Auxiliary members on the pressing surface

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CPC
H01L2224/75986

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75986Auxiliary members on the pressing surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low warpage curing methodology by inducing curvature
- Patent number 11,929,260
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Fang Jie Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage-compensated bonded structure including a support chip and a...
- Patent number 11,114,406
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Mounting method using dilatancy fluid
- Patent number 8,296,939
- Issue date Oct 30, 2012
- Sony Chemical & Information Device Corporation
- Kazutaka Furuta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC-card manufacturing apparatus
- Patent number 6,913,057
- Issue date Jul 5, 2005
- Nissei Plastic Industrial Co., Ltd.
- Suinobu Kubota
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for manufacturing semiconductor device, and se...
- Patent number 6,509,206
- Issue date Jan 21, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Toshihiro Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for thermally bonding connecting surfaces of two...
- Patent number 6,394,158
- Issue date May 28, 2002
- PAC Tech - Packaging Technologies GmbH
- Kaveh Momeni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3699640
- Patent number 3,699,640
- Issue date Oct 24, 1972
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3608809
- Patent number 3,608,809
- Issue date Sep 28, 1971
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING DEVICE, MOUNTING METHOD, PACKAGE, AND PRESSURIZING PLATE
- Publication number 20100085723
- Publication date Apr 8, 2010
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazutaka FURUTA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DOUBLE-SIDED MOUNTING APPARATUS AND ELECTRIC DEVICE MANUFACTURING M...
- Publication number 20080156434
- Publication date Jul 3, 2008
- Yoshitaka Uematsu
- B32 - LAYERED PRODUCTS
Information Patent Application
DOUBLE-SIDE MOUNTING APPARATUS, AND METHOD OF MANUFACTURING ELECTRI...
- Publication number 20070144668
- Publication date Jun 28, 2007
- KABUSHIKI KAISHA TOSHIBA
- Yoshitaka Uematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC-card manufacturing apparatus
- Publication number 20030075275
- Publication date Apr 24, 2003
- Suinobu Kubota
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method and apparatus for manufacturing semiconductor device, and se...
- Publication number 20020070459
- Publication date Jun 13, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Toshihiro Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary members on the pressing surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low warpage curing methodology by inducing curvature

Warpage-compensated bonded structure including a support chip and a...

Bonding apparatus, bonding system, bonding method and storage medium

Bonding apparatus, bonding system, bonding method and storage medium

Bonding apparatus, bonding system, bonding method and storage medium

Mounting method using dilatancy fluid

IC-card manufacturing apparatus

Method and apparatus for manufacturing semiconductor device, and se...

Method and device for thermally bonding connecting surfaces of two...

3699640

3608809

Patents Applicationslast 30 patents

MOUNTING DEVICE, MOUNTING METHOD, PACKAGE, AND PRESSURIZING PLATE

DOUBLE-SIDED MOUNTING APPARATUS AND ELECTRIC DEVICE MANUFACTURING M...

DOUBLE-SIDE MOUNTING APPARATUS, AND METHOD OF MANUFACTURING ELECTRI...

IC-card manufacturing apparatus

Method and apparatus for manufacturing semiconductor device, and se...