being a ball array

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CPC
H01L2924/15331

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15331being a ball array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) semiconductor package and electronic syste...
- Patent number 12,033,991
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Tong-suk Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 12,033,929
- Issue date Jul 9, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die memory device
- Patent number 11,990,177
- Issue date May 21, 2024
- RAMBUS INC.
- Scott C. Best
- G11 - INFORMATION STORAGE
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods for forming the same
- Patent number 11,961,791
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memories and memory components with interconnected and redundant da...
- Patent number 11,955,165
- Issue date Apr 9, 2024
- RAMBUS INC.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a redistribution layer
- Patent number 11,935,856
- Issue date Mar 19, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-mold via
- Patent number 11,869,829
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
- Patent number 11,810,893
- Issue date Nov 7, 2023
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,810,899
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,798,906
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,798,932
- Issue date Oct 24, 2023
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 11,791,252
- Issue date Oct 17, 2023
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure including a thermal isolation material
- Patent number 11,776,945
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 11,749,535
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded fan-out packaged semiconductor device and method of manufa...
- Patent number 11,742,252
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Fumitomo Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system topologies including a memory die stack
- Patent number 11,727,982
- Issue date Aug 15, 2023
- RAMBUS INC.
- Ian Shaeffer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer level package structure and method of forming same
- Patent number 11,728,217
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die memory device
- Patent number 11,657,868
- Issue date May 23, 2023
- RAMBUS INC.
- Scott C. Best
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 11,658,137
- Issue date May 23, 2023
- Chengwei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin bonded interposer package
- Patent number 11,621,243
- Issue date Apr 4, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE
- Publication number 20240421096
- Publication date Dec 19, 2024
- VIA TECHNOLOGIES, INC.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE MEMORY DEVICE
- Publication number 20240404580
- Publication date Dec 5, 2024
- Rambus Inc.
- Scott C. Best
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...
- Publication number 20240387308
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...
- Publication number 20240321842
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Tong-Suk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240304583
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND MEMORY COMPONENTS WITH INTERCONNECTED AND REDUNDANT DA...
- Publication number 20240257863
- Publication date Aug 1, 2024
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240222350
- Publication date Jul 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING
- Publication number 20240079250
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- JAEWON CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240021491
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...
- Publication number 20240006366
- Publication date Jan 4, 2024
- Intel Corporation
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLY HAVING A POLYGONAL LINKING DIE
- Publication number 20240006374
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240006401
- Publication date Jan 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure Including a Thermal Isolation Material
- Publication number 20230378153
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230260866
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Yin-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230139141
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Doyoung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...
- Publication number 20230129617
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Tong-suk KIM
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230113465
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20230106826
- Publication date Apr 6, 2023
- Chengwei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACIT...
- Publication number 20230075019
- Publication date Mar 9, 2023
- SMOLTEK AB
- M Shafiqul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220344318
- Publication date Oct 27, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE ARCHITECTURE WITH THINNED SURFACE
- Publication number 20220310518
- Publication date Sep 29, 2022
- Intel Corporation
- Haobo CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods for Forming the Same
- Publication number 20220278031
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20220189864
- Publication date Jun 16, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20220157799
- Publication date May 19, 2022
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS

being a ball array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor bonding structures and methods

Offset interposers for large-bottom packages and large-die package-...

3D integrations and methods of making thereof

Multi-die fine grain integrated voltage regulation

Package-on-package (PoP) semiconductor package and electronic syste...

Package-on-package semiconductor assemblies and methods of manufact...

Multi-die memory device

Offset interposers for large-bottom packages and large-die package-...

Package structures and methods for forming the same

Memories and memory components with interconnected and redundant da...

Semiconductor device and manufacturing method thereof

Semiconductor device having a redistribution layer

Semiconductor device encapsulated by molding material attached to r...

Semiconductor device with through-mold via

Package-on-package assembly with wire bonds to encapsulation surface

Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...

3DIC formation with dies bonded to formed RDLs

Semiconductor chip

Offset interposers for large-bottom packages and large-die package-...

Package-on-package semiconductor assemblies and methods of manufact...

Package-on-package structure including a thermal isolation material

Semiconductor bonding structures and methods

Shielded fan-out packaged semiconductor device and method of manufa...

Package-on-package assembly with wire bond vias

Memory system topologies including a memory die stack

Wafer level package structure and method of forming same

Semiconductor device and method of forming interposer with opening...

Multi-die memory device

Semiconductor package

Thin bonded interposer package

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

MULTI-DIE MEMORY DEVICE

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...

Lead-Free Solder Ball

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MEMORIES AND MEMORY COMPONENTS WITH INTERCONNECTED AND REDUNDANT DA...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THRO...

SEMICONDUCTOR DIE ASSEMBLY HAVING A POLYGONAL LINKING DIE

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

Package-on-Package Structure Including a Thermal Isolation Material

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Package

ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACIT...

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

EMBEDDED BRIDGE ARCHITECTURE WITH THINNED SURFACE

Package Structures and Methods for Forming the Same

3D INTEGRATIONS AND METHODS OF MAKING THEREOF

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...