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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/95at chip-level

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Micro light emitting device array and method of manufacturing the s...
- Patent number 12,166,021
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode and display apparatus having the same
- Patent number 12,159,861
- Issue date Dec 3, 2024
- SEOUL VIOSYS CO., LTD.
- Seong Kyu Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and display device including rod shaped light...
- Patent number 12,155,018
- Issue date Nov 26, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,155,022
- Issue date Nov 26, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless architecture and processing strategy for EMIB-based substr...
- Patent number 12,142,567
- Issue date Nov 12, 2024
- Intel Corporation
- Xiao Di Sun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 12,132,074
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 12,125,834
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Bek Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,125,804
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink leveling device and method of manufacturing display device usin...
- Patent number 12,113,047
- Issue date Oct 8, 2024
- Samsung Display Co., Ltd.
- Jung Hyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of micro light-emitting device and method of transferring...
- Patent number 12,113,150
- Issue date Oct 8, 2024
- Korea University Research and Business Foundation
- In Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip transferring and device/module having gas guiding st...
- Patent number 12,106,981
- Issue date Oct 1, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,094,847
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale-aligned three-dimensional stacked integrated circuit
- Patent number 12,094,775
- Issue date Sep 17, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package having a chipse...
- Patent number 12,087,734
- Issue date Sep 10, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using semiconductor light-emitting elements and manu...
- Patent number 12,080,689
- Issue date Sep 3, 2024
- LG Electronics Inc.
- Dohee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 12,080,678
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having an intermediate electrode between sub-areas a...
- Patent number 12,074,171
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Won Sik Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of controlling warpage during LAB
- Patent number 12,074,135
- Issue date Aug 27, 2024
- STATS ChipPAC Pte. Ltd.
- Wagno Alves Braganca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dipole alignment apparatus for use in manufacturing of display devi...
- Patent number 12,068,279
- Issue date Aug 20, 2024
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 12,062,603
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,062,621
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PANEL-LEVEL SEMICONDUCTOR PACKAGING METHOD
- Publication number 20240404974
- Publication date Dec 5, 2024
- PEP INNOVATION PTE LTD.
- Munirathinam Senthil Kumar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE BODY AND PREPARATION METHOD THEREFOR
- Publication number 20240404938
- Publication date Dec 5, 2024
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404972
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240395587
- Publication date Nov 28, 2024
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH EMBEDDED TRACES
- Publication number 20240387350
- Publication date Nov 21, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20240387230
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MAKING
- Publication number 20240387500
- Publication date Nov 21, 2024
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...
- Publication number 20240379612
- Publication date Nov 14, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379575
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240379617
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240371916
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371795
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20240363803
- Publication date Oct 31, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20240363585
- Publication date Oct 31, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...
- Publication number 20240355697
- Publication date Oct 24, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and (micro) transfer printing process
- Publication number 20240355775
- Publication date Oct 24, 2024
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Ralf LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240347496
- Publication date Oct 17, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY
- Publication number 20240332239
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
- Publication number 20240334608
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240332247
- Publication date Oct 3, 2024
- Nichia Corporation.
- Hiroaki KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240332204
- Publication date Oct 3, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Reinforcement Layer Structure and Manufactur...
- Publication number 20240332104
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321851
- Publication date Sep 26, 2024
- SAMSUNG ELECTERONICS CO., LTD.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240304560
- Publication date Sep 12, 2024
- DENSO CORPORATION
- Kazuki KUWATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Antenna in Fan-Out Package
- Publication number 20240297432
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282760
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE
- Publication number 20240282737
- Publication date Aug 22, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Liang Sun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

at chip-level

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro light emitting device array and method of manufacturing the s...

Methods and systems of forming metal interconnect layers using engi...

Single-shot encapsulation

Light emitting diode and display apparatus having the same

Light-emitting device and display device including rod shaped light...

Solder reflow apparatus and method of manufacturing an electronic d...

Display device and method for manufacturing display device

Shift control method in manufacture of semiconductor device

Coreless architecture and processing strategy for EMIB-based substr...

Package

Display device and method of fabricating the same

Semiconductor package and manufacturing method thereof

Encapsulated light emitting diodes for selective fluidic assembly

Ink leveling device and method of manufacturing display device usin...

Semiconductor package with dual sides of metal routing

Structure of micro light-emitting device and method of transferring...

Method of chip transferring and device/module having gas guiding st...

Semiconductor package and method of manufacturing the same

Nanoscale-aligned three-dimensional stacked integrated circuit

Method for forming chip packages and a chip package having a chipse...

Display device using semiconductor light-emitting elements and manu...

Methods and systems for manufacturing semiconductor devices

Display device having an intermediate electrode between sub-areas a...

Methods and devices for fabricating and assembling printable semico...

Selective transfer of micro devices

Chip bonding apparatus and securing assembly therefor

Semiconductor device and method of controlling warpage during LAB

Dipole alignment apparatus for use in manufacturing of display devi...

Semiconductor device having via sidewall adhesion with encapsulant

Semiconductor package

Patents Applicationslast 30 patents

PANEL-LEVEL SEMICONDUCTOR PACKAGING METHOD

PACKAGE BODY AND PREPARATION METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

TRANSFER SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS

PACKAGE WITH EMBEDDED TRACES

Semiconductor Package and Method of Manufacturing the Same

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

MULTI-CHIP PACKAGE AND METHOD OF MAKING

APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...

SEMICONDUCTOR PACKAGE

SELECTIVE TRANSFER OF MICRO DEVICES

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...

Semiconductor wafer and (micro) transfer printing process

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING SAME

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

Component Carrier With Reinforcement Layer Structure and Manufactur...

SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Heterogeneous Antenna in Fan-Out Package

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

FLUX, SUBSTRATE AND MANUFACTURING METHOD, AND DEVICE