Assemblies of semiconductor devices on lead frames

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H01L23/49575

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49575Assemblies of semiconductor devices on lead frames

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing multi-die semiconductor devices and corresp...
- Patent number 12,368,055
- Issue date Jul 22, 2025
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,362,266
- Issue date Jul 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,264
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMDs integration on QFN by 3D stacked solution
- Patent number 12,354,932
- Issue date Jul 8, 2025
- STMicroelectronics S.r.l.
- Cristina Somma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standalone isolation capacitor
- Patent number 12,355,025
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,354,933
- Issue date Jul 8, 2025
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,354,934
- Issue date Jul 8, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,756
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having galvanic isolation and method therefor
- Patent number 12,347,753
- Issue date Jul 1, 2025
- NXP USA, INC.
- Jerry Rudiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,347,755
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with load terminals on which coupled power component and lo...
- Patent number 12,347,754
- Issue date Jul 1, 2025
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual die integrated circuit system in an integrated circuit package...
- Patent number 12,341,138
- Issue date Jun 24, 2025
- TDK-MICRONAS GMBH
- Paolo Marozzi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 12,341,080
- Issue date Jun 24, 2025
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 12,336,231
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including vent openings and associated methods
- Patent number 12,334,405
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Michael Stadler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced electronic packages for GaN power integrated cir...
- Patent number 12,334,421
- Issue date Jun 17, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Daniel M. Kinzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for a multi-phase motor driving circuit
- Patent number 12,327,993
- Issue date Jun 10, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Chung-Kuang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 12,315,826
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,315,771
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wire pieces in bonding member
- Patent number 12,315,825
- Issue date May 27, 2025
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method for producing the same
- Patent number 12,308,359
- Issue date May 20, 2025
- Osram Opto Semiconductors GmbH
- Andreas Dobner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 12,300,689
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat sink with exposed side from enc...
- Patent number 12,300,584
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge bend for isolation packages
- Patent number 12,293,953
- Issue date May 6, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for a cascode semiconductor device
- Patent number 12,293,961
- Issue date May 6, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming leadframe with clip bond...
- Patent number 12,293,972
- Issue date May 6, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Natawat Kasikornrungroj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,283,539
- Issue date Apr 22, 2025
- Mitsubishi Electric Corporation
- Yuki Matsutaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,566
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,278,171
- Issue date Apr 15, 2025
- Infineon Technologies AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IC PACKAGE WITH DIE AND COPPER POSTS
- Publication number 20250239507
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GUANGXU LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250239559
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Takashi TSUBAKIDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233085
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION
- Publication number 20250233055
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250233099
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Ryosuke FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE SEMICONDUCTOR PACKAGE
- Publication number 20250226295
- Publication date Jul 10, 2025
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...
- Publication number 20250226298
- Publication date Jul 10, 2025
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEM...
- Publication number 20250219029
- Publication date Jul 3, 2025
- MURATA MANUFACTURING CO., LTD.
- David M. GIULIANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE TRANSFORMER POWER MODULES
- Publication number 20250218908
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Giacomo CALABRESE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20250218886
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH RETAINING FEATURES
- Publication number 20250218907
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jefferson LUGUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250219019
- Publication date Jul 3, 2025
- ROHM CO., LTD.
- Akihiro KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20250210478
- Publication date Jun 26, 2025
- INFINEON TECHNOLOGIES AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE
- Publication number 20250210471
- Publication date Jun 26, 2025
- NXP B.V.
- Chanon SUWANKASAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20250210474
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Yoshiki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS
- Publication number 20250201675
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING A FLOATING PAD
- Publication number 20250201681
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hiroshi INOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...
- Publication number 20250201682
- Publication date Jun 19, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE
- Publication number 20250201680
- Publication date Jun 19, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Lung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20250194115
- Publication date Jun 12, 2025
- Kabushiki Kaisha Toshiba
- Jia LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING DEVICE
- Publication number 20250192009
- Publication date Jun 12, 2025
- ACTRON TECHNOLOGY CORPORATION
- PEN-HUNG HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20250192097
- Publication date Jun 12, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250192008
- Publication date Jun 12, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER
- Publication number 20250183133
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chun Ping Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION
- Publication number 20250183111
- Publication date Jun 5, 2025
- Joby Aero, Inc.
- Robert Ramm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT
- Publication number 20250183124
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill for Large Area Attaches for Semiconductor Packages
- Publication number 20250183119
- Publication date Jun 5, 2025
- Wolfspeed, Inc.
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-BASED INTEGRATED TRANSFORMER PACKAGES
- Publication number 20250174611
- Publication date May 29, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Harry Chandra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH RECESSED TERMINALS
- Publication number 20250167082
- Publication date May 22, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Assemblies of semiconductor devices on lead frames

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing multi-die semiconductor devices and corresp...

Low stress asymmetric dual side module

Semiconductor device

SMDs integration on QFN by 3D stacked solution

Standalone isolation capacitor

Semiconductor device

Method of manufacturing a semiconductor device

Semiconductor device

Semiconductor device having galvanic isolation and method therefor

Low stress asymmetric dual side module

Package with load terminals on which coupled power component and lo...

Dual die integrated circuit system in an integrated circuit package...

Semiconductor device stack-up with bulk substrate material to mitig...

Inverted leads for packaged isolation devices

Electronic devices including vent openings and associated methods

Thermally enhanced electronic packages for GaN power integrated cir...

Semiconductor package for a multi-phase motor driving circuit

Semiconductor device package assemblies with direct leadframe attac...

Semiconductor module

Semiconductor device having wire pieces in bonding member

Optoelectronic component and method for producing the same

Dual cool power module with stress buffer layer

Semiconductor device including heat sink with exposed side from enc...

Edge bend for isolation packages

Method of manufacture for a cascode semiconductor device

Semiconductor device and method of forming leadframe with clip bond...

Semiconductor device and method for manufacturing the same

Semiconductor device

Semiconductor device and method for manufacturing the same

Chip package and method of forming a chip package

Patents Applicationslast 30 patents

IC PACKAGE WITH DIE AND COPPER POSTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MULTI-DIE SEMICONDUCTOR PACKAGE

EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...

INTEGRATED CIRCUIT PACKAGES FOR FACILITATING POWER CONVERTER SYSTEM...

MULTI-DIE TRANSFORMER POWER MODULES

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

LEADFRAME WITH RETAINING FEATURES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS

WIRE BONDING USING A FLOATING PAD

SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...

INTELLIGENT POWER MODULE

ISOLATOR

DRIVING DEVICE

HIGH POWER MODULE PACKAGE STRUCTURES

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED LAMINATE TRANSFORMER

POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION

MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT

Underfill for Large Area Attaches for Semiconductor Packages

LEADFRAME-BASED INTEGRATED TRANSFORMER PACKAGES

ELECTRONIC PACKAGE WITH RECESSED TERMINALS