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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/95at chip-level

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of transferring micro-light emitting diode for LED display
- Patent number 12,205,931
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of an electronic apparatus
- Patent number 12,191,277
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ming-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,183,866
- Issue date Dec 31, 2024
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 12,176,334
- Issue date Dec 24, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly board for use in a display manufacturing method
- Patent number 12,176,225
- Issue date Dec 24, 2024
- LG Electronics Inc.
- Changhyun Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of forming the same
- Patent number 12,176,321
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,170,267
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and display device including rod shaped light...
- Patent number 12,155,018
- Issue date Nov 26, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,155,022
- Issue date Nov 26, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless architecture and processing strategy for EMIB-based substr...
- Patent number 12,142,567
- Issue date Nov 12, 2024
- Intel Corporation
- Xiao Di Sun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for integration of biological chips
- Patent number 12,128,377
- Issue date Oct 29, 2024
- MGI Tech Co., Ltd.
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Display device and method of fabricating the same
- Patent number 12,125,834
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Bek Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink leveling device and method of manufacturing display device usin...
- Patent number 12,113,047
- Issue date Oct 8, 2024
- Samsung Display Co., Ltd.
- Jung Hyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of micro light-emitting device and method of transferring...
- Patent number 12,113,150
- Issue date Oct 8, 2024
- Korea University Research and Business Foundation
- In Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip transferring and device/module having gas guiding st...
- Patent number 12,106,981
- Issue date Oct 1, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-flare semiconductor packages and related methods
- Patent number 12,107,102
- Issue date Oct 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method forming a semiconductor package device
- Patent number 12,094,727
- Issue date Sep 17, 2024
- Silicon Motion, Inc.
- Yi-Hung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale-aligned three-dimensional stacked integrated circuit
- Patent number 12,094,775
- Issue date Sep 17, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting structure
- Patent number 12,094,864
- Issue date Sep 17, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package having a chipse...
- Patent number 12,087,734
- Issue date Sep 10, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using semiconductor light-emitting elements and manu...
- Patent number 12,080,689
- Issue date Sep 3, 2024
- LG Electronics Inc.
- Dohee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for stress sensitive component and semiconductor device
- Patent number 12,074,134
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having an intermediate electrode between sub-areas a...
- Patent number 12,074,171
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Won Sik Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Integrating eWLB with E-bar Stru...
- Publication number 20250038101
- Publication date Jan 30, 2025
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240429255
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
- Publication number 20240429099
- Publication date Dec 26, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240421120
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240395587
- Publication date Nov 28, 2024
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MAKING
- Publication number 20240387500
- Publication date Nov 21, 2024
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...
- Publication number 20240379612
- Publication date Nov 14, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20240363585
- Publication date Oct 31, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355850
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355691
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor wafer and (micro) transfer printing process
- Publication number 20240355775
- Publication date Oct 24, 2024
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Ralf LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240347496
- Publication date Oct 17, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY
- Publication number 20240332239
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240332247
- Publication date Oct 3, 2024
- Nichia Corporation.
- Hiroaki KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240332204
- Publication date Oct 3, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Reinforcement Layer Structure and Manufactur...
- Publication number 20240332104
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321851
- Publication date Sep 26, 2024
- SAMSUNG ELECTERONICS CO., LTD.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240304560
- Publication date Sep 12, 2024
- DENSO CORPORATION
- Kazuki KUWATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH PACKAGE FOR MICROELECTRONICS
- Publication number 20240290757
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282760
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE
- Publication number 20240282737
- Publication date Aug 22, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Liang Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL-PACKAGE DEVICE WITH PERIPHERAL SIDE WALL PROTECTION
- Publication number 20240274484
- Publication date Aug 15, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240274565
- Publication date Aug 15, 2024
- WINBOND ELECTRONICS CORP.
- Yu-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...
- Publication number 20240258270
- Publication date Aug 1, 2024
- LG Display Co., Ltd.
- Sunghwan YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED DIRECT BONDED AND INTERCONNECTED STACK
- Publication number 20240243103
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL I/O DIE
- Publication number 20240243074
- Publication date Jul 18, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS

at chip-level

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of transferring micro-light emitting diode for LED display

Selective micro device transfer to receiver substrate

Manufacturing method of an electronic apparatus

Display device using micro LED, and manufacturing method therefor

Method for manufacturing display panel, display panel, and display...

Assembly board for use in a display manufacturing method

Dicing die attach film, and semiconductor package using the same an...

Semiconductor packages and method of forming the same

Semiconductor device and method of manufacture

Light emitting diode and display apparatus having the same

Light-emitting device and display device including rod shaped light...

Display device and method for manufacturing display device

Coreless architecture and processing strategy for EMIB-based substr...

Semiconductor device package and manufacturing method thereof

System and method for integration of biological chips

Display device and method of fabricating the same

Ink leveling device and method of manufacturing display device usin...

Semiconductor package with dual sides of metal routing

Structure of micro light-emitting device and method of transferring...

Method of chip transferring and device/module having gas guiding st...

Anti-flare semiconductor packages and related methods

Method forming a semiconductor package device

Nanoscale-aligned three-dimensional stacked integrated circuit

Light emitting structure

Method for forming chip packages and a chip package having a chipse...

Package with different types of semiconductor dies attached to a fl...

Display device using semiconductor light-emitting elements and manu...

Package for stress sensitive component and semiconductor device

Display device having an intermediate electrode between sub-areas a...

Selective transfer of micro devices

Patents Applicationslast 30 patents

Semiconductor Device and Method of Integrating eWLB with E-bar Stru...

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS

NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

TRANSFER SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS

MULTI-CHIP PACKAGE AND METHOD OF MAKING

APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...

SELECTIVE TRANSFER OF MICRO DEVICES

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR PACKAGE

Semiconductor wafer and (micro) transfer printing process

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

Component Carrier With Reinforcement Layer Structure and Manufactur...

SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SANDWICH PACKAGE FOR MICROELECTRONICS

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE

WAFER-LEVEL-PACKAGE DEVICE WITH PERIPHERAL SIDE WALL PROTECTION

DIE PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...

MOLDED DIRECT BONDED AND INTERCONNECTED STACK

COAXIAL I/O DIE