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H01L2224/95

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/95at chip-level

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Driving backplane, transfer method for light-emitting diode chip, d...
- Patent number 12,368,144
- Issue date Jul 22, 2025
- BOE Technology Group Co., Ltd.
- Zhijun Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting InFO packages to reduce warpage
- Patent number 12,368,115
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Basin-shaped underbump plates and methods of forming the same
- Patent number 12,362,299
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-small LED electrode assembly
- Patent number 12,364,088
- Issue date Jul 15, 2025
- Samsung Display Co., Ltd.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,356,716
- Issue date Jul 8, 2025
- Samsung Display Co., Ltd.
- Jong Hwan Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting electronic component
- Patent number 12,347,806
- Issue date Jul 1, 2025
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semifinished product for populating with components and, method for...
- Patent number 12,341,127
- Issue date Jun 24, 2025
- Siemens Aktiengesellschaft
- Nora Jeske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 12,341,139
- Issue date Jun 24, 2025
- Samsung Display Co., Ltd.
- Ki Yeup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,334,486
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- In Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Massive parallel assembly method
- Patent number 12,327,751
- Issue date Jun 10, 2025
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display device using semiconductor light em...
- Patent number 12,328,979
- Issue date Jun 10, 2025
- LG Electronics Inc.
- Mihee Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for self-assembly of semiconductor light-emitt...
- Patent number 12,324,292
- Issue date Jun 3, 2025
- LG Electronics Inc.
- Kisu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device reflective bank structure
- Patent number 12,322,738
- Issue date Jun 3, 2025
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,317,658
- Issue date May 27, 2025
- Samsung Display Co., Ltd.
- Hyun Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro led
- Patent number 12,308,352
- Issue date May 20, 2025
- LG Electronics Inc.
- Byungjun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and bonding method thereof
- Patent number 12,308,337
- Issue date May 20, 2025
- Diodes Incorporated
- Duane Wilcoxen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High registration particles-transferring system
- Patent number 12,297,538
- Issue date May 13, 2025
- Xerox Corporation
- Yunda Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light emitting element, display device including the same, and manu...
- Patent number 12,300,768
- Issue date May 13, 2025
- Samsung Display Co., Ltd.
- Hyung Seok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package
- Patent number 12,293,986
- Issue date May 6, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED mounting substrate, micro-led display, and method of manu...
- Patent number 12,288,769
- Issue date Apr 29, 2025
- SHARP KABUSHIKI KAISHA
- Yoshiyuki Harumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and method for manufacturing same
- Patent number 12,289,934
- Issue date Apr 29, 2025
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel and display device including the same
- Patent number 12,283,582
- Issue date Apr 22, 2025
- Samsung Display Co., Ltd.
- Eun A Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including sub-interpose...
- Patent number 12,278,222
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular construction of hybrid-bonded semiconductor die assemblies...
- Patent number 12,278,202
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using semiconductor light-emitting elements, and man...
- Patent number 12,278,221
- Issue date Apr 15, 2025
- LG Electronics Inc.
- Jeonghyo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display device and display device manufact...
- Patent number 12,278,223
- Issue date Apr 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Yosuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 12,272,671
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20250226264
- Publication date Jul 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20250218889
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Min Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250219015
- Publication date Jul 3, 2025
- Canon Kabushiki Kaisha
- Nilabh K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250210440
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250212518
- Publication date Jun 26, 2025
- SAMSUNG DISPLAY CO., LTD.
- Se Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...
- Publication number 20250210400
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Taehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20250192080
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20250192086
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183230
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED ARRAY ELECTRONIC DEVICE AND ITS TRANSFER METHOD
- Publication number 20250176343
- Publication date May 29, 2025
- Seoul National University R&DB Foundation
- Yong Taek HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174572
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyun Ung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167171
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...
- Publication number 20250167168
- Publication date May 22, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167172
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Manufacturing Display Device and Display Device Manufact...
- Publication number 20250158000
- Publication date May 15, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yosuke TSUKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250149491
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DIE BONDING
- Publication number 20250140592
- Publication date May 1, 2025
- Canon Kabushiki Kaisha
- Nilabh K ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250132286
- Publication date Apr 24, 2025
- Yibu Semiconductor Co., Ltd.
- Wenqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING BODY
- Publication number 20250125306
- Publication date Apr 17, 2025
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
- Publication number 20250125275
- Publication date Apr 17, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250118574
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...
- Publication number 20250112185
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...
- Publication number 20250112195
- Publication date Apr 3, 2025
- EPISTAR CORPORATION
- Wen-Chien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20250105086
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS

at chip-level

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

Driving backplane, transfer method for light-emitting diode chip, d...

Supporting InFO packages to reduce warpage

Basin-shaped underbump plates and methods of forming the same

Ultra-small LED electrode assembly

Display device and method of manufacturing the same

Method of mounting electronic component

Semifinished product for populating with components and, method for...

Display device and method of fabricating the same

Display device and method of manufacturing the same

Massive parallel assembly method

Method of manufacturing display device using semiconductor light em...

Wafer reconstitution and die-stitching

Apparatus and method for self-assembly of semiconductor light-emitt...

Light emitting device reflective bank structure

Display device

Display device using micro led

Molded product for semiconductor strip and method of manufacturing...

Power semiconductor apparatus and bonding method thereof

High registration particles-transferring system

Light emitting element, display device including the same, and manu...

Method for forming chip packages and a chip package

Micro-LED mounting substrate, micro-led display, and method of manu...

Display device using micro LED, and method for manufacturing same

Pixel and display device including the same

Method of fabricating semiconductor package including sub-interpose...

Modular construction of hybrid-bonded semiconductor die assemblies...

Display device using semiconductor light-emitting elements, and man...

Method for manufacturing display device and display device manufact...

Semiconductor device package and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...

Integrated Devices in Semiconductor Packages and Methods of Forming...

CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

MICRO LED ARRAY ELECTRONIC DEVICE AND ITS TRANSFER METHOD

SELECTIVE TRANSFER OF MICRO DEVICES

SEMICONDUCTOR PACKAGE

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

MANUFACTURING METHOD OF PACKAGE DEVICE

WAFER RECONSTITUTION AND DIE-STITCHING

Method For Manufacturing Display Device and Display Device Manufact...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

METHOD AND SYSTEM FOR DIE BONDING

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGING METHOD AND PACKAGING BODY

MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT...

SEMICONDUCTOR DEVICE ARRANGEMENT STRUCTURE AND METHOD OF MANUFACTUR...

Integrated Circuit Packages and Methods of Forming the Same