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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/95at chip-level

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Driving backplane, transfer method for light-emitting diode chip, d...
- Patent number 12,368,144
- Issue date Jul 22, 2025
- BOE Technology Group Co., Ltd.
- Zhijun Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-small LED electrode assembly
- Patent number 12,364,088
- Issue date Jul 15, 2025
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,356,716
- Issue date Jul 8, 2025
- Samsung Display Co., Ltd.
- Jong Hwan Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fault isolation, computer device, medium a...
- Patent number 12,347,093
- Issue date Jul 1, 2025
- China Electronics Reliability And Environmental Testing Institute
- Chao Pang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semifinished product for populating with components and, method for...
- Patent number 12,341,127
- Issue date Jun 24, 2025
- Siemens Aktiengesellschaft
- Nora Jeske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 12,341,139
- Issue date Jun 24, 2025
- Samsung Display Co., Ltd.
- Ki Yeup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,334,486
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- In Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance in hybrid bonded 3D die stacks
- Patent number 12,327,775
- Issue date Jun 10, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Massive parallel assembly method
- Patent number 12,327,751
- Issue date Jun 10, 2025
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display device using semiconductor light em...
- Patent number 12,328,979
- Issue date Jun 10, 2025
- LG Electronics Inc.
- Mihee Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for self-assembly of semiconductor light-emitt...
- Patent number 12,324,292
- Issue date Jun 3, 2025
- LG Electronics Inc.
- Kisu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,317,658
- Issue date May 27, 2025
- Samsung Display Co., Ltd.
- Hyun Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 12,315,769
- Issue date May 27, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and bonding method thereof
- Patent number 12,308,337
- Issue date May 20, 2025
- Diodes Incorporated
- Duane Wilcoxen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High registration particles-transferring system
- Patent number 12,297,538
- Issue date May 13, 2025
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light emitting element, display device including the same, and manu...
- Patent number 12,300,768
- Issue date May 13, 2025
- Samsung Display Co., Ltd.
- Hyung Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package
- Patent number 12,293,986
- Issue date May 6, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED mounting substrate, micro-led display, and method of manu...
- Patent number 12,288,769
- Issue date Apr 29, 2025
- SHARP KABUSHIKI KAISHA
- Yoshiyuki Harumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and method for manufacturing same
- Patent number 12,289,934
- Issue date Apr 29, 2025
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel and display device including the same
- Patent number 12,283,582
- Issue date Apr 22, 2025
- Samsung Display Co., Ltd.
- Eun A Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular construction of hybrid-bonded semiconductor die assemblies...
- Patent number 12,278,202
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and display device manufact...
- Patent number 12,278,223
- Issue date Apr 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Yosuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 12,266,640
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full-color LED display using ultra-thin LED element and method for...
- Patent number 12,266,740
- Issue date Apr 1, 2025
- Kookmin University Industry Academy Cooperation Foundation
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including dummy pattern on bank
- Patent number 12,261,160
- Issue date Mar 25, 2025
- Samsung Display Co., Ltd.
- Ki Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 12,261,084
- Issue date Mar 25, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro LED
- Patent number 12,255,193
- Issue date Mar 18, 2025
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Jaekyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for manufacturing display device and method for manufactu...
- Patent number 12,243,759
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Kisu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,243,847
- Issue date Mar 4, 2025
- Semes Co., Ltd.
- Gil Yong Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,243,861
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Dohan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20250226264
- Publication date Jul 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20250218889
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Min Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250219015
- Publication date Jul 3, 2025
- Canon Kabushiki Kaisha
- Nilabh K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250212518
- Publication date Jun 26, 2025
- SAMSUNG DISPLAY CO., LTD.
- Se Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183230
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174572
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyun Ung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167171
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167172
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Manufacturing Display Device and Display Device Manufact...
- Publication number 20250158000
- Publication date May 15, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yosuke TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250149491
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DIE BONDING
- Publication number 20250140592
- Publication date May 1, 2025
- Canon Kabushiki Kaisha
- Nilabh K ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250132286
- Publication date Apr 24, 2025
- Yibu Semiconductor Co., Ltd.
- Wenqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...
- Publication number 20250112185
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20250105086
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096201
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Gyujin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, DISPLAY DEVICE COMPRISING SAME, AND METHOD F...
- Publication number 20250089411
- Publication date Mar 13, 2025
- SAMSUNG DISPLAY CO., LTD.
- Young Rag DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20250087627
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20250087641
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250087592
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...
- Publication number 20250079380
- Publication date Mar 6, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD
- Publication number 20250079397
- Publication date Mar 6, 2025
- Canon Kabushiki Kaisha
- SHUN TOKAIRIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20250062295
- Publication date Feb 20, 2025
- Seoul Viosys Co., Ltd.
- Seong Kyu JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICES
- Publication number 20250062129
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Yin Wei LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE CARTRIDGE STRUCTURE
- Publication number 20250046752
- Publication date Feb 6, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Integrating eWLB with E-bar Stru...
- Publication number 20250038101
- Publication date Jan 30, 2025
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS

at chip-level

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Driving backplane, transfer method for light-emitting diode chip, d...

Ultra-small LED electrode assembly

Display device and method of manufacturing the same

Method and apparatus for fault isolation, computer device, medium a...

Semifinished product for populating with components and, method for...

Display device and method of fabricating the same

Display device and method of manufacturing the same

Thermal performance in hybrid bonded 3D die stacks

Massive parallel assembly method

Method of manufacturing display device using semiconductor light em...

Apparatus and method for self-assembly of semiconductor light-emitt...

Display device

Build-up package for integrated circuit devices, and methods of mak...

Power semiconductor apparatus and bonding method thereof

High registration particles-transferring system

Light emitting element, display device including the same, and manu...

Method for forming chip packages and a chip package

Micro-LED mounting substrate, micro-led display, and method of manu...

Display device using micro LED, and method for manufacturing same

Pixel and display device including the same

Modular construction of hybrid-bonded semiconductor die assemblies...

Method for manufacturing display device and display device manufact...

Molded direct bonded and interconnected stack

Full-color LED display using ultra-thin LED element and method for...

Display device including dummy pattern on bank

Fan-out wafer level packaging of semiconductor devices

Method for transferring micro LED

Substrate for manufacturing display device and method for manufactu...

Bonding apparatus and bonding method

Display device using micro LED, and manufacturing method therefor

Patents Applicationslast 30 patents

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

SELECTIVE TRANSFER OF MICRO DEVICES

SEMICONDUCTOR PACKAGE

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

Method For Manufacturing Display Device and Display Device Manufact...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

METHOD AND SYSTEM FOR DIE BONDING

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...

Integrated Circuit Packages and Methods of Forming the Same

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE

LIGHT-EMITTING DEVICE, DISPLAY DEVICE COMPRISING SAME, AND METHOD F...

SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME

Semiconductor Device and Method of Manufacture

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...

BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD

LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME

DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICES

MICRODEVICE CARTRIDGE STRUCTURE

Semiconductor Device and Method of Integrating eWLB with E-bar Stru...

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF