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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/95at chip-level

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full-color LED display using ultra-thin LED element and method for...
- Patent number 12,266,740
- Issue date Apr 1, 2025
- Kookmin University Industry Academy Cooperation Foundation
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including dummy pattern on bank
- Patent number 12,261,160
- Issue date Mar 25, 2025
- Samsung Display Co., Ltd.
- Ki Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packaging of semiconductor devices
- Patent number 12,261,084
- Issue date Mar 25, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer warpage regulation epoxy functional film, and preparation met...
- Patent number 12,255,175
- Issue date Mar 18, 2025
- Wuhan Sanxuan Technology Co., Ltd
- De Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for transferring micro LED
- Patent number 12,255,193
- Issue date Mar 18, 2025
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Jaekyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for manufacturing display device and method for manufactu...
- Patent number 12,243,759
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Kisu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display and micro device array for transfer to a display substrate
- Patent number 12,243,955
- Issue date Mar 4, 2025
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,243,861
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Dohan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device with improved alignment of light emitting elements,...
- Patent number 12,243,877
- Issue date Mar 4, 2025
- Samsung Display Co., Ltd.
- Se Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluidic assembly encapsulating light emitting diodes
- Patent number 12,230,743
- Issue date Feb 18, 2025
- ehux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro-LED, and manufacturing method therefor
- Patent number 12,230,617
- Issue date Feb 18, 2025
- LG Electronics Inc.
- Bongchu Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnecting method, interconnect device and method for for...
- Patent number 12,224,267
- Issue date Feb 11, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode display panel and manufacturing method t...
- Patent number 12,224,274
- Issue date Feb 11, 2025
- BOE Technology Group Co., Ltd.
- Yuju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method therefor
- Patent number 12,224,384
- Issue date Feb 11, 2025
- Samsung Display Co., Ltd.
- Moon Jung An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing same
- Patent number 12,218,299
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Chang Il Tae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 12,218,069
- Issue date Feb 4, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro-light emitting diode for LED display
- Patent number 12,205,931
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Method of producing a multi-chip assembly
- Patent number 12,191,296
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ling Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 12,183,712
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,183,866
- Issue date Dec 31, 2024
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 12,176,334
- Issue date Dec 24, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly board for use in a display manufacturing method
- Patent number 12,176,225
- Issue date Dec 24, 2024
- LG Electronics Inc.
- Changhyun Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light emitting device array and method of manufacturing the s...
- Patent number 12,166,021
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...
- Publication number 20250112185
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...
- Publication number 20250112195
- Publication date Apr 3, 2025
- EPISTAR CORPORATION
- Wen-Chien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20250105086
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096201
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Gyujin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE, DISPLAY DEVICE COMPRISING SAME, AND METHOD F...
- Publication number 20250089411
- Publication date Mar 13, 2025
- SAMSUNG DISPLAY CO., LTD.
- Young Rag DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER WARPAGE REGULATION EPOXY FUNCTIONAL FILM, AND PREPARATION MET...
- Publication number 20250087630
- Publication date Mar 13, 2025
- Wuhan Sanxuan Technology Co., Ltd
- De WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250087592
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...
- Publication number 20250079380
- Publication date Mar 6, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD
- Publication number 20250079397
- Publication date Mar 6, 2025
- Canon Kabushiki Kaisha
- SHUN TOKAIRIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING...
- Publication number 20250079225
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Hajung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING FAN-OUT PACKAGE
- Publication number 20250079427
- Publication date Mar 6, 2025
- Yibu Semiconductor Co., Ltd.
- Wenqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Systems Of Forming Metal Interconnect Layers Using Engi...
- Publication number 20250069900
- Publication date Feb 27, 2025
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20250062295
- Publication date Feb 20, 2025
- Seoul Viosys Co., Ltd.
- Seong Kyu JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20250062217
- Publication date Feb 20, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY US...
- Publication number 20250062152
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hyungjun Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICES
- Publication number 20250062129
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Yin Wei LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE CARTRIDGE STRUCTURE
- Publication number 20250046752
- Publication date Feb 6, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Integrating eWLB with E-bar Stru...
- Publication number 20250038101
- Publication date Jan 30, 2025
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE
- Publication number 20250022826
- Publication date Jan 16, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...
- Publication number 20250015036
- Publication date Jan 9, 2025
- LINGSEN PRECISION INDUSTRIES, LTD.
- Yu-Chia CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Publication number 20250006510
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429198
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT
- Publication number 20240429099
- Publication date Dec 26, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...
- Publication number 20240429199
- Publication date Dec 26, 2024
- Intel Corporation
- Yi Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BODY AND PREPARATION METHOD THEREFOR
- Publication number 20240404938
- Publication date Dec 5, 2024
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL-LEVEL SEMICONDUCTOR PACKAGING METHOD
- Publication number 20240404974
- Publication date Dec 5, 2024
- PEP INNOVATION PTE LTD.
- Munirathinam Senthil Kumar
- G06 - COMPUTING CALCULATING COUNTING

at chip-level

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated devices in semiconductor packages and methods of forming...

Full-color LED display using ultra-thin LED element and method for...

Package process and package structure

Display device including dummy pattern on bank

Fan-out wafer level packaging of semiconductor devices

Wafer warpage regulation epoxy functional film, and preparation met...

Method for transferring micro LED

Substrate for manufacturing display device and method for manufactu...

Display and micro device array for transfer to a display substrate

Display device using micro LED, and manufacturing method therefor

Display device with improved alignment of light emitting elements,...

Fluidic assembly encapsulating light emitting diodes

Display device using micro-LED, and manufacturing method therefor

Package device

Chip interconnecting method, interconnect device and method for for...

Micro light-emitting diode display panel and manufacturing method t...

Display device and manufacturing method therefor

Display device and method for manufacturing same

Multi-chip package with high density interconnects

Method of transferring micro-light emitting diode for LED display

Selective micro device transfer to receiver substrate

Method of producing a multi-chip assembly

Method and system for manufacturing a semiconductor package structure

Display device using micro LED, and manufacturing method therefor

Method for manufacturing display panel, display panel, and display...

Assembly board for use in a display manufacturing method

Dicing die attach film, and semiconductor package using the same an...

Micro light emitting device array and method of manufacturing the s...

Methods and systems of forming metal interconnect layers using engi...

Single-shot encapsulation

Patents Applicationslast 30 patents

SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...

SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...

Integrated Circuit Packages and Methods of Forming the Same

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE

LIGHT-EMITTING DEVICE, DISPLAY DEVICE COMPRISING SAME, AND METHOD F...

WAFER WARPAGE REGULATION EPOXY FUNCTIONAL FILM, AND PREPARATION MET...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

BONDING METHOD, BONDING APPARATUS AND ARTICLE MANUFACTURING METHOD

DICING TAPE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING...

METHOD FOR FABRICATING FAN-OUT PACKAGE

Methods And Systems Of Forming Metal Interconnect Layers Using Engi...

LIGHT EMITTING DIODE AND DISPLAY APPARATUS HAVING THE SAME

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

DICING FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY US...

DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICES

MICRODEVICE CARTRIDGE STRUCTURE

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

Semiconductor Device and Method of Integrating eWLB with E-bar Stru...

SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

PREFORMED UNIT OF FAN-OUT CHIP-EMBEDDED PACKAGING PROCESS AND APPLI...

SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

NANOSCALE-ALIGNED THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT

METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...

PACKAGE BODY AND PREPARATION METHOD THEREFOR

PANEL-LEVEL SEMICONDUCTOR PACKAGING METHOD