being a combination of two or more materials provided in the groups H01L2924/0531 - H01L2924/0546

Industry

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H01L2924/0549

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0549being a combination of two or more materials provided in the groups H01L2924/0531 - H01L2924/0546

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
- Patent number 11,916,038
- Issue date Feb 27, 2024
- Canon Anelva Corporation
- Takayuki Saitoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Array substrate and method for manufacturing the same, and display...
- Patent number 11,901,375
- Issue date Feb 13, 2024
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Yongbo Ju
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device
- Patent number 11,855,055
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Seung Lyong Bok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device and method for fabricating the same
- Patent number 11,784,177
- Issue date Oct 10, 2023
- Samsung Display Co., Ltd.
- Seung Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pads and method of manufactu...
- Patent number 11,380,638
- Issue date Jul 5, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,811,305
- Issue date Oct 20, 2020
- International Business Machines Corporation
- Li-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and preparation method therefor
- Patent number 10,784,218
- Issue date Sep 22, 2020
- BOE Technology Group Co., Ltd.
- Li Xiao
- G02 - OPTICS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 10,720,403
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,636,838
- Issue date Apr 28, 2020
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 10,373,926
- Issue date Aug 6, 2019
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated multi-color light-emitting pixel arrays based devices by...
- Patent number 10,325,894
- Issue date Jun 18, 2019
- Shaoher Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 10,062,662
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a protective material with a first pH f...
- Patent number 10,037,965
- Issue date Jul 31, 2018
- NXP USA, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and connecting method of circuit member
- Patent number 10,037,960
- Issue date Jul 31, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 9,953,955
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-to-wafer bonding structure
- Patent number 9,941,243
- Issue date Apr 10, 2018
- Samsung Electronics Co., Ltd.
- Tae-yeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with modified pad spacing structure
- Patent number 9,922,948
- Issue date Mar 20, 2018
- United Microelectronics Corp.
- Po-Chen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module and method for forming the same
- Patent number 9,812,413
- Issue date Nov 7, 2017
- Xintec Inc.
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with a double metal contact and related...
- Patent number 9,761,550
- Issue date Sep 12, 2017
- Infineon Technologies Americas Corp.
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Conductive die attach film for large die semiconductor packages and...
- Patent number 9,449,938
- Issue date Sep 20, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 9,318,471
- Issue date Apr 19, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tatsuya Kabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching semiconductor structures and etching composition...
- Patent number 9,287,228
- Issue date Mar 15, 2016
- Lam Research AG
- Harald Kraus
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching of under bump mettallization layer and resulting device
- Patent number 9,214,436
- Issue date Dec 15, 2015
- GLOBALFOUNDRIES Inc.
- Tanya Andreeva Atanasova
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including a double metal contact
- Patent number 8,791,525
- Issue date Jul 29, 2014
- International Rectifier Corporation
- Robert Montgomery
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240162402
- Publication date May 16, 2024
- AUO Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240113056
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Kuo Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079364
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20240072027
- Publication date Feb 29, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC TERM...
- Publication number 20240021628
- Publication date Jan 18, 2024
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Zhuhui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021593
- Publication date Jan 18, 2024
- UNITED MICROELECTRONICS CORP.
- ZHIBIAO ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240021627
- Publication date Jan 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Ki Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY...
- Publication number 20230420431
- Publication date Dec 28, 2023
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Peihai WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING
- Publication number 20230402427
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230326932
- Publication date Oct 12, 2023
- SAMSUNG DISPLAY CO., LTD.
- Yong Duck SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING PASTE-BASED CONDUCTIVE DEVICE AND MANUFACTURING METHOD T...
- Publication number 20230307408
- Publication date Sep 28, 2023
- Shenzhen Guangshe Zhaoming Technology Co., LTD
- Jianwei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CON...
- Publication number 20230260956
- Publication date Aug 17, 2023
- SK HYNIX INC.
- Mir IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230253412
- Publication date Aug 10, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jeong Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230246011
- Publication date Aug 3, 2023
- SAMSUNG DISPLAY CO., LTD.
- Nak Cho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND TILE-SHAPED DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230238398
- Publication date Jul 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Byeong Kyun CHOI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE AND TILED DISPLAY DEVICE
- Publication number 20230238373
- Publication date Jul 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Nak Cho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND TILED DISPLAY DEVICE
- Publication number 20230238400
- Publication date Jul 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Seung Lyong BOK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230209926
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- Shinhyuk Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230154877
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230122457
- Publication date Apr 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Eui Kang HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230070620
- Publication date Mar 9, 2023
- SAMSUNG DISPLAY CO., LTD.
- Seung Kyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING
- Publication number 20230065793
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230058776
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jun Young LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...
- Publication number 20230051810
- Publication date Feb 16, 2023
- Canon ANELVA Corporation
- Takayuki SAITOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
- Publication number 20230053037
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230027391
- Publication date Jan 26, 2023
- SAMSUNG DISPLAY CO., LTD.
- Na Hyeon CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME
- Publication number 20230006095
- Publication date Jan 5, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hoo Keun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005866
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS

being a combination of two or more materials provided in the groups H01L2924/0531 - H01L2924/0546

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chemical bonding method, package-type electronic component, and hyb...

Array substrate and method for manufacturing the same, and display...

Display device

Display device and method for fabricating the same

Semiconductor device including bonding pads and method of manufactu...

Wafer level integration including design/co-design, structure proce...

Display device and preparation method therefor

Integrated fan-out package structures with recesses in molding comp...

Integrated multi-color light-emitting pixel arrays based devices by...

Anisotropic conductive film, method for producing anisotropic condu...

Integrated multi-color light-emitting pixel arrays based devices by...

Integrated fan-out package structures with recesses in molding comp...

Semiconductor device having a protective material with a first pH f...

Connection structure and connecting method of circuit member

Integrated fan-out package structures with recesses in molding comp...

Wafer-to-wafer bonding structure

Semiconductor device with modified pad spacing structure

Chip module and method for forming the same

Power semiconductor device with a double metal contact and related...

Reduced expansion thermal compression bonding process bond head

Conductive die attach film for large die semiconductor packages and...

Semiconductor device and method for fabricating the same

Method for etching semiconductor structures and etching composition...

Etching of under bump mettallization layer and resulting device

Power semiconductor device including a double metal contact

Patents Applicationslast 30 patents

DISPLAY DEVICE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

Die Structures and Methods of Forming the Same

METHOD OF FABRICATING DISPLAY PANEL

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC TERM...

LIGHT-EMITTING DIODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE

LIGHT-EMITTING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY...

HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

INSULATING PASTE-BASED CONDUCTIVE DEVICE AND MANUFACTURING METHOD T...

SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CON...

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE AND TILE-SHAPED DISPLAY DEVICE INCLUDING THE SAME

DISPLAY DEVICE AND TILED DISPLAY DEVICE

DISPLAY DEVICE AND TILED DISPLAY DEVICE

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

DISPLAY DEVICE

HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

DISPLAY DEVICE

DISPLAY DEVICE

LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF