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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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H01L2924/15331
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Patents Grants
last 30 patents
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Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,978,730
Issue date
May 7, 2024
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and methods for forming the same
Patent number
11,961,791
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memories and memory components with interconnected and redundant da...
Patent number
11,955,165
Issue date
Apr 9, 2024
RAMBUS INC.
Frederick A. Ware
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,948,808
Issue date
Apr 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a redistribution layer
Patent number
11,935,856
Issue date
Mar 19, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device encapsulated by molding material attached to r...
Patent number
11,887,952
Issue date
Jan 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with through-mold via
Patent number
11,869,829
Issue date
Jan 9, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Joo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
Patent number
11,830,845
Issue date
Nov 28, 2023
TESSERA LLC
Hiroaki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
Patent number
11,810,893
Issue date
Nov 7, 2023
International Business Machines Corporation
William Emmett Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC formation with dies bonded to formed RDLs
Patent number
11,810,899
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip
Patent number
11,798,906
Issue date
Oct 24, 2023
Samsung Electronics Co., Ltd.
Jeong-gi Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,798,932
Issue date
Oct 24, 2023
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
Patent number
11,791,252
Issue date
Oct 17, 2023
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package structure including a thermal isolation material
Patent number
11,776,945
Issue date
Oct 3, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tse Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor bonding structures and methods
Patent number
11,749,535
Issue date
Sep 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Tse Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielded fan-out packaged semiconductor device and method of manufa...
Patent number
11,742,252
Issue date
Aug 29, 2023
Micron Technology, Inc.
Fumitomo Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package assembly with wire bond vias
Patent number
11,735,563
Issue date
Aug 22, 2023
Invensas LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory system topologies including a memory die stack
Patent number
11,727,982
Issue date
Aug 15, 2023
RAMBUS INC.
Ian Shaeffer
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Wafer level package structure and method of forming same
Patent number
11,728,217
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interposer with opening...
Patent number
11,688,612
Issue date
Jun 27, 2023
STATS ChipPAC Pte. Ltd.
Reza A. Pagaila
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-die memory device
Patent number
11,657,868
Issue date
May 23, 2023
RAMBUS INC.
Scott C. Best
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor package
Patent number
11,658,137
Issue date
May 23, 2023
Chengwei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin bonded interposer package
Patent number
11,621,243
Issue date
Apr 4, 2023
Amkor Technology Singapore Holding Pte Ltd.
Christopher J. Berry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package (PoP) semiconductor package and electronic syste...
Patent number
11,552,062
Issue date
Jan 10, 2023
Samsung Electronics Co., Ltd.
Tong-suk Kim
G11 - INFORMATION STORAGE
Information
Patent Grant
Package-on-package structure
Patent number
11,532,498
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor package structure
Patent number
11,532,569
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Jui-Pin Hung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method of manufacturing a package-on-package type semiconductor pac...
Patent number
11,508,712
Issue date
Nov 22, 2022
Amkor Technology Singapore Holding Pte Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board and method of manufacturing the same
Patent number
11,430,725
Issue date
Aug 30, 2022
Shinko Electric Industries Co., Ltd.
Noriyoshi Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
Patent number
11,424,211
Issue date
Aug 23, 2022
TESSERA LLC
Hiroaki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device encapsulated by molding material attached to r...
Patent number
11,417,620
Issue date
Aug 16, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING
Publication number
20240079250
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
JAEWON CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240021491
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hsuan Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...
Publication number
20240006366
Publication date
Jan 4, 2024
Intel Corporation
Stephen Morein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE ASSEMBLY HAVING A POLYGONAL LINKING DIE
Publication number
20240006374
Publication date
Jan 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
Publication number
20240006401
Publication date
Jan 4, 2024
Intel Corporation
Russell K. MORTENSEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package-on-Package Structure Including a Thermal Isolation Material
Publication number
20230378153
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Meng-Tse Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20230260866
Publication date
Aug 17, 2023
MEDIATEK INC.
Yin-Fa CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230139141
Publication date
May 4, 2023
Samsung Electronics Co., Ltd.
Doyoung Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...
Publication number
20230129617
Publication date
Apr 27, 2023
Samsung Electronics Co., Ltd.
Tong-suk KIM
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230113465
Publication date
Apr 13, 2023
Samsung Electronics Co., Ltd.
Minki Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package
Publication number
20230106826
Publication date
Apr 6, 2023
Chengwei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACIT...
Publication number
20230075019
Publication date
Mar 9, 2023
SMOLTEK AB
M Shafiqul Kabir
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
Publication number
20220344318
Publication date
Oct 27, 2022
Intel Corporation
Russell K. MORTENSEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED BRIDGE ARCHITECTURE WITH THINNED SURFACE
Publication number
20220310518
Publication date
Sep 29, 2022
Intel Corporation
Haobo CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Structures and Methods for Forming the Same
Publication number
20220278031
Publication date
Sep 1, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D INTEGRATIONS AND METHODS OF MAKING THEREOF
Publication number
20220189864
Publication date
Jun 16, 2022
BroadPak Corporation
Farhang YAZDANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
Publication number
20220157799
Publication date
May 19, 2022
Intel Corporation
Russell K. MORTENSEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE MEMORY DEVICE
Publication number
20220139446
Publication date
May 5, 2022
Rambus Inc.
Scott C. Best
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR CHIP
Publication number
20220108962
Publication date
Apr 7, 2022
Samsung Electronics Co., Ltd.
Jeong-gi JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20220059490
Publication date
Feb 24, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
Publication number
20220013460
Publication date
Jan 13, 2022
Micron Technology, Inc.
Suan Jeung Boon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELDED FAN-OUT PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFA...
Publication number
20220013421
Publication date
Jan 13, 2022
Micron Technology, Inc.
Fumitomo Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and Apparatus for Package with Interposers
Publication number
20210391230
Publication date
Dec 16, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PACKAGE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUF...
Publication number
20210358824
Publication date
Nov 18, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUF...
Publication number
20210296263
Publication date
Sep 23, 2021
Amkor Technology Singapore Holding Pte. Ltd.
Jin Seong Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shieldi...
Publication number
20210288022
Publication date
Sep 16, 2021
International Business Machines Corporation
William EMMETT BERNIER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...
Publication number
20210242186
Publication date
Aug 5, 2021
Samsung Electronics Co., Ltd.
Tong-suk KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Manufacturing a Package-on-Package Type Semiconductor Pac...
Publication number
20210175222
Publication date
Jun 10, 2021
Amkor Technology Singapore Holding Pte. Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SECURE SEMICONDUCTOR INTEGRATION
Publication number
20210175162
Publication date
Jun 10, 2021
BroadPak Corporation
Farhang YAZDANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package
Publication number
20210167027
Publication date
Jun 3, 2021
Chengwei Wu
H01 - BASIC ELECTRIC ELEMENTS