies of semiconductor devices on lead frames

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 12,315,826
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,315,771
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wire pieces in bonding member
- Patent number 12,315,825
- Issue date May 27, 2025
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method for producing the same
- Patent number 12,308,359
- Issue date May 20, 2025
- Osram Opto Semiconductors GmbH
- Andreas Dobner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 12,300,689
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat sink with exposed side from enc...
- Patent number 12,300,584
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge bend for isolation packages
- Patent number 12,293,953
- Issue date May 6, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for a cascode semiconductor device
- Patent number 12,293,961
- Issue date May 6, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
- Patent number 12,293,972
- Issue date May 6, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,283,539
- Issue date Apr 22, 2025
- Mitsubishi Electric Corporation
- Yuki Matsutaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,566
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,278,171
- Issue date Apr 15, 2025
- Infineon Technologies AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, electrical component, and connection structur...
- Patent number 12,278,170
- Issue date Apr 15, 2025
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packaging with galvanic isolation
- Patent number 12,278,169
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina Estacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 12,278,158
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,272,627
- Issue date Apr 8, 2025
- Kabushiki Kaisha Toshiba
- Hiroshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a drain back contact electrode, met...
- Patent number 12,272,743
- Issue date Apr 8, 2025
- GPOWER SEMICONDUCTOR, INC.
- Junfeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent power module containing exposed surfaces of transistor...
- Patent number 12,249,562
- Issue date Mar 11, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank and related methods
- Patent number 12,243,810
- Issue date Mar 4, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacture of semiconductor de...
- Patent number 12,237,248
- Issue date Feb 25, 2025
- AOI Electronics Co., Ltd.
- Katsuhiro Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,230,601
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stackable electronic power device for surface mounting and...
- Patent number 12,230,555
- Issue date Feb 18, 2025
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,224,231
- Issue date Feb 11, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency package implementing a window frame with edge plati...
- Patent number 12,224,217
- Issue date Feb 11, 2025
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER
- Publication number 20250183133
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chun Ping Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION
- Publication number 20250183111
- Publication date Jun 5, 2025
- Joby Aero, Inc.
- Robert Ramm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT
- Publication number 20250183124
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill for Large Area Attaches for Semiconductor Packages
- Publication number 20250183119
- Publication date Jun 5, 2025
- Wolfspeed, Inc.
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-BASED INTEGRATED TRANSFORMER PACKAGES
- Publication number 20250174611
- Publication date May 29, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH RECESSED TERMINALS
- Publication number 20250167082
- Publication date May 22, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...
- Publication number 20250167081
- Publication date May 22, 2025
- Wolfspeed, Inc.
- Ajit R. Kanale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157913
- Publication date May 15, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20250149412
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250140656
- Publication date May 1, 2025
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250140660
- Publication date May 1, 2025
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250140652
- Publication date May 1, 2025
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140658
- Publication date May 1, 2025
- Fuji Electric Co., Ltd.
- Masanori TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20250140657
- Publication date May 1, 2025
- IDEAL SEMICONDUCTOR DEVICES, INC.
- Ryan Thorpe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20250140659
- Publication date May 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...
- Publication number 20250133803
- Publication date Apr 24, 2025
- MURATA MANUFACTURING CO., LTD.
- David GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOTTED CLIPS FOR REDUCTION OF MOLDING COMPOUND DELAMINATION
- Publication number 20250132231
- Publication date Apr 24, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissi...
- Publication number 20250132233
- Publication date Apr 24, 2025
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...
- Publication number 20250132666
- Publication date Apr 24, 2025
- MURATA MANUFACTURING CO., LTD.
- David GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125693
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Shigemi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Bonded Semiconductor Die Package
- Publication number 20250125231
- Publication date Apr 17, 2025
- Wolfspeed, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND RELATED METHODS
- Publication number 20250125227
- Publication date Apr 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WETTABLE METALIZATION MULTILAYER WITH INCREASED ADHESION ENERGY, IN...
- Publication number 20250125232
- Publication date Apr 17, 2025
- STMicroelectronics International N.V.
- Brunella CAFRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBMODULE SEMICONDUCTOR PACKAGE
- Publication number 20250125297
- Publication date Apr 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
- Publication number 20250118635
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS HAVING SURFACE MOUNT PACKAGES HAVING CO-PACKED FIELD EFFE...
- Publication number 20250118638
- Publication date Apr 10, 2025
- Alpha and Omega Semiconductor International LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...
- Publication number 20250118636
- Publication date Apr 10, 2025
- LX Semicon Co., Ltd.
- Min Yup JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HIGH VOLTAGE ELECTRONIC DEVICE WITH HIGH RELATIVE PERMIT...
- Publication number 20250111987
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS

Assemblies of semiconductor devices on lead frames

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package assemblies with direct leadframe attac...

Semiconductor module

Semiconductor device having wire pieces in bonding member

Optoelectronic component and method for producing the same

Dual cool power module with stress buffer layer

Semiconductor device including heat sink with exposed side from enc...

Edge bend for isolation packages

Method of manufacture for a cascode semiconductor device

Semiconductor device and method of forming leadframe with clip bond...

Semiconductor device and method for manufacturing the same

Semiconductor device

Semiconductor device and method for manufacturing the same

Chip package and method of forming a chip package

Semiconductor module, electrical component, and connection structur...

Electronic device packaging with galvanic isolation

Leadframe spacer for double-sided power module

Semiconductor device

Semiconductor device comprising a drain back contact electrode, met...

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor manufacturing apparatus and method of manufacturing s...

Electronic devices in semiconductor package cavities

Intelligent power module containing exposed surfaces of transistor...

Packaged electronic device with film isolated power stack

Semiconductor package with wettable flank and related methods

Semiconductor device and method for manufacture of semiconductor de...

High power module package structures

Semiconductor device and method of forming micro interconnect struc...

Packaged stackable electronic power device for surface mounting and...

Semiconductor module

Radio frequency package implementing a window frame with edge plati...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER

POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION

MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT

Underfill for Large Area Attaches for Semiconductor Packages

LEADFRAME-BASED INTEGRATED TRANSFORMER PACKAGES

ELECTRONIC PACKAGE WITH RECESSED TERMINALS

REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...

SLOTTED CLIPS FOR REDUCTION OF MOLDING COMPOUND DELAMINATION

Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissi...

HYBRID POWER CONVERTERS, LATERAL DEVICES, VERTICAL DEVICES, MULTIPL...

SEMICONDUCTOR DEVICE

Direct Bonded Semiconductor Die Package

POWER MODULE AND RELATED METHODS

WETTABLE METALIZATION MULTILAYER WITH INCREASED ADHESION ENERGY, IN...

SUBMODULE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK

APPARATUS HAVING SURFACE MOUNT PACKAGES HAVING CO-PACKED FIELD EFFE...

HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...

INTEGRATED HIGH VOLTAGE ELECTRONIC DEVICE WITH HIGH RELATIVE PERMIT...